CIMdata PLM Industry Summary Online Archive
7 December 2004
Implementation Investments
DARPA Selects PTC for Next Generation 3D Integrated Circuit Research Project; PLM Expertise in Electronics & High Tech Leads to Selection for Design Management
PTC announced that the Defense Advanced Research Projects Agency (DARPA), the central research and development organization for the United States Department of Defense, has selected PTC as the prime contractor for a research project to deliver 3-Dimensional Integrated Circuit (3D IC) design management capabilities. PTC will use the proceeds from this funded research project to enhance Windchill®, Pro/ENGINEER®, and InterCommT. DARPA plans to use these solutions along with other advanced IC solutions to improve the performance of next-generation military electronics.
Key to DARPA's decision was PTC's strong history of working with commercial and military electronics companies to improve their product development processes by producing higher quality, lower cost products that can be delivered in a shorter timeframe. As part of this multi-million dollar, multi-year funded research project, PTC has sub-contracted with Raytheon and North Carolina State University. PTC and its partners plan to deliver three main components of the IC research project including design process management, design collaboration, and design tool integration. Specifically, PTC will provide:
• Product development process management and design collaboration solutions developed with Windchill.
• Mechanical and thermal analysis of these next generation integrated circuits with Pro/ENGINEER
• Information extraction and visualization with InterComm
• Integration to third-party design and analysis applications through Windchill
As subcontractors to the deal, North Carolina State University will offer innovative IC design technology expertise and Raytheon will provide key end user perspective and testing. Collectively, DARPA's goal is to create the manufacturing capabilities and design framework to develop advanced, high-performance 3D IC's.
"PTC will provide DARPA and the electronics industry with an innovative Product Lifecycle Management (PLM) solution that will manage the overall design process for greater first-pass product development success for integrated circuits," said Greg Creech, Design Team Leader for the Air Force Research Laboratory at Wright-Patterson Air Force Base, the Contracting Officer's Technical Representative (COTR) for the project. "We are confident that PTC will be key to the success of this overall project by managing the flow of information between design disciplines and their respective design and analysis tools."
"Sharing data and collaborating across the many design disciplines that need to interact to develop and manufacture a 3D IC is a highly complex process," said Chad Hawkinson, director, electronics & high tech product & market strategy, PTC. "This is a very exciting project because Windchill will be instrumental in addressing the industry's need for improved product development collaboration and process management, ultimately providing these companies with future advancements in their technology solutions."
PTC solutions for electronics & high tech are designed to meet the product lifecycle management requirements of electronics manufacturers. These solutions include product development process and data management, electronic verification and collaboration, environmental regulatory compliance (RoHS, WEEE, etc.) and 3D mechanical design. PTC has over 3,000 high tech customers, including the top 30 largest electronics manufacturers across the globe.
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