CIMdata PLM Industry Summary Online Archive

31 January 2011

Events News

Apache Design Solutions to Sponsor Upcoming Chip-Package-System Workshop

Apache Design Solution announced that it is sponsoring an educational CPS Workshop at the upcoming DesignCon 2011 conference being held at the Santa Clara Convention Center in Santa Clara, California. The CPS Workshop will take place during the conference on February 3, from 9:00 a.m. to 12:00 p.m., in the Great America Room #1-2, second floor.

This informative CPS Workshop technical session is titled “Methodologies for Chip-Package-System Co-design with EMI/EMC Focus,” and will feature presentations by leading experts in the industry on methodologies and technologies for CPS, EMI and EMC modeling and analysis. The workshop will include case studies and real design examples by speakers from LSI Corporation, Infineon Technologies, and the Missouri University of Science and Technology. Admission to the workshop is complimentary for DesignCon attendees, but advance registration is required and seating is limited.

Meet the Apache Design Solutions’ CPS experts who will be on hand during the DesignCon exhibition (booth #214), being held on February 1-2, to demonstrate the company’s solutions for CPS convergence. Apache will also be a featured speaker delivering a technical track paper entitled “Design and Optimization of Power Delivery Network for 3D Stacked Die Designs,” on February 3, at 10:40 a.m. in Ballrooom G.

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