Ann Arbor, Michigan, 16 June 2015—CIMdata, Inc., the leading global PLM strategic management consulting and research firm, announces the successful start of its inaugural PLM Road Map for the High Tech Electronics Community conference in Santa Clara, California. The theme of the conference was Innovating in a Nanosecond World: How PLM Makes Innovation and Collaboration for the High Tech Electronics Industry Repeatable, Sustainable, and Scalable. Around 100 people registered for the event. Sponsorships sold out.
The format for PLM Road Map for the High Tech Community was presentations by industry-specific PLM users interleaved with short vignettes about topics of interest/high tech electronics case studies presented by the sponsors of the event. Speakers included:
- How SunPower Deployed PLM Globally, Pascal Rassinoux, SunPower Corporation
- Adopting PLM: Using Modern Cloud Collaboration, Steve Chalgren, Arena Solutions
- Effective HPC on Public Clouds, David Hinz, HGST - a Western Digital Company
- SAP PLM: Driving Innovation @ EMC, Paul Carlson, EMC Corporation
- Transforming Supply Based Collaboration & Integration, Frank Khoshnoud, Cannexa
- Using PLM to Execute a Successful NPDI Process for Electronics and Semiconductor, Sia Langrudi, Siemens PLM Software
- Doing PLM in BIG Way, Dr. Robb Johnson, Inphi
- The Future of Making Things, Brian Roepke, Autodesk
- Divestitures - New Trends in Redefining Businesses, Bob Wickens, Qualcomm
- The Platformization of PLM, Peter Bilello, CIMdata
- Electronic Component Engineering: New Challenges, New Approaches, Lopa Subramanian, Aras
- How PLM is Enabling Edwards Lifesciences to Focus on Speed to Market, Vinu Gurukar, Edwards Lifesciences
- Driving Business Transformation with an Enterprise-wide PLM Platform, John McCallum, Dassault Systèmes
- The Value of Due Diligence in PLM Selections, Thomas Skogen, Minerva
- Managing Software Components in the Product Structure, Ravi Iyer, Cisco Systems
The PLM Collaboration Cafe™, provided a vibrant environment for open discussions among the attendees and the sponsors.
