2 February 2009
Apache Design Solutions to Participate in Three DesignCon Sessions Addressing Chip-Package-System Co-Design
Apache Design Solutions announced that they will be participating in several technical and business conference sessions at the upcoming DesignCon Conference held in Santa Clara, California. Apache’s key executives will be discussing the latest challenges and solutions in maintaining power, noise, and thermal integrity and driving convergence across IC, package, system, and SiP designers.
What: Worst-Case Switching Pattern for Core Noise Analysis (4-TA3) Technical Paper
Who: Cisco Systems and Apache Design Solutions
Where: Santa Clara Convention Center, Ballroom J
When: Tuesday, February 3, 10:15AM to 10:55AM
This paper demonstrates an optimum methodology to capture the worst-case switching activity when performing the power integrity analysis for the core power of ASIC.
What: Collaboration across the Changing Design Chain Business Forum Panel
Where: Santa Clara Convention Center, Room 203/204
When: Tuesday, February 3, 2:00PM to 3:30PM
This panel will discuss the challenges faced by IC and system designers on reaping the benefits of SiP technology and what foundries and package providers are doing to make SiP a reality.
What: Multi-Die Chip/Package Co-Design for SiP Applications Technical Panel
Where: Santa Clara Convention Center, Ballroom G
When: Tuesday, February 3, 3:45PM to 5:00PM
This panel will discuss the challenges faced by the IC and package teams as power, SI, reliability, thermal, stress, etc. issues further exacerbates design and validation of multi-die chips, and the solutions needed to address these challenges.
Apache will also be exhibiting at DesignCon in booth #514, demonstrating its leading power, noise, and reliability platform solutions for Chip-Package-System co-design. Attendees will learn how to mitigate the design risks induced by noise issues, reduce overall cost, and improve productivity and time-to-market.
What: Apache Design Solutions at DesignCon 2009
Where: Santa Clara Convention Center, Booth #514, Santa Clara, California
When: February 3 – 4, 2009, 12:30PM – 6:30PM PST
For more information visit: http://www.designcon.com
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