CIMdata PLM Industry Summary Online Archive
21 May 2009
Events News
Apache Design Solutions to Demonstrate the Next Generation Power Integrity Solutions for IC Package and SiP Designs at ECTC 2009
Apache Design Solutions announced that they will be participating at the upcoming Electronics Components and Technology Conference (ECTC) in San Diego, California, May 17 – 28, 2009. ECTC is the premier international packaging, components, and microelectronic systems technology conference. Apache will be demonstrating Sentinel, a complete power and noise analysis platform for IC package, PCB, and SiP designs in booth #220. The Sentinel products address the challenges associated with system-level power integrity, I/O-SSO, thermal, and EMI issues.
What: Electronic Components and Technology Conference
Where: Sheraton San Diego Hotel & Marina, San Diego, California Booth #220
When: Wednesday, May 27, 7:00AM to 6:30PM
Thursday, May 28, 7:00AM to 4:00PM
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