Industry Summary Articles

aPriori will be holding its third annual European product cost management conference on June 27-29 at the International Conference Center in Stuttgart, Germany.  The event kicks off on Monday evening, June 27, with a Welcome Reception.  On Tuesday, June 28 and Wednesday, June 29, leading PCM practitioners from the UK, the…

Materialise NV is pleased to announce the newest version of the Materialise Mimics Innovation Suite. This flexible platform of 3D printing software and services enables engineers and researchers to achieve rapid, reliable image segmentation and accurate 3D reconstruction using validated software. Users can now segment medical images faster with new intuitive tools such…

COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design software, today announced the latest release of the COMSOL Multiphysics® and COMSOL Server™ simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics®, COMSOL Server™, and add-on products have been implemented with an emphasis on accuracy,…

Mastercam 2017 brings a new suite of programming tools focused on delivering speed, automation, and efficiency for all machining jobs.  Mastercam 2017 introduces a more efficient workflow, improved usability, Dynamic Motion improvements, and so much more. Mastercam 2017 features a new ribbon interface and makes it easier to find the…

Mentor Graphics Corp. today announced that MagnaChip Semiconductor Corp., a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications, has selected the Mentor® Analog FastSPICE™ (AFS™) Platform for circuit verification and device noise analysis of their analog and mixed-signal designs including display drivers, power management ICs, and…

Visual 2000 International, end-to-end omni-channel business solutions provider for the apparel, footwear and accessories (AFA) industry, has announced its sponsorship of the Product Innovation (PI) Apparel Congress, scheduled to take place on June 27-28, 2016, in New York City.  PI Congress is a gathering of AFA professionals to discuss and…

The Borlas consulting group and DATADVANCE – a developer of predictive modeling, intelligent data analysis and multidisciplinary optimization software in Russia, present the solution integrating pSeven, the software package for engineering analysis and optimization by DATADVANCE, and Teamcenter®, the product lifecycle management system developed by Siemens PLM Software. This joint…

Centric Software is pleased to announce the availability of its brand new Field Testing mobile app in iOS. This new app works seamlessly with Centric’s PLM platform or, alternatively, can be used as a stand-alone solution. Centric’s Field Testing app is a new innovation and unique on the market. It…

Camtek Ltd. today announced the launch of an innovative inspection method for Fan-Out Wafer Level Packaging (FOWLP). This new inspection method compares the image acquisition of the dies on the reconstructed wafer with the computer-aided design (CAD) data used in fabricating the wafer. Ramy Langer, Vice President and Head of…

International TechneGroup Limited (ITI) will be exhibiting at the Farnborough International Airshow in the UK, 11-17 July. ITI will be on the Midlands Aerospace Alliance stand 1/B90 showcasing their engineering data interoperability solutions which significantly benefit the aerospace industry.  “Aerospace customers demand that their engineering and manufacturing technologies enable interoperability…