CIMdata PLM Industry Summary Online Archive
17 January 2011
Product News
Cadence Introduces 32/28-Nanometer Low-Power RTL-to-GDSII Silicon Realization Reference Flow for Common Platform Alliance
Cadence Design Systems, Inc. introduced a qualified 32/28-nanometer reference flow targeting Common Platform™ technology. Cadence® collaborated closely with members of the Common Platform alliance—IBM, GLOBALFOUNDRIES, and Samsung Electronics—to develop a comprehensive flow from RTL synthesis to GDSII signoff for the advanced node, low-power high-k metal gate (HKMG) process technology.
This new Silicon Realization reference flow for the Common Platform alliance is built around the Cadence end-to-end Encounter® flow, including Encounter RTL Compiler, Encounter Test, Encounter Conformal, the Encounter Digital Implementation System, Litho Physical Analyzer, QRC Extractor, Encounter Timing System, and Encounter Power System. It was validated using the 32/28-nanometer ARM® low-power physical libraries, and employs the Common Power Format (CPF)-enabled Cadence Low-Power Solution to maintain power intent throughout the design process.
“We worked closely with Cadence to pursue an optimal design flow that enables our mutual customers to create differentiated products in 32/28-nanometer technology,” said Gary Patton, vice president, IBM Semiconductor Research and Development Center, on behalf of the Common Platform alliance. “Cadence's Silicon Realization offering of a fully optimized end-to-end design flow targeted to the Common Platform 32/28-nanometer high-k metal gate technology marks our mutual commitment to customer success."
The flow encompasses key foundry-validated technologies, including physically aware synthesis, large-scale rapid design exploration and physical prototyping, advanced timing and signal integrity concurrent optimization with multi-mode and multi-corner analysis and optimization, context-aware placement, advanced OCV-aware clock tree synthesis, litho-aware routing, and in-design signoff analysis for timing and power. In addition, concurrent design for manufacturing (in-design DFM) technology is enabled on demand to ensure manufacturability at 32 and 28 nanometers. The Cadence Silicon Realization reference flow is fully optimized to deliver significant power savings with utmost quality on all counts, and offers time-to-market advantages for innovative electronic designs targeted to the Common Platform alliance’s 32/ 28-nanometer process.
The recently announced Silicon Realization flow is the latest Cadence offering supporting the EDA360 vision, which, among other things, calls for industry-wide collaboration to address the challenges of today’s complex designs.
"Our close collaboration with the Common Platform partners brings together silicon-proven tools, end-to-end flows and methodologies as an aid to advanced designers looking to achieve better predictability in design convergence, superior quality of silicon and higher design productivity," said Chi-Ping Hsu, senior vice president, Research and Development, Silicon Realization Group at Cadence. "The close collaboration between Cadence and the Common Platform alliance on advanced node, low-power design solutions for Silicon Realization gives designers a fast track to silicon success."
Solutions for 32/28-nanometer technology and other advanced innovations will be presented at the Common Platform Technology Forum on Jan. 18, 2011 at Santa Clara Convention Center. Forum details can be found at http://www.commonplatform.com.
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