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Premier Farnell today announces that, together with its wholly owned subsidiary Celdis Limited, it has completed the sale of Cadsoft Computer GmbH (“Cadsoft”) and the assets used in connection with the sale of Cadsoft products in the US (together “the Business) to a subsidiary of Autodesk Inc. (“Autodesk”). Cadsoft is a software development business that produces electronics design software that Autodesk will add to its software portfolio. Premier Farnell will continue to distribute the Cadsoft product on behalf of Autodesk. This action follows an operational review, initiated in July 2015, which concluded that Premier Farnell would look to strategically refocus its portfolio and concentrate on its core distribution business, while also reducing its net debt. The net proceeds of the disposal will have the effect of reducing Premier Farnell’s reported net debt position as at 31 January 2016 by approximately 8%. To view the original press release, please click here. Search for

WISeKey, a Swiss based cyber security company, today announced plans to help secure Internet of Things (IoT) devices with SAP. The collaboration aims to allow the integration of WISeKey’s Managed Cryptographic Root of Trust secure IoT Edge Device with devices leveraging SAP HANA® Cloud Platform for the Internet of Things (IoT). The collaboration will provide increased security of IoT devices when connecting to SAP solutions for the IoT. Having sensors connected to everything does not necessarily enable monetization or customer value. Companies and consumers can realize value and enable monetization when they can certify that they are receiving authenticated and secure sensor data, gain insight from it and propose appropriate actions as needed. Carlos Moreira, WISeKey’s CEO noted, “This new collaboration is indicative of WISeKey's broad and continuously expanding cyber security IoT offerings, as we are placing significant emphasis on strategic relationships to increase penetration and boost sales with established

Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro® FPGA synthesis tools. With this agreement, Synopsys continues to be the exclusive provider of logic synthesis technology optimized for the highest quality of results, area and runtime for designers targeting Lattice Field Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs). "The extension of our long-standing relationship with Synopsys gives our customers continued access to a complete, easy-to-use synthesis design flow to implement and validate the rigorous timing and area requirements of next-generation designs," said Choon-Hoe Yeoh, senior director, software quality and strategic partnership at Lattice Semiconductor. "Synopsys' Synplify Pro synthesis software is optimized for the advanced architectural features of Lattice's programmable logic devices, offering designers the customizable and flexible solutions they need to quickly innovate and develop differentiated products for a variety of consumer, communications, industrial, computing and automotive

Rescale is excited to announce a technology collaboration that provides Autodesk Moldflow software users the ability to run their simulations on the Rescale platform. Existing Autodesk Moldflow Insight software customers can access Rescale’s on-demand, high performance computing (HPC) platform in order to benefit from Rescale’s powerful and scalable hardware resources. Rescale provides a highly secure, enterprise solution that enables companies to seamlessly accelerate their simulations with access to customizable, on-demand HPC resources available directly through a web browser. Rescale is a multi-cloud environment with more than 30 data centers globally providing a wide range of hardware offerings, including an ITAR compliant environment and specialty hardware such as InfiniBand and GPUs. Autodesk is a leader in 3D design, engineering and entertainment software, and has developed a comprehensive portfolio of innovative simulation solutions to address the needs of their customers. Through this collaboration, Autodesk is providing an additional way for customers to

Roima has created a new Business Unit and broadened its services into Product Information and Lifecycle Management with the acquisition of Modultek, a Finnish market leader in the field. Modultek is headquartered in Pori, Southwestern Finland and has offices in Vantaa and Eindhoven, The Netherlands. Last year it had a turnover of 3,8 MEUR and employed 40 people. Roima has grown rapidly since 2014. After this merger the Company’s turnover has grown from 3 to 16 MEUR and from 35 employees to almost 150 in a little over two years. This merger was the next logical step in Roima’s and its majority stakeholder Korona Invest’s growth strategy. Roima is targeted to become a large international player capable of serving even the largest of companies in manufacturing and supply chain management. ”We will continue our planned growth”, assures Jukka Ropponen, CEO of Roima. The merger of Roima and Modultek means a wider range and increased

aPriori will be holding its third annual European product cost management conference on June 27-29 at the International Conference Center in Stuttgart, Germany.  The event kicks off on Monday evening, June 27, with a Welcome Reception.  On Tuesday, June 28 and Wednesday, June 29, leading PCM practitioners from the UK, the Nordics, Germany, Switzerland, Austria, France, Italy and Spain will be joining together with Subject Matter Experts from aPriori to discuss new strategies and tactics for improving product profitability. CIMdata’s Stan Przybylinski is amongst the featured speakers. Registration and more info available by clicking here. Search for aPriori on CIMdata.com Search for Stan Przybylinski on CIMdata.com

Materialise NV is pleased to announce the newest version of the Materialise Mimics Innovation Suite. This flexible platform of 3D printing software and services enables engineers and researchers to achieve rapid, reliable image segmentation and accurate 3D reconstruction using validated software. Users can now segment medical images faster with new intuitive tools such as a live 3D Mask Preview. Robust algorithms in the finite element analysis mesh preparation workflow allow the user to obtain high-quality meshes with more ease, even in challenging cases. Segmenting anatomy from a CT or MRI scan is the most labor-intensive part in the process of creating a patient-specific device. That’s why the new version of the Materialise Mimics Innovation Suite will enable users to perform segmentations faster through a combination of smarter editing tools and a live 3D Preview. The Split Tool automatically splits two adjacent tissues by marking the two tissues in a few slices.

COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design software, today announced the latest release of the COMSOL Multiphysics® and COMSOL Server™ simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics®, COMSOL Server™, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL® software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.  Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation density are shown. This COMSOL® model is used to design microphones and speakers used in consumer products, such as, smartphones, tablets, and laptops. It consists of 2.5 million degrees of freedom and required 14 GB of RAM to solve. Previsously 120 GB were needed using a direct solver. Powerful New Tools for

Mastercam 2017 brings a new suite of programming tools focused on delivering speed, automation, and efficiency for all machining jobs.  Mastercam 2017 introduces a more efficient workflow, improved usability, Dynamic Motion improvements, and so much more. Mastercam 2017 features a new ribbon interface and makes it easier to find the functions you need to complete your tasks. “Many of our more powerful tools were underused because customers did not know where to find them,” says CNC Software President, Meghan West. “We spent a lot of time with users determining the best way to simplify this, and the response has been overwhelmingly positive.” The ribbon tabs group similar functions and displays them in order from simple to more complex. Each tab relates to a type of activity, from creating wireframe geometry to generating toolpaths. Editing functions are on the same tab as creation functions so you have all the tools you

Mentor Graphics Corp. today announced that MagnaChip Semiconductor Corp., a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications, has selected the Mentor® Analog FastSPICE™ (AFS™) Platform for circuit verification and device noise analysis of their analog and mixed-signal designs including display drivers, power management ICs, and PLLs. "We needed to reduce our long circuit simulation time and include device noise analysis in our analog and mixed-signal circuit verification flow," said Dr. Kihyun Kim, senior manager, Design Technology at MagnaChip. "We selected the AFS Platform because it demonstrated SPICE accurate results 2.5x-4x faster than our existing parallel SPICE simulator in multiple analog circuits." The AFS Platform provides the world’s fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits. Foundry certified by the world’s leading foundries and IDMs, the AFS Platform delivers nanometer SPICE accuracy 5x-10x faster than traditional SPICE and 2x-6x faster than