CIMdata PLM Industry Summary Online Archive
4 January 2005
Company News
Microfabrica and MOSIS Launch 'EFABT Access' to Boost Innovation in 3-D Microdevice Design
Microfabrica, a leader in microdevice and microsystem fabrication, has partnered with MOSIS, a low-cost prototyping and small-volume production service for integrated circuit development, to introduce EFAB Access, the first multi-project run service to offer Microfabrica's 3-D micromanufacturing technology.
EFAB Access gives companies, universities, research labs, and individuals the ability to design three-dimensional MEMS and microdevices and have their prototypes produced economically through MOSIS. The program opens the door to a wide variety of 3-D applications, including sensors, actuators, RF devices, and medical instruments.
"We've seen significant demand among designers for a flexible MEMS and microdevice provider. After considering the available MEMS technologies, we chose to partner with Microfabrica because of the unprecedented flexibility of the EFAB process for microdevice design and fabrication. No other MEMS technology enables such a wide range of microdevice applications," said Vance Tyree, research and development manager at MOSIS. "There are so many designers with ideas and needs for groundbreaking, complex 3-D microdevices that were previously impossible to manufacture with other technologies, or impractical to fabricate on a researcher's budget. We are pleased to make the EFAB process available to them for the first time, through EFAB Access."
"The EFAB process sets a new benchmark for microfabrication, through 3-D flexibility, ease-of-use, and quick time-to-market across a wide variety of applications from wireless electronics to inertial sensing. Our partnership with MOSIS extends these benefits of the EFAB process to a new group of designers and researchers," said Adam Cohen, executive vice president, technology and CTO of Microfabrica. "EFAB Access provides a set of simple design rules that empowers everyone to design and obtain 3-D microdevices and MEMS, at an affordable cost."
MOSIS' multi-project run service allows multiple, typically unrelated projects from multiple designers to be fabricated at the same time, as part of the same semiconductor or MEMS wafer, offering lower-cost access to advanced fabrication processes than a dedicated run.
A key benefit of the EFAB process is that it allows designers to create microdevices quickly using 3-D computer aided design (CAD) software. SolidWorks Corporation is the #1 provider of 3-D CAD software for EFAB Access.
Microfabrica's LayerViewT software allows designers to visualize what the layers of their devices will look like when the devices are produced through the EFAB process, and facilitates manual checking of design rules. The Web sites of Microfabrica, MOSIS, and SolidWorks include links to download LayerView software at no charge. Additionally, as part of EFAB Access, MOSIS will provide designers with specialized LayerView Plus software, as well as an EFAB Access Design Guide.
EFAB Access participants can submit their designs to MOSIS, which will then prepare the multi-project run layout for Microfabrica. MOSIS and Microfabrica have initially scheduled one EFAB Access run per quarter, and the deadline to submit designs for the first multi-project run is March 21, 2005. The first run allows devices to be built with up to 20 structural layers and is priced at $5,000 (domestic), which is less than 10% of a typical dedicated EFAB technology run. For specific requirements, full pricing details, and additional information, please visit http://www.efabaccess.com or http://www.mosis.org/efabaccess .
EFAB Access is designed to make EFAB technology available via a set of pre-defined layer thicknesses and standardized design rules. Companies that require greater design freedom or larger quantities of devices can contact Microfabrica directly at http://www.microfabrica.com/inquiry .
Attendees of the 18th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2005, January 30-February 3, 2005, in Miami, Florida, are invited to stop by the Microfabrica-MOSIS booth (#48) and learn more about EFAB Access.
Founded in 1999, Microfabrica Inc. is a leader in microdevice manufacturing. The company's proprietary EFAB® technology offers flexibility, ease-of-use and quick time-to-market in a wide range of applications including wireless, consumer electronics, automotive and military/aerospace. EFAB is the first manufacturing technology that can fabricate intricate, truly three-dimensional microdevices by depositing many tens of precision metal layers. The technology opens up a world of possibilities for complex microdevices and microsystems previously impossible or impractical to manufacture using other approaches.
Microfabrica is headquartered in Burbank, California.
MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for commercial firms, government agencies, and research and educational institutions around the world.
MOSIS provides designers with a single interface to the constantly changing technologies of the semiconductor industry. Mask generation, wafer fabrication, and device packaging are contracted to leading industry vendors.
MOSIS is based in Marina del Rey, California.
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