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Electronic Component Engineering: New Challenges, New Approaches

Lopa Subramanian, Director of Product Management, Aras

The increase of intelligent, connected products and IoT devices is driving new complexities into the design, development, and supply chain processes. Electronic component engineering is more challenging, more inefficient, and more risk prone than ever. As a result, current disjointed practices for managing purchased components used in products are breaking down. Improved integration is needed from design selection and reuse to ensuring conflict mineral and environmental compliance through product changes notification and eventual end of life. In this presentation find out how integrating electronic component engineering into the PLM workflow streamlines and simplifies selection, approval, sourcing and compliance processes to increase productivity while reducing liability and supply chain risks.