CIMdata PLM Industry Summary Online Archive
2 February 2010
Product News
Mentor Graphics Enhances Signal and Power Integrity Solution with Full-Wave 3D Analysis
Mentor Graphics Corporation announced delivery of full-wave 3D electromagnetic (EM) analysis functionality addressing the needs of the industry’s most advanced designers of high-performance electronic products. These EM analysis enhancements address the advanced simulation needs of engineers designing PCBs and packages that utilize high-speed interconnect technologies such as SERDES, which operate at multi-gigabit-per-second speeds.
The new functionality is a result of Mentor Graphics’ recent acquisition of certain assets of Zeland Software Inc., which for 17 years has been a recognized leader in electromagnetic simulation. This new functionality is integrated with the Mentor Graphics HyperLynx® product suites and will analyze, in full electromagnetic detail, 3D structures such as vias, solder bumps, wirebonds, and edge connectors.
“Mentor is the only supplier to provide a full PCB systems design flow including this much-needed 3D electromagnetic solution,” stated Henry Potts, vice president and general manager of Mentor Graphics’ Systems Design Division. “It further strengthens our technology and world market share lead and provides our customers with capabilities they need to design their advanced electronics products.”
Today’s fast circuits commonly operate at speeds that require high-frequency electromagnetic effects to be accurately captured and modeled on PCBs, IC packages, and at the system level. Neglecting signal-path discontinuities often results in design failures or overall system performance degradation and forces further design iterations and delay of design closure.
EM simulation increases the model accuracy for 3D interconnect structures like vias, solder bumps, bond wires, and edge connectors. Without accurate models, power- and signal-integrity simulations cannot close the analysis gap with a high degree of confidence. The EM effects of these structures are dominating performance results in systems operating at the gigahertz (GHz) frequencies common in today’s high-speed SERDES, DDR2/DDR3, RF, and other high-frequency circuits.
These new capabilities are available immediately and add to the HyperLynx suite of fast, accurate, and easy-to-use products for signal-integrity, power-integrity, PCB thermal, EMI, and mixed signal (including analog) simulation. For more information on the new full-wave 3D analysis, go to www.mentor.com/go/hyperlynx3d and register for an educational webinar to be held March 10, 2010.
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