CIMdata PLM Industry Summary Online Archive
26 April 2011
Implementation Investments
IOsemi Adopts Berkeley Design Automation Analog FastSPICE™ Platform
Berkeley Design Automation, Inc. announced that IO Semiconductor Inc., a fabless semiconductor company developing high-performance front-end chips for multi-band, multi-mode cellular applications, has selected the company’s AFS Platform for RF verification and characterization.
"At IOsemi we have tremendous verification and characterization challenges for our ZEROcap™ CMOS technology designs," said Stuart Molin, CTO at IOsemi. "We have standardized on the Analog FastSPICE Platform because it provides nanometer SPICE accuracy 5x to 10x faster than traditional SPICE, exceeding our requirements for verification and characterization of our high-performance CMOS RF front-end devices."
The Analog FastSPICE Platform is the industry’s only unified verification platform for nanometer analog, RF, mixed-signal, and custom digital circuits. The AFS Platform combines foundry-certified nm SPICE accuracy, 5x-10x faster single-core performance than any other SPICE circuit simulator, >10M-element capacity, and the industry’s only comprehensive silicon-accurate device noise analysis. The AFS Platform is a single executable that uses advanced algorithms and numerical analysis to rapidly solve the original device equations and full-circuit matrix without any approximations. It includes licenses for AFS Nano SPICE simulation, AFS circuit simulation, AFS Transient Noise Analysis, AFS RF Analysis, and AFS Co-Simulation.
"We are delighted with the IOsemi selection of the Analog FastSPICE Platform for their verification and characterization flow," said Ravi Subramanian, president and CEO of Berkeley Design Automation. "Achieving best-in-class cellular front-end performance in an RF-CMOS platform is a tremendous challenge. IOsemi's adoption of the AFS Platform reinforces the fact that today’s leading fabless semiconductor companies select Berkeley Design Automation for nanometer circuit verification."
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