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PTC today announced that it has joined the 3MF Consortium at the founding membership level. 3MF Consortium is an industry association created to develop and promote a new full-fidelity file format for 3D printing. PTC’s industry-leading Creo® CAD software offers capabilities designed to streamline additive manufacturing, enabling users to remove uncertainty and rework from the process, and allowing them to go from concept to validation quickly and easily. With Design for Additive Manufacturing, PTC provides a single environment within its Creo product suite that enables users to design, optimize, prepare, and validate designs for 3D printing. “PTC is committed to bringing visibility of manufacturing capabilities to the design engineer and streamlining the overall design-to-3D print process,” said Paul Sagar, vice president, CAD product management, PTC. “This is a shared vision with the 3MF Consortium, and we look forward to collaborating with fellow industry leaders to make this a reality.” “PTC joining the 3MF Consortium is yet

The Business Advantage Group this week announced more details from its Worldwide CAD Trends 2016 Survey, specific to Concurrent Engineering. The survey results are based on responses from CAD users, Designers, Engineers, Professionals including managers and senior executives.   Chris Turner, CEO of Business Advantage Group commented, “Concurrent Engineering through CAD collaboration, defined as multiple users working on a single model in real time, continues to be an area of interest in today’s market with relatively low current usage implying plenty of opportunity for the growth that survey respondents predict.” For Concurrent Engineering the growth predicted in the 2015 report did not materialize – usage has remained flat (19%-18%) through 2015. Users continue to rate its Importance highly – it is the 6th most important CAD trend from the survey. Like PLM, Concurrent Engineering is a trailing trend - high importance coupled with relatively low usage. However, users continue to predict growth – 33% this year (from 18%

Oracle today announced that it has entered into a definitive agreement to acquire NetSuite, the very first cloud company. The transaction is valued at $109.00 per share in cash, or approximately $9.3 billion. “Oracle and NetSuite cloud applications are complementary, and will coexist in the marketplace forever,” said Mark Hurd, Chief Executive Officer, Oracle. “We intend to invest heavily in both products—engineering and distribution.” “We expect this acquisition to be immediately accretive to Oracle’s earnings on a non-GAAP basis in the first full fiscal year after closing,” said Safra Catz, Chief Executive Officer, Oracle. “NetSuite has been working for 18 years to develop a single system for running a business in the cloud,” said Evan Goldberg, Founder, Chief Technology Officer and Chairman, NetSuite. “This combination is a winner for NetSuite’s customers, employees and partners.” “NetSuite will benefit from Oracle’s global scale and reach to accelerate the availability of our cloud

Design Data, specializing in 3D steel detailing and Building Information Modeling (BIM) software, announced today the company has been acquired by Nemetschek Group, based in Munich, Germany. Nemetschek is a globally leading software provider for the architecture, engineering and construction (AEC) industry, with 12 brands and 2.1 million users in 142 countries. In keeping with the strategic alignment of Nemetschek Group, Design Data will continue to be led by its current management as an independent brand company in the future. “For our company, the acquisition means accelerated growth into international markets,” said Damon Scaggs, president of Design Data. “For our customers, it allows them to continue to use the leading software in the structural steel detailing industry, while now benefitting from increased integration with Nemetschek’s software solutions throughout the BIM process. SDS/2 seamlessly plugs into Nemetschek’s architectural and design offerings, while providing their customers access to Design Data’s longstanding manufacturing

Technology consulting firm, Microdesk, partnered with the Benjamin Moore Paint Company to launch a new application, The Benjamin Moore Color Suite for Revit. The application, available through Autodesk SEEK, allows designers to easily integrate color into their projects. The Benjamin Moore Color Suite for Revit helps bring designs to life with more accurate depictions of an architect's or designer's project. The tools allow them to choose paint colors, find product details, and integrate these details into their design specifications directly from the application. Other features include comprehensive filtering capabilities to allow designers to sort by variables such as environmental filters, families, color collections, and light reflectance values. "We worked closely with Benjamin Moore to ensure that this new innovative and intuitive tool helps designers using Autodesk SEEK to create models that provide a more accurate representation of the desired final product," said Steve Martin, VP of Application Development, at Microdesk. "The opportunity to partner

Computer Methods Inc. (CMiC) and PlanGrid are pleased to announce a brand new product integration, bringing together PlanGrid's user-friendly field collaboration app for construction professionals with CMiC's enterprise platform for unmatched collaboration and productivity. "Many leading construction firms choose CMiC software to power their projects," says Tracy Young, CEO of PlanGrid. "We're excited that customers will be able to synchronize key project elements, such as Issues, RFIs, and plans between CMiC's powerful project management tools and PlanGrid's user-friendly field collaboration experience." "CMiC is very excited about the opportunity to extend the power of the ERP via this partnership," said Gord Rawlins, president of CMiC. "PlanGrid is highly regarded by many of our customers, and we see this as a very strategic relationship, with unique benefits for our common customers, which should provide them with significant competitive advantages." Mutual customers can expect seamless interoperability between the two products with this integration. All key

Cadence Design Systems, Inc. today announced the availability of the new Cadence® Tensilica® Fusion G3 digital signal processor (DSP), a multi-purpose, high-performance DSP ideal for compute-intensive system-on-chip (SoC) designs. The Tensilica Fusion G3 DSP is exceptionally easy to program and ideal for use in automotive, consumer, internet-of-things (IoT) and industrial applications that combine intensive audio, imaging, communications, radar and embedded DSP computation. “As we continue to broaden our customer base, we are solving a wider range of SoC challenges. The flexibility of the new Tensilica Fusion G3 DSP is perfect for customers running a diverse set of software applications,” stated Steve Roddy, senior group director of product marketing for Tensilica in the IP Group at Cadence. “With advanced development tools including auto-vectorization and extensive library support, the Tensilica Fusion G3 DSP provides our customers with an easy development flow and higher performance out-of-the-box for their next-generation applications. Even those with extensive floating-point

Synopsys, Inc. today announced it will host the 8th annual CodenomiCON USA and showcase its Software Integrity Platform at Black Hat USA 2016.  CodenomiCON is an exclusive cybersecurity thought leadership and networking event organized by Synopsys during Black Hat USA, one of the largest and most distinguished information security conferences in the world. CodenomiCON brings together some of the brightest minds in cybersecurity the evening before the Black Hat Business Hall commences to network, discuss the evolving threat landscape, and explore proactive solutions to secure our connected world. CodenomiCON features presentations and panel discussions from renowned security researchers like Dr. Charlie Miller, Chris Valasek and Billy Rios, as well as thought leaders and practitioners from the public and private sectors. WHEN AND WHERE: CodenomiCON USA 2016 will take place at the House of Blues at Mandalay Bay Resort and Casino, Las Vegas, on Tuesday, August 2 from 5:00 p.m. to 10:00 p.m. Synopsys will be showcasing its Software Integrity Platform and delivering presentations at booth #960

The Experimental Aircraft Association (EAA) will now provide members with free access to Dassault Systèmes SOLIDWORKS Student Design Kit – EAA Maker Edition software, MySolidWorks online video tutorials, the MySolidWorks Manufacturing Network, and related training and design resources. Powered by the Dassault Systèmes 3DExperience Platform, SOLIDWORKS 3D applications help millions of engineers and designers succeed through innovation. SOLIDWORKS delivers an intuitive experience in product design, simulation, publishing, data management, and environmental impact assessment. “Since its humble beginnings in Paul and Audrey’s basement, EAA has inspired, enabled, and defended our members’ right to take a dream sketched on a napkin at the dinner table to first flight and beyond,” said Jack Pelton, EAA CEO/Chairman. “SOLIDWORKS is the industry standard for computer-aided design. Aircraft and kit manufacturers from Cirrus to Zenith are designing today’s aircraft in SOLIDWORKS, and now EAA members can get free access to this powerful tool.” “We are passionate about making product design accessible

Ambiq Micro Inc. and electronics distributor Fujitsu Electronics Inc. today announced they have signed a distribution agreement whereby FEI will market Ambiq Micro Inc.’s Apollo family of ARM Cortex microcontrollers (MCUs) and real-time clocks (RTCs) in Japan, Asia and Europe. With these devices, customers have an ideal solution for battery-powered and other power-sensitive applications, including Internet of Things (IoT) and wearable devices where energy savings translate into much longer battery life and enhanced feature sets. These semiconductor components can also enable much smaller batteries to be used, allowing greater creativity in the design and form factor of the end products that utilize these innovative solutions. The Apollo family of ARM Cortex MCUs and RTCs are the world’s lowest-power devices of their kind, both based on Ambiq’s patented Subthreshold Power Optimized Technology (SPOT™) platform. This innovative technology enables the ability to operate transistors at voltage levels that are far below what