CIMdata PLM Industry Summary Online Archive

4 June 2008

Events News

Apache Design Solutions to Host Methodology Presentations by Designers from Leading Semiconductor Companies

Apache Design Solutions will host methodology presentations by designers from Broadcom, IBM, STMicroelectronics, Texas Instruments, Toshiba, and TSMC at this years’ 45th Design Automation Conference (DAC) in Anaheim, California. The designers will share their best practices on critical design challenges such as SoC power and noise sign-off, custom IP validation, and chip-package co-design. For presentation details and registration, go to http://www.apache-da.com/apache-da/Home/NewsandEvents/Seminars.html#Customer (Due to its length, this URL may need to be copied/pasted into your Internet browser’s address field. Remove the extra space if one exists.)

WHAT:  Methodology presentations by designers from Broadcom, IBM, STMicroelectronics, Texas Instruments, Toshiba, and TSMC

WHERE:   Apache Design Solutions, Booth #2311

                    Design Automation Conference, Anaheim Convention Center, Anaheim, CA

WHEN:

Broadcom: Reducing jitter in DDR interface

June 10, 2:00 pm

June 11, 10:00 am

IBM: Power integrity and low power design analysis

June 9, 12:00 am

STMicroelectronics: Embedded memory validation

June 10, 11:00 am

Texas Instruments: EMI noise modeling and compliance

June 9, 11:00 am

Toshiba: Chip-package-system co-design for cost reduction

June 11, 1:00 pm

TSMC: Power integrity and signoff methodology

June 9, 2:00 am

The company will also be demonstrating their complete line of power, noise, and reliability platform solutions for SoC and package/PCB designs. Demonstrations and presentations will include:

•  SoC dynamic power analysis from early design to signoff

•  Low power verification including MTCMOS, VTCMOS, and LDO

•  Methodology for early stage analysis from prototype to design

•  Analog, mixed-signal power integrity

•  Chip-Package-System co-design

•  Package and PCB power and signal integrity

•  Hands-on-Tutorial on chip-package co-design methodology

For more information and registration, go to http://www.apache-da.com/apache-da/Home/NewsandEvents/Seminars.html#Product (Due to its length, this URL may need to be copied/pasted into your Internet browser’s address field. Remove the extra space if one exists.)

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