CIMdata PLM Industry Summary Online Archive
8 March 2011
Product News
Springsoft, Dongbu HiTek Release First in Series of Laker Process Design Kits to Streamline Custom Chip Design
SpringSoft, Inc. and Dongbu HiTek Co., Ltd., a world leader of specialized foundry technologies and services based in South Korea, announced a multi-year partner program to jointly develop a series of process design kits (PDKs) that streamline implementation of custom chips with Dongbu’s manufacturing technologies at mature process nodes. The companies also announced the release today of the SpringSoft Laker™ PDK for the Dongbu HiTek 0.18-micron BCDMOS foundry process with additional PDKs to follow throughout 2011.
This first foundry-qualified Laker PDK supports Dongbu HiTek’s 0.18-micron BCDMOS process technology that enables chip designers to integrate high levels of power with analog control and logic functions, making it ideal for applications such as audio and motor control ICs, automotive SoCs, and LED driver chips. The PDK includes foundry-specific device symbols, highly optimized parameterized cells (PCells), pre-validated design rules and the latest technology files. When used with SpringSoft’s Laker Custom Layout Automation System, the PDK automates the physical layout of analog designs to maximize designer productivity and reduce development cycles. The Laker 0.18-micron BCDMOS PDK is immediately available online for Dongbu HiTek customers.
“Our BCDMOS processes are used in a broad range of leading-edge chip applications and vertical markets, and provide the basis for advanced analog and power control designs that can be optimized for performance or cost,” said Dr. Taek-Soo Kim , Vice President at Dongbu HiTek. “By combining our chip expertise with SpringSoft’s custom design tools into Laker PDKs, foundry customers can now immediately access mature design automation and manufacturing technologies with a proven path to first-pass silicon success.”
“We’ve enjoyed a successful relationship with Dongbu HiTek as a user of Laker tools, and now we look forward to building on this as our teams collaborate to deliver PDKs that leverage their strength in specialized analog and mixed-signal foundry technologies. Together, we’re making it easier for our mutual customers to design and manufacture custom chips that meet their cost, performance and time-to-market goals,” said JT Li, Vice President of Physical Design Product Group, at SpringSoft.
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