CIMdata PLM Industry Summary Online Archive
26 August 2004
Product News
ImpactXoft Introduces Mobile Collaborative Design Solution
It is now possible for product developers to transmit design changes from more places than ever with laptop computers using Intel® CentrinoT mobile technology paired with ImpactXoft's Simultaneous Product DevelopmentT (SPD) software. This communications breakthrough marks a dramatic improvement in the efficiency and accuracy of product development teams during the highly iterative work-in-progress phase.
With ImpactXoft's IX SPeeD® V5 Suite, only the changes made to a design are transmitted within extremely small files across globally distributed teams, making it possible for the first time for product development teams to work in parallel on the same design with the flexibility and convenience of mobile computing devices. In addition, the IX SPeeD V5 Suite is the only 3D design solution natively interoperable with Dassault Systèmes' CAA V5 platform, adding another layer of communications ease and flexibility across the enterprise supply chain.
"Now the engineer can go directly to the shop floor with a laptop and implement and communicate design changes on the fly to the entire distributed team," said Attilio Rimoldi, president and CEO of ImpactXoft. "Before this capability, engineers didn't have powerful enough portable computers to run CAD on the shop floor, and they couldn't just share the changes they made, but had to transmit the entire design which demanded far too much processing power for any laptop."
ImpactXoft and Intel demonstrated the mobile collaborative design capability at COFES and COE earlier this spring. Pilot tests of the solution in a manufacturing setting are currently underway, running the IX SPeeD V5 Suite on HP laptops and tablet PCs powered by Intel Centrino mobile technology. For a more detailed explanation of the solution, visit http://www.impactxoft.com/index.asp?cam=IntelPR
"Global economic forces are making efficient communications more important than ever, especially for the manufacturing industry," said John Davies, vice president and director, Intel's Solutions Market Development Group. "The combination of the IX SPeeD V5 Suite with the outstanding mobile performance and WLAN capability of Intel Centrino mobile technology gives engineers a collaborative design technology with the ability to implement, share, and merge changes, while improving the manufacturing process."
Become a member of the CIMdata PLM Community to receive your daily PLM news and much more.
Tell us what you think of the CIMdata Newsletter. Send your feedback.
CIMdata is committed to your privacy. Your personal information will never be sold or shared outside of CIMdata without your express permission.