CIMdata PLM Industry Summary Online Archive
21 July 2004
Company News
Synplicity Awarded Key Patent for Signal Integrity Technology
Synplicity Inc. announced the United States Patent Office has awarded the company a patent for technology that addresses mounting signal integrity issues in next-generation ICs.
Synplicity's latest technology achievement, patent number 6,734,472 B2, titled, "Power and Ground Shield Mesh to Remove Signal Coupling Effects," provides users with increased signal integrity safety, better pre-route delay prediction, power and ground noise suppression and improved power distribution, guarding against unforeseen design issues that could prove costly. The technology described in the patent uses a unique two-dimensional power and ground-interconnect mesh to shield both capacitive and inductive coupling between susceptible signal lines. Synplicity believes this technology will enable the more efficient development of integrated circuits at 90nm and below.
Synplicity's patented signal integrity technique has a starting point where simple routing design rules can be used to guarantee signal integrity safety and predictability of delay. The shielding mesh, which is also used as part of the power distribution, can then be optimized while maintaining signal integrity safety.
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