CIMdata PLM Industry Summary Online Archive
29 October 2009
Events News
CENIT Attends EuroMold to Showcase Holistic Process Solutions for Tooling and Mold Making
At booth D46 in Hall 8 at this year's EuroMold in Frankfurt, CENIT will demonstrate the advantages of CATIA in tooling and mold making for implementing holistic development and manufacturing processes. During our participation from 2 to 5 December in Frankfurt, we will focus on our know-how as a recognized Dassault Systèmes Value Added Reseller (VAR Partner). CENIT experts will showcase sector-specific innovations in the fields of CATIA, DELMIA, DYMOLA, SIMULIA, ENOVIA and 3DVia Composer.
"At our demo spots, visitors to the EuroMold exhibition can get a thorough look at the advantages of Dassault's standard solutions", explains CENIT CEO Kurt Bengel, adding that "we will also demonstrate how our own add-on software products, developed specifically for the fields of tooling and mold making, can be leveraged to achieve enormous competitive advantages."
One of the innovations is CENIT's Industry Accelerator Suite, a solution that provides standard functionalities specifically for this target sector to simplify and significantly accelerate the introduction of CATIA and ENOVIA. The advantages are self-evident: faster implementation and at the same time increased cost transparency and notably project risks. Currently, CENIT's Industry Accelerator Suite for tooling and mold making supports CATIA V5 and ENOVIA SmarTeam. An expansion to V6 is already in the pipeline.
CENIT's trade fair portfolio further includes CATIA V5 add-on solutions and methodologies for optimizing CAD and CAM application in tooling and mold making. We will introduce our solutions e.g. for template-based tool construction, CAM with CATIA V5, approaches in process standardization, as well as the CENIT products DIE SINKING ELECTRODE (electrode generation) and CUT4AXES (wire EDM).
Individual appointments at booth D46 in Hall 8 can be arranged at the CENIT website at http://www.cenit.de/euromold.
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