CIMdata PLM Industry Summary Online Archive
18 May 2009
Implementation Investments
Cadence Encounter Digital IC Design Platform Adds 200 New Customers, including Ricoh and Siano
Cadence Design Systems, Inc. announced that it has added more than 200 customers to its growing list of Cadence® Encounter® Digital Implementation IC design platform users over the past 24 months. The Cadence Encounter Digital Implementation (EDI) System, which was added to the product suite last December, is achieving wide-scale adoption. Most recently, while using EDI System Ricoh Co. Ltd., and Siano Mobile Silicon each reported advantages in productivity, design performance, area reduction and power consumption when designing large-scale, high-performance advanced-node digital designs with both complex low power and mixed-signal requirements.
Imaging and digital office solutions products place a wide range of demands on semiconductor design, including the need for higher efficiency, miniaturization and reduced power consumption. Ricoh’s skilled CMOS analog, image processing, and information communications designers chose EDI System to ensure they would achieve the required high quality of silicon and fast time to market.
“Achieving the area, performance and power consumption targets becomes more challenging with every new project, and it is critical that our design software can scale to meet these increasing complexities,” said Kazunobu Sugaya, Manager, Design Engineering Section, Imaging System LSI Development Center, Electronic Devices Company, Ricoh Co. Ltd. “We are pleased with the Encounter Digital Implementation System’s native multi-mode, multi-corner timing optimization, signal integrity, and end-to-end multi-CPU design flow, which enable us to reach design closure more quickly than ever before.”
At Siano, a maker of highly integrated silicon receivers for the mobile digital TV (MDTV) market, designers successfully develop high-performance chips to meet extremely challenging power consumption and die-size constraints. A multidisciplinary team of mixed-signal, power and wireless design specialists combined the company’s proprietary algorithms with the Encounter Digital Implementation System and the CPF-based Cadence Low-Power Solution to produce leading-edge mobile entertainment technology.
“After our evaluation, we chose to adopt the full Encounter Digital Implementation and signoff system, as well the full Cadence Low-Power Solution,” said Neil Feldman, director of RF and VLSI chip design at Siano. “The Encounter flow allows us to quickly achieve design closure and differentiate our products with a complex power shut-off methodology and a unique multi-supply voltage scheme. This project clearly demonstrated the benefits of Encounter technology and the Common Power Format.”
“We are seeing design teams achieve better productivity, better quality of silicon, and faster time to market after switching to EDI System’s integrated and scalable design closure solution," said Chi-Ping Hsu, senior vice president of research and development for the Implementation Products Group at Cadence. “It is gratifying to see a surge of technology-leading companies turn to Cadence to achieve differentiated results for their designs.”
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