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Mentor Graphics Corporation today announced a design, layout, and verification solution to support design applications for TSMC’s Integrated Fan-Out (InFO) wafer-level packaging technology. The solution comprises the Calibre® nmDRC physical verification product, the Calibre RVE™ results viewing platform, and the Xpedition® Package Integrator flow. It enables mutual customers to deploy the unique fan-out layer structures and interconnects in the TSMC InFO technology, targeting cost-sensitive applications such as mobile and consumer products. The interplay between today’s advanced system-on-chip (SoC) technologies and packaging requirements is driving the need for co-validation between integrated circuit (IC) and package design environments. The Xpedition Package Integrator flow will be Mentor’s platform to support TSMC’s unique TSMC InFO design requirements, including integration with other Mentor solutions the first being Calibre nmDRC and Calibre RVE. The Mentor® solution allows IC and package designers to view and cross-probe results from the Calibre nmDRC tool directly inside the Xpedition Package Integrator flow

Plastic Ingenuity, a leader in innovative packaging solutions from proposal to finished product, is proud to debut a groundbreaking new technology to cut costs and trial-and-error testing for packaging designers. Perfect Shelf, a 3D experience solution from Dassault Systèmes, bridges the gap between retailers, consumers, and product design engineers while a design is being developed, far before any real-world trials are needed. The digital modeling system creates highly realistic aisle views with shelves, fixtures, products, lighting, and promotional materials, all supported with product performance and consumer trend information. Product shelving quality affects brand awareness, sales margins, and overall product revenue. A key factor to any product’s overall success, packaging choices directly influence the consumer shopping experience. Perfect Shelf software simulates the subtleties of a package’s unique design in context, allowing for better informed strategy and decision making, and ultimately more successful work. Plastic Ingenuity’s team of in-house packaging design engineers combine deep industry

ILEXSOFT has today announced HighDesign 2016, the latest version of its powerful, full-featured CAD software exclusively for Mac OS X. The new CAD system update delivers native 64-bit support, which provides a substantial speed boost, in all areas of the software, says the company. Additionally, HighDesign 2016 now features associative dimensioning, compound walls, enhanced input and output with improved support for DWG files, GIF, and PNG with alpha channel support and more. All of this is packaged within a modern Apple Mac user interface that emphasizes the user experience (UX) and maximum productivity. “With the support for the 64-bit architecture and many new improvements, HighDesign 2016 is a very important update as it focuses on the core drafting features: speed, workflow, and interoperability, as well as adding some tools that had been requested by our users in the fields of architecture and mechanical design,” said Andrea Suraci, co-founder of Ilexsoft. A list of many

For many years, IntegrityWare Inc. / nPower Software has helped 3D engineers and designers improve productivity through its popular, award winning plugins ( Power Surfacing for SolidWorks, Power Translators for 3ds Max / Maya / MODO, Power SubD-NURBS for 3ds Max / MODO, Power NURBS for 3ds Max, Power Solids for Rhino, etc.) for 3ds Max, Maya, MODO, Rhino, and SolidWorks. With its new standalone architecture, Cyborg3D brings these popular plugins, with their advanced features, to virtually the entire CAD / 3D modeling community. Cyborg3D is an exciting new standalone 3D modeling software platform that uniquely combines organic surface modeling (subdivision surfaces) with precise, parametric CAD (NURBS solids & surfaces) modeling. Cyborg3D is built using modern software architecture techniques (Object Oriented Modeling, C#, Managed Code, multi-threaded parallel processing, OpenGL, etc.). Its multi-threaded architecture is very well suited for dealing with large assemblies and compute intensive functionality. And its modern architecture makes

Razorleaf Corporation today announces it is releasing Clover integration connectors for ARAS Innovator to SAP, NetSuite and Salesforce.  Clover will enable the passing of business, product, and project data such as customer and supplier information, items and bills of materials, and project accounting and services data to improve profitability and enable on-time delivery of projects and products across the organization.  Clover goes beyond typical middleware and ensures that contextual business processes are aligned when passing data to improve process efficiency and data integrity.  "Connecting business processes between ERP, CRM, and Project Management with PLM helps align resources more effectively, enables better collaboration and saves our customers time and money." stated Eric Doubell, CEO of Razorleaf Corporation.  "ARAS is a growing player in the PLM market, and we can help ARAS customers strategically plan and implement their PLM investment rapidly.  If they are using SAP, NetSuite or Salesforce, we can assist with getting

 PDF Key takeaways: IBM’s executives made it clear that IBM is “all-in” on the cloud and mobile, the foci of the event, and they continue to make investments and acquisitions to build out their capabilities IBM has many strengths dispersed across several groups in PLM for smart, connected products, and customer cases are emerging that highlight their breadth of capabilities One thing IBM brings to the table that the traditional PLM solution providers do not is a long history and significant investments in analytics and cognitive computing Billed as “The Premier Cloud & Mobile Conference,” IBM InterConnect 2016 is a sprawling event that had the Mandalay Bay Conference Center bursting at the seams with over 25,000 people from customers, partners, and IBM. IBM created this event last year by merging three separate events: Pulse (focused on their Tivoli offerings), Innovate (Rational), and Impact (WebSphere). All of these product offerings, and more, were on the exhibit

 PDF  PDF (Japanese) Key takeaways: Few PLM implementations achieve their original goals and often end up as PDM silos that struggle to evolve as business needs change PLM is usually not enabled with a single technology and no solution provider has a complete end-to-end, top-to-bottom solution that fully enables an organization’s end-to-end PLM needs Enabling PLM requires a platform that is capable of filling in data and process gaps to connect system silos into a holistic solution that meets current as well as future business requirements An organization’s PLM platform should be easily configurable to support future requirements without exorbitant cost and effort Aras Innovator case studies show its ability to fill in PLM process gaps and tie disparate product definition silos together, and according to their clients, has the platform capabilities needed to help them achieve their PLM vision CIMdata has been in PLM since before the acronym PLM emerged. Over the years we have seen product

Popular education program will take place at the Mecure Hotel at Amsterdam Airport from June 6-10. ANN ARBOR, Michigan, 15 March, 2016—CIMdata, Inc., the leading global product lifecycle management (PLM) strategic consulting and research firm announces that it will bring its highly acclaimed PLM Certificate Program to Amsterdam, The Netherlands from June 6-10, 2016. The program is recognized as the PLM industry’s most comprehensive solution-agnostic education offering. The program, which includes several options that have been designed to accommodate the needs of those involved in the industry at any level, prepares PLM professionals to successfully address the challenges commonly faced in PLM strategy development and implementation. The assessment-based certificate program includes a personalized classroom experience, individual and team-based exercises, and individual evaluations of achievement. The program is facilitated by a team of CIMdata experts. Upon successful completion of the program, participants receive a CIMdata PLM Certificate and are invited to join CIMdata’s

Periscope™, a McKinsey Solution, focusing on price, promotion and assortment optimization, today announced that it was included in Forrester Research, Inc.’s “Reinvent Product Innovation To Revive Your Brand” report, by George Lawrie, published on January 29, 2016. Aimed at Application Design & Development (AD&D) professionals, the report provides insights on how they should be using big data insight and applications to support the essential product innovation for retailers and consumer brands. Forrester states that PLM always used to be product-focused, but modern applications put customer insight at the heart of the PLM process. In addition to the guidelines offered, Forrester also includes map market characteristics to drive compelling product innovation. The report notes, “Brands use platforms like Periscope, a McKinsey Solution, to understand category performance and consumer brand loyalty in online channels like Amazon and retailers’ direct eCommerce sites. They feed this insight in the form of specifications to PLM to

Synopsys, Inc. today announced a broad IP portfolio for TSMC's 16-nanometer FinFET Compact (16FFC) process for reliable integration into cost-sensitive, ultra-low power applications including mobile, Internet of Things (IoT), digital home and automotive. Synopsys DesignWare® IP on the 16FFC process enables designers to accelerate development of SoCs that incorporate logic libraries, embedded memories, embedded test and repair, USB 3.1/3.0/2.0, USB-C 3.1/DisplayPort 1.3, DDR4/3, LPDDR4, PCI Express® 4.0/3.1/2.1, SATA 6G, HDMI 2.0, MIPI M-PHY and D-PHY and data converter IP. "The 16FFC process reduces SoC power consumption by more than 50 percent (at the same frequency) compared to the 28HPM process and optimizes die area to lower system cost.  Synopsys' DesignWare IP portfolio for the TSMC 16FFC process helps our mutual customers achieve their SoC performance, power and area targets," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "Synopsys continues to provide proven IP solutions that support TSMC's latest process