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EY and EMC have announced a formal strategic partnership over business technology services, building on a long-standing relationship between the two firms. The partnership will offer a number of different services to clients ranging from enterprise mobility management, hybrid cloud enablement, governance risk & compliance and cyber security. “Working together as an integrated team, combining advisory services and innovative products, we will be able to connect on both existing and future initiatives to help our clients maximize their technology investments and drive better  business outcomes,” said Mark Weinberger, Chairman and CEO at EY. “The alliance will further expand EY’s digital capabilities and range of services offered to clients.” Addressing growing trends in the industry, security will form one of the central pillars of the partnership. One of the first offerings from the team is Isolated Recovery, an offering which protects company data from cyber-attacks. The team claims a combination of

CIMdata, Inc., the leading global PLM strategic management consulting and research firm, announces that Sandeep Waghchoure, Director of the Business Transformation Program Office at Dell, Inc. (Dell), will make a presentation at PLM Road Map™ for the High Tech and Medical Device Industries on the topic of empowering people to innovate. In his presentation, “Innovating Organizational Change Management with Enterprise Deployments,” Sandeep Waghchoure will share information about a complex cross-functional strategic initiative that was undertaken at Dell leveraging 4 Disciplines of Execution (owned by Franklin Covey) methodology. In this case study style presentation, he will highlight how a breakthrough idea was propagated through a large organization in record time, aligning over 14 different functional groups and over 5,000 people—uniting them in a singular mission to improve Dell’s on-time delivery experience to its customers. The presentation will share some key lessons learned which can be applied across a variety of

CIMdata, Inc., the leading global PLM strategic management consulting and research firm, announces that Dr. Suna Polat, Director, Collaborative Innovation & Social Product Development Consulting Practice, will lead a special session at the Innovation & Growth Leadership Summit, which takes place on April 25-26, in Chicago, Illinois. Sustaining profitable business growth is difficult for established enterprises in today’s networked economy. Good ideas can emerge from anywhere, and the next big competitor could even be a start-up. Businesses are aware, and are desperately seeking out new strategies, tools, and technologies to cope with the accelerated innovation environment that has been created due to rapid advancements in technology. Many are also aware that they suffer from innovation inefficiencies due to disjointed processes, tools, data, and organizational silos, but are hesitant to try new approaches or invest in new solutions. Dr. Polat’s session, “Strategies, and Solutions to Overcome Inefficiencies in Enterprise Innovation

It's always risky to drag metaphors from one realm into another, but sometimes the urge is irresistible.  Take the matter of technology obsolescence, traditionally the Third Rail for information technology (IT) management. Third rails have delivered electric power to subways for over a century, and they are dangerous.   The usefulness of this particular metaphor in obsolescence of data management solutions and maintaining legacy solutions is the voltage in the third rails.   If a PLM solution becomes obsolete, the complexity in disconnecting and removing such legacy solutions can be as risky for the business as touching a third rail. Because so many data management applications in aerospace and defense companies are tightly linked, the choice to upgrade any one of them can raise dozens of issues—issues that busy managers have little time for.  This is why such obsolescence decisions are often no decision: “If it's not broken, don't fix it.”  

Presentation will share details about how a strategic initiative to improve Dell’s on-time delivery experience was implemented. Ann Arbor, Michigan, 17 March 2016—CIMdata, Inc., the leading global PLM strategic management consulting and research firm announces that Sandeep Waghchoure, Director of the Business Transformation Program Office at Dell, Inc. (Dell), will make a presentation at PLM Road Map™ for the High Tech and Medical Device Industries on the topic of empowering people to innovate. In his presentation, “Innovating Organizational Change Management with Enterprise Deployments,” Sandeep Waghchoure will share information about a complex cross-functional strategic initiative that was undertaken at Dell leveraging 4 Disciplines of Execution (owned by Franklin Covey) methodology. In this case study style presentation, he will highlight how a breakthrough idea was propagated through a large organization in record time, aligning over 14 different functional groups and over 5,000 people—uniting them in a singular mission to improve Dell’s on-time delivery experience

Event will take place on April 25-25, 2016, in Chicago Illinois. ANN ARBOR, Michigan, 17 March 2016—CIMdata, Inc., the leading global PLM strategic management consulting and research firm announces that Dr. Suna Polat, Director, Collaborative Innovation & Social Product Development Consulting Practice, will lead a special session at the Innovation & Growth Leadership Summit, which takes place on April 25-26, in Chicago, Illinois. Sustaining profitable business growth is difficult for established enterprises in today’s networked economy. Good ideas can emerge from anywhere, and the next big competitor could even be a start-up. Businesses are aware, and are desperately seeking out new strategies, tools, and technologies to cope with the accelerated innovation environment that has been created due to rapid advancements in technology. Many are also aware that they suffer from innovation inefficiencies due to disjointed processes, tools, data, and organizational silos, but are hesitant to try new approaches or invest in new solutions. Dr. Polat’s

Trimble introduced today three new software versions of its Building Information Modeling (BIM) and analysis & design solutions for engineering and construction—Tekla Structures 2016, Tekla Structural Designer 2016 and Tekla Tedds 2016. The solutions provide enhanced collaboration and workflow efficiency for structural steel and precast concrete designers, detailers and fabricators, concrete contractors, general contractors and structural engineers. Tekla Structures, the most advanced BIM software, makes accurate, constructible modeling of any steel or concrete structure possible. The new software version provides even more efficient modeling, allowing increased productivity by avoiding costly errors more easily in the fabrication and construction phases. The software is available and supported in 17 languages; Korean is also now available with this release. The new Tekla Structures user interface offers a smooth user experience and shorter learning curve with several features that make modeling easier and accelerate the design process. The customizable menus and easily recognizable icons allow users to

SAP SE today announced the Internet of Things (IoT) foundation bundle for SAP HANA, which features device connectivity management capability from Vodafone and is designed to help customers gain returns on their IoT investments quicker. The announcement was made at CeBIT 2016 being held March 14–18 in Hannover, Germany. SAP and Vodafone have signed an agreement to collaborate on customer projects in all markets that they jointly serve. This collaboration aims to allow enterprises to connect and manage devices using Vodafone’s IoT connectivity platform and to collect and move data from the devices into the SAP HANA platform to support predictive maintenance as well as other use cases. The technical certification of the integration between Vodafone and SAP HANA is supported by the new IoT foundation from SAP. The IoT foundation for SAP HANA integrates device connectivity management from Vodafone to help aggregate data from SIM-based IoT devices’ status, usage, rate plans and

CADLearning, a learning partner in the Autodesk community, has earned the status of Autodesk Authorized Publisher in the newly revamped publisher program. In the updated program, the Authorized Publisher Program (APP) designation has been awarded to a very select and small number of publishers in the Autodesk space. The designation means that CADLearning resources are now syndicated through the Autodesk Knowledge Network (AKN) and In-Product Help, making select content available at knowledge.autodesk.com and to Autodesk customers and trial users within select Autodesk products. “Having worked with Autodesk as a publisher for more than a decade, we’re thrilled to be part of the newly revamped program,” says Matt Murphy, Senior Director of Product Strategy, CADLearning. “Like so many of our customers, we’re glad to see Autodesk focus their efforts on delivering quality content to their end-users and making it readily available through AKN and in-application.” CADLearning offers a diverse library of resources, including

Manufacturers of advanced electronic products – ranging from mobile and networking appliances to futuristic Internet of Things devices – will become more powerful, smaller and more energy efficient thanks to new advances from TSMC and ANSYS. TSMC's certification of ANSYS solutions for its 10nm FinFET process technology, enables customers to deliver their innovative and reliable products to market faster while minimizing design costs and risk. TSMC also certified ANSYS solutions for the latest 7nm design rule manual and SPICE model for early design starts. Additionally, ANSYS solutions are enabled for TSMC's Integrated Fanout (InFO), the advanced wafer-level packaging technology for three-dimensional integrated circuits. Today's cutting-edge electronic products demand minimal power yet still be reliable under a variety of conditions while still being affordable. These requirements place demands on the chip as well as a package, board and system. The TSMC certification provides users with a proven design process for advanced System on