CIMdata PLM Industry Summary Online Archive
27 October 2004
Implementation Investments
Toshiba Implements Its Largest Semiconductor Design to Date with Cadence Digital IC Flow
Cadence Design Systems, Inc. announced that Toshiba Corporation and Toshiba Microelectronics Corporation successfully taped out a 24-million-gate chip using Cadence® SoC EncounterT. The chip, with an end application in digital consumer electronics, is Toshiba's largest to date, and was designed using Toshiba's TC300 process for 90 nanometer technology.
As indicated by this successful tapeout, SoC Encounter is now fully supported as the digital IC implementation platform of choice for Toshiba's standard design environment. Toshiba released the first version of this design environment in July to its worldwide internal design community and it is being used in several design projects already underway.
"Deploying Encounter's Physical Prototyping functionality in the early stage of the design process was critical to helping us avoid schedule delays for this design," said Takashi Yoshimori, Technology Executive SoC-Design of Toshiba's Semiconductor Company. "We see this chip as one of the year's most important projects in the digital consumer arena."
"Our mission is to provide high quality designs with shorter turnaround time," said Kiyofumi Ochii, Senior Vice President of Toshiba Microelectronics Corporation. "SoC Encounter helped us meet our goal for this extremely challenging design by delivering speed, capacity and quality of results with a fully integrated design flow from prototyping through GDS."
To achieve the highest quality of silicon with the simplest design flow, Toshiba used Cadence SoC Encounter physical implementation technology and wires-first methodology. SoC Encounter's timing and signal integrity closure flow coupled with fast turn-around-time helped Toshiba achieve First Silicon Success for this scale of design.
"We are delighted to see Toshiba successfully implementing its largest 90 nanometer design to date using SoC Encounter," said Wei-Jin Dai, platform vice president, digital IC implementation, Cadence Design Systems. "Toshiba is one of Cadence's most highly valued customers and this tapeout underscores our ongoing commitment to customer success as measured in quality silicon."
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