CIMdata PLM Industry Summary Online Archive
5 February 2008
Events News
Apache Design Solutions CEO Andrew Yang to Participate in a Panel Discussion on IC-Package-Board Co-Design
Apache Design Solutions announced that Andrew Yang, CEO and Chairman of Apache Design Solutions will be participating in a panel titled “Package Extraction, Modeling, and Simulation in IC-Packaging-Board Design” at the DesignCon Conference held in Santa Clara, California. With rising complexity in system designs, there is a need for an accurate IC-package co-design/co-analysis and incremental design enhancements/optimization to ensure properly functioning and cost efficient systems. This panel brings together experts in design and simulation of ICs and packages to discuss the interactions between the two domains and the needed enhancements in electronic design automation solutions.
WHAT: Packaging Extraction, Modeling, and Simulation in IC-Packaging-Board Design
WHERE: DesignCon 2008, Santa Clara Convention Center, Santa Clara, California
WHEN: Wednesday, February 6, 2008, 3:45 pm -5:00 pm
For more information visit: http://www.designcon.com/2008/conference/tec_panel_wednesday_package.html Due to its length, this URL may need to be copied/pasted into your Internet browser's address field. Remove the extra space if one exists.)
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