CIMdata PLM Industry Summary Online Archive
10 November 2004
Company News
Cadence Sponsors Industry Forums; Series Addresses Key Challenges Affecting the Design Chain
Cadence Design Systems, Inc. announced its sponsorship of Industry Forums, a series of panels where leading experts from major semiconductor, foundry, equipment, IP and EDA companies will engage each other on key issues and challenges affecting the design chain. The first two forums will focus on low-power design and advanced nanometer manufacturing challenges.
The first forum, "Making the Low-Power Design Chain a Reality," will be co-sponsored with the Fabless Semiconductor Association (FSA) and held Nov. 11 at the 2004 FSA Suppliers Expo Taiwan. This forum explores how advanced nanometer technology nodes and complex wireless applications have made the impact of power consumption on design performance a significant issue for designers. At 90 nanometers and below, leakage current becomes a significant barrier to success. At this panel, experts from semiconductor industry leaders such as Cadence, Freescale, and TSMC will provide perspectives regarding the business effects of power management and technical approaches to address low-power design. Mike Clendenin of EE Times will moderate the forum. For more information, please visit: http://www.fsa.org./suppliers_expo/taiwan/forum.asp .
The second forum, "How Does the Design Chain Need to Reconfigure Itself to Address the Manufacturing Challenges of the Nanometer Era?," will be held during the Cadence Partners Event on Dec. 2, 2004, in San Jose. This forum considers how significantly increasing complexity has severely hindered the ability to effectively develop, integrate, and ramp new technology nodes, as experienced at 130 nanometers. Design and photomask costs are skyrocketing and are affecting the business model for lower-volume ASICs and SoCs. The disaggregated design chain must invest in new, more integrated solutions, form strategic alliances to increase collaboration, and reintegrate to enable customer success at advanced processes. At this panel, business experts from leading integrated device manufacturers (IDMs), EDA vendors, lithography tool providers and pure-play foundries will debate the industry structure required to address the challenges affecting the design chain. Ken Rygler of Rygler and Associates, Inc. will serve as moderator.
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