CIMdata PLM Industry Summary Online Archive
3 June 2004
Product News
Ansoft and Synopsys Join to Provide IC/Package Co-Design & Analysis
Ansoft Corporation ( http://www.ansoft.com ) announced a collaboration with Synopsys, Inc., which will provide streamlined IC and package co-design and analysis design flow solutions to address the substantial challenges of developing products based on 90 nanometer and SoC (System-on-Chip) technologies.
For package designers, the ability to lay out the package and then analyze the package interconnect structure for power and signal integrity issues is a major step forward in productivity and reliability of the end package design. The combined solution offers a winning combination of Synopsys' package design tool, Encore, and Ansoft's signal integrity analysis products, TPA and SIwave.
The new Synopsys/Ansoft design flow for package design and analysis will debut at this year's Design Automation Conference (DAC) in San Diego, CA in the Ansoft booth #945. With the combined tool solution offered by Synopsys and Ansoft, designers of I/O buffers, ICs and packages can now work concurrently from the same spec-sheet, utilizing a common design flow, thereby streamlining the design process, saving both time and money.
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