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Geometric Limited today announced the release of eDrawings® Publisher for CATIA® V5 10.6 with support for eDrawings viewer 2015. eDrawings is the first email enabled collaboration tool designed to ease the sharing and interpretation of 2D and 3D product design data. Features and Benefits: Generate ultra-compact eDrawings (up to 95% compressed) and share over email Share and receive feedback on product designs with review-enabled eDrawings and collaborate with unlimited number of recipients Take dynamic sections and hide/show/move components Measure dimensions in part, assembly, and drawing files Review changes using Markups Export files to STL, HTML, eDrawings EXE and image formats eDrawings Publisher for CATIA V5 version 10.6 includes: Support for CATIA V5-6 R2015 Upgrade of eDrawings viewer version to eDrawings 2015 Support for Windows 8 and Windows 10 eDrawings Publishers are also available for Pro/ENGINEER® and Creo®, NX™, Solid Edge® and STEP and IGES files.  To view the original press release, please click here. Search for Geometric on CIMdata.com

NAFEMS, the International Association for the Engineering Analysis, Modelling and Simulation Community, is preparing to welcome the major players in the UK Simulation & Analysis Industry to Telford next month for the 2016 NAFEMS UK Conference. The conference will include over 70 presentations more than 20 sessions, representing the most comprehensive and wide-ranging overview of the analysis and simulation industry in the UK. The conference has already attracted sponsorship from the major names in the simulation arena, including MSC Software, Altair, Siemens, Ansys, Ceetron, ITI Transcendata, nCode, Allinea, BETA CAE, Dassault Simulia and Mentor Graphics to name only a few. Presentations are already confirmed from companies such as GE Alstom, Rolls-Royce, Fujitsu, Airbus, Jaguar Land-Rover, Arup & Robert Bird Group, in what promises to be the finest collection of workshops, discussion sessions, presentations and technical sessions available in an independent UK forum this year. “The NAFEMS UK Conference

IronCAD, LLC along with AMPS Technologies announced major software donations to top universities in Taiwan. The National Taiwan University (NTU) and the National Taiwan University of Science and Technology (NTUST) received IRONCAD 3D design software and AMPS Multi-Physics Finite Element Analysis (FEA) application. The software will be used within the respective universities’ engineering curriculum for both teaching and research. The president of IronCAD, Dr. Tao Yan Han and the president of AMPS, Dr. Ted Lin, both graduates of NTU, were present at the donation ceremony held at NTUST along with Professor Liang-Jheng Leu, the Chairman of the Department of Civil Engineering at NTU, and Professor Cheng-Cheng Chen, the Chairman of the Department of Construction Engineering at NTUST, along with other faculty members. "We are very excited and proud to offer our solutions to these universities, both of which are among the top universities in Taiwan." said Dr. Han and Dr.

Accenture and IPsoft today announced the creation of an Accenture Amelia practice, designed to accelerate client adoption of artificial intelligence to improve business outcomes and create new growth opportunities for their businesses. Accenture will utilize IPsoft’s Amelia platform to develop go-to-market strategies, solutions and consulting service offerings around deployments of virtual agent technology for clients across several industries with initial focus on banking, insurance and travel. “Artificial intelligence is maturing rapidly and offers great potential to reshape the way that organizations conduct business and interact with their customers and employees. At the same time, executives are overwhelmed by the plethora of technologies and many products that are advertising AI or Cognitive capabilities,” said Paul Daugherty, Accenture’s chief technology officer. “With our new Accenture Amelia practice, we are taking an important step forward in advancing the business potential of artificial intelligence by combining IPsoft’s world-class virtual agent platform with Accenture’s broad technology capabilities

ANSYS has married the advanced computer science of elastic computing, big data and machine learning to the physics-based world of engineering simulation – offering the industry a first look at the future of product development. Available today, the unique ANSYS®  SeaScape™ architecture enables organizations to innovate faster than the ever. ANSYS®  SeaHawk™ is the first product taking advantage of this new platform capability to deliver accelerated design optimization of next-generation chips.   Engineering simulation generates tremendous amounts of data – far more than most organizations can effectively leverage for future product designs. A typical integrated circuit, for example, has billions of variables that can be simulated. At the same time the highly specialized engineering supercomputing resources are not keeping pace with the demand for even higher fidelity simulations needed for increasingly complex products. By leveraging such big data technologies as elastic compute and map reduce, SeaScape provides an infrastructure to address these issues in the context

First Quarter Fiscal 2017 Total subscriptions increased 132,000 from the fourth quarter of fiscal 2016 to 2.71 million at the end of the first quarter. New model subscriptions increased 140,000 from the fourth quarter of fiscal 2016 to 567,000. Total annualized recurring revenue (ARR) was $1.44 billion, an increase of 9 percent compared to the first quarter last year as reported, and 12 percent on a constant currency basis. New model ARR was $308 million and increased 71 percent compared to the first quarter last year as reported, and 76 percent on a constant currency basis. Deferred revenue increased 32 percent to $1.52 billion, compared to $1.15 billion in the first quarter last year. Revenue was $512 million, a decrease of 21 percent compared to the first quarter last year as reported, and 17 percent on a constant currency basis. During Autodesk's business model transition, revenue is negatively impacted as more revenue is recognized

Ridgetop Group of Tucson, Ariz., has become a voting member of the Electronic System Design (ESD) Alliance (formerly the EDA Consortium), an international association of companies providing goods and services throughout the semiconductor design ecosystem. In joining the Alliance, Ridgetop Group, provider of advanced electronic prognostics and health management (PHM) solutions for electronic systems, semiconductor intellectual property (IP) blocks, and built-in self-test (BIST) solutions for critical applications, noted several initiatives that corresponded with its needs. They include the new Semiconductor IP Working Group to develop common methodology and best practices for IP fingerprinting, the Market Statistics Service (MSS) and the Export Committee that tracks licensing and compliance issues. "Ridgetop is an impressive company with a portfolio of equally impressive solutions and tools to improve performance and reliability of mission-critical electronic systems for companies in North America, Europe and Asia," comments Bob Smith, the ESD Alliance's executive director. "It is with great pleasure

The Outlook integration for PROSTEP's managed file transfer (MFT) solution OpenDXM GlobalX has been awarded the Industriepreis (Industry Award) by the "Initiative Mittelstand" for what is already the second time. The OpenDXM GlobalX Outlook integration ranked among the leading group of products and was awarded the distinction "Best of 2016". The integration makes sending confidential files of any size with real end-to-end encryption as simple as sending an e-mail and ensures compliance with company-specific rules relating to the secure data exchange. The Industriepreis is awarded annually by the publishing house Huber Verlag für Neue Medien in recognition of the economic, environmental, technological and social benefits offered by innovative industrial products in a variety of categories. These include, among others, IT and software solutions that help simplify and automate processes and workflows in industrial companies. The products and solutions are evaluated by an independent jury of experts comprising professors, scientists, industry

Planview has moved into a new, state-of-the-art headquarters facility in Austin, Texas. Planview’s new 51,000 square-foot facility, located at 12301 Research Blvd, at Research Park V, will accommodate Planview’s 200+ Austin-based employees and will allow for 50 percent incremental headcount growth. The new office brings together the company’s employees from previous locations at 8300 North Mopac and 8601 Ranch Road 2222. “After completing two acquisitions in two years, we wanted one space to help our Austin-based employees come together in an efficient and inspiring environment and continue the innovation that has facilitated our growth,” said Planview CEO Greg Gilmore. “As we merge our two locations in Austin into one, we are proud to continue broadening our overall presence in one of the world’s greatest technology centers.” During a two-year time period, the company’s global footprint expanded from 250 to almost 600 employees and revenue grew at a compound annual rate

BIMobject, Inc., the North American subsidiary of BIMobject AB, announced today at The American Institute for Architects (AIA) convention in Philadelphia that Autodesk has appointed BIMobject its exclusive reseller in North America and Europe for new subscriptions of Autodesk® Seek, a cloud-based building product content delivery system. Additionally, BIMobject is an early adopter of the Autodesk® Forge Platform, which consists of a set of Autodesk cloud services, APIs, and SDKs for developers to quickly create the data, apps, experiences, and services that power the future of making things. BIMobject leverages Forge APIs for content creation and “on-the-fly” content configuration workflows. The Autodesk® Seek web service enables architects, engineers, construction professionals and other design professionals to quickly discover, preview, and download branded building information modeling (BIM) files, models, drawings, and product specifications for their active design sessions in Autodesk Revit® or AutoCAD® software. Autodesk’s new relationship with BIMobject will extend and