CIMdata PLM Industry Summary Online Archive
10 December 2012
Product News
Moldex3D Mold Filling Simulation Technology Now Integrated with Siemens’ NX 8.5 Software
CoreTech System(Moldex3D) Co., Ltd., announced its mold filling simulation technology has been integrated with the latest release of NX™ software, Siemens’ flagship computer-aided design, manufacturing and engineering analysis (CAD/CAM/CAE) solution. NX EasyFill Analysis will enable the innovative and professional mold filling simulation technologies to further enhance the mold design-to-manufacturing process for users of NX 8.5. Siemens’ PLM software business unit started distributing and supporting NX EasyFill Analysis globally with the release of NX 8.5.
“We are very happy to incorporate Moldex3D filling analysis capabilities in NX to offer designers a more accessible and easy-to-use injection molding solution,” said Dr. Venny Yang, President of Moldex3D, “Predicting and preventing manufacturing defects in the earliest design phase of plastic injection-molded product development will become more efficient and cost-effective, and help companies avoid unnecessary waste of time and money on repeated mold trials and fixes.”
“NX has been a global leader in the design of high-end plastic product and mold tooling in a wide variety of industries. We believe that incorporating Moldex3D CAE technologies will further enhance our customers’ ability to validate designs upfront and solve design bottlenecks. The EasyFill Analysis in NX 8.5 demonstrates our commitment to bringing integrated design and manufacturing simulation solutions for plastic parts to our customers,” said Jim Rusk , Senior Vice President of Product Engineering Software, Siemens PLM Software.
NX EasyFill Analysis enables designers to easily check potential manufacturing defects without leaving the NX design environment. It helps users tackle significant molding issues more efficiently to optimize gate number/locations, material selection, or process conditions. Additionally, Moldex3D provides more advanced capabilities in its “eDesignSYNC for NX” to support packing, cooling, fiber orientation and warpage predictions. It allows NX users to visualize more critical molding factors and evaluate the results, such as sink marks, overpacking, or thermal displacement and part shrinkage.
NX EasyFill Analysis is now available in NX 8.5, to read more see the NX EasyFill fact sheet. To read more about all the new functionality in NX 8.5, please visit www.siemens.com/nx. The product information about Moldex3D eDesignSYNC for NX can be found at www.moldex3d.com/en/products/solution-addons/edesignsync.
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