Industry Summary Articles

Fujitsu Electronics Europe (FEEU) will be attending this year’s electronica in Munich from November 8 to 11, 2016. Under the slogan “Accelerating Global Innovation“, FEEU informs businesses about the current supplier portfolio and range of product linecards, developed by the value added distribution partner for key sectors such as the…

Dassault Systèmes presents the Italian edition of 3DEXPERIENCE Forum 2016, “Doing Business in the Age of Experience,” to be held October 13 at Talent Garden in Milan.  The event will focus on the proposition of groundbreaking innovation strategies to the Italian business community and will showcase a content-rich agenda, where…

TEDxHyderabad will be the second TEDx Event to be presented under the TEDx Anchor Program series and will take place on Sunday, 2 October, at Sandhya Convention by Nimantran, Gachibowli, Hyderabad. This event has been organized with the core narrative revolving around “Crafting Our Future.” A line-up of 13 speakers…

Infosys today announced the winners of the first Infy Maker Awards, India. The Infy Maker Awards are testimony to Infosys' commitment to encourage the concept of 'Making' in India, acknowledging those individuals that have an interesting or innovative solution for real-world issues or a knack for leveraging technology to make things easier.…

Materialise NV, HOYA Vision Care Company, and Hoet Design Studio are proud to launch the world’s first vision-centric 3D-tailored eyewear. Yuniku by HOYA enables individualized lens and frame design, with a sophisticated end-to-end digital supply chain that is set to transform the eyewear industry. For the first time ever, both…

Cadence Design Systems, Inc. today announced the immediate availability of an integrated system design solution for TSMC’s advanced wafer-level Integrated Fan-Out (InFO) packaging technology, resulting from a collaboration between Cadence and TSMC that was announced earlier this year. Cadence is now offering implementation, signoff and electro-thermal analysis tools that enable…

Synopsys, Inc. today announced its collaboration with TSMC to deliver innovative technologies to enable adoption of TSMC's High Performance Compute (HPC) Platform. The new technologies, enabled through TSMC and Synopsys collaboration, will be available in the Synopsys' Galaxy™ Design Platform for the 7-nanometer (nm) process in November 2016. Via pillar, multi-source…

PTC today announced that it has joined the SAP® PartnerEdge® program as a partner that designs, develops and builds software integrated with SAP solutions. Through its participation in the program, PTC is now announcing the availability of its ThingWorx® Internet of Things (IoT) platform running on the SAP HANA® platform.…

3D PDF Consortium is pleased to announce its first Academia Member Category partner. Purdue University is the first university to take advantage of the new Academia member category. The team initiating the drive for consortium membership is headed up by Nathan W. Hartman, Ed.D., the Professor and Associate Head of Computer…

ESI Group launches the latest version of its Virtual Reality solution IC.IDO 10.2. In this new version, ESI has strengthened its solution with the new modules IDO.SolidMechanics and IDO.Elastic, while significantly improving pre-existing modules. Benefiting from ESI’s unique knowledge of material physics, the two new modules are based on a novel physical simulation…