CIMdata PLM Industry Summary Online Archive
6 July 2004
Product News
Spatial's Interoperability Solution Selected as Add-on to PlassoTech's Flagship Simulation Product
Spatial Corp. ( http://www.spatial.com ), a Dassault Systemes ( http://www.3ds.com ) company and provider of 3D subsystems, and PlassoTech announced that PlassoTech's latest release of its flagship simulation product, 3G.author, uses Spatial's Interoperability solutions. Part of PlassoTech's 3G.Simulation/Optimization Suite, 3G.author is a multi-CAD parametric simulation and optimization tool that serves industries such as machinery and equipment, instrumentation and controls, automotive, aerospace and electronics.
Built on a collaborative backbone, the 3G.Design Simulation/Optimization Suite (3G.author, 3G.central, and 3G.access) from PlassoTech provides standalone, enterprise, and extended enterprise simulation, optimization, and communication solutions. It offers bi-directional support, with peer-to-peer access, of CAD/CAE/PDM platforms including Inventor, Pro/Engineer, Solid Edge, SolidWorks, CATIA, Parasolid, STEP and SAT.
"We were looking for the best options for reading CATIA V4 and V5 native files, as well having the ability to read ACIS-based geometry for the purpose of FEA simulation," said Tomi Mossessian, president, PlassoTech. "Spatial's interoperability solution was the best option and one we believe will provide our customers with the solution they are looking for. In addition, Spatial's dedication to providing updated interoperability solutions within three months of a major CAD product release demonstrated to us the type of support we believe will surpass our customers' expectations."
"PlassoTech's 3G.author simulation product is used by customers including Bose, Canon and Sony," said Phil Spreier, product manager, Interoperability, Spatial. "PlassoTech's decision to utilize Spatial's Interoperability solution for such established and recognizable companies underscores not only the strength of PlassoTech's offering but also the reliability of Spatial's solutions. I look forward to working with PlassoTech as it expand its market penetration and continues to deliver advanced simulation solutions."
PlassoTech develops and markets computer-aided engineering tools that help companies simulate, validate and optimize their designs and design processes. The 3G.Design Simulation/Optimization Suite has been adopted by such companies as Akabono, Bose, Canon, Delphi Electronics, Intevac, OXY-DRY, Panasonic, SONY and Tokyo Electron. It has found a market in such industries as machinery and equipment, instrumentation and controls, automotive, aerospace and electronics.
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