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PROCAD Software (www.procad.com) announces the release of Advantage BOM for industrial pipe fabricatiors and EPCs Over the past four years since the release of SPOOLCAD, PROCAD worked closely with industrial pipe fabricators to advance their drawing and material management capabilities. With the addition of Advantage BOM, pipe fabricators will have an excellent tool to generate global bills of material (BOMs) using customer supplied PCF or IDF files extracted from 3D models. This capability facilitates pipe fabricators to confidently submit project bids backed up by accurate piping material lists. With a few simple clicks, Advantage BOM generates BOMs in Excel™ spreadsheet format enabling estimators to tally accurate material costs in the project bid. It also eliminates any errors due to manual material transcription from printed spool drawings. Advantage BOM expands PROCAD’s offering to industrial pipe fabricators by enhancing workplace productivity to complement its popular SPOOLCAD software. Zaia Abraham, president of PROCAD Software notes, “Over the past few years, our industrial

PTC today announced PTC Windchill® 11 product lifecycle management software that achieves new levels of connectivity and process improvement across the entire, closed-loop product lifecycle. PTC Windchill is used by more than 1.5 million users around the world to manage and optimize their product development and lifecycle processes. With this major new release, PTC now offers a PLM system that bridges the digital world and the physical world. Customers benefit through an improved systems-engineering process that is informed by real world usage and quality data from smart connected products. This benefit is extended through broad and easy access to the definitive source of truth of product information enabling richer collaboration and faster decision making. The data stream from smart, connected products opens up new worlds of possibility: driving new business models, creating new service opportunities and improving design decisions. But to fully capitalize on this potential, companies need a product lifecycle

Comet Solutions, Inc. announces the availability of Cloud-based SimApps. By capturing and embedding the experience of Senior Analysts, SimApps allow simulations to be run more easily, consistently, and safely. Comet SimApps are delivering measurable gains in productivity, cost savings, quality and innovation for leading aerospace, automotive and industrial companies.   Comet is broadening access by offering its SimApps via the Cloud. This not only makes CAE expertise accessible to all manufacturers; but also it combines high performance computing resources with SimApps for a very powerful, scalable simulation solution. Today Comet announces it is working with Ohio Supercomputer Center (OSC) via the OSC AweSim initiative, its founding partners including Kinetic Vision, and other engineering service providers to make SimApps available to its customers. The Ohio Supercomputer Center (OSC) AweSim program is the world's first comprehensive simulation-driven design solution for small to medium-sized businesses. By delivering unique manufacturing-domain expertise, sophisticated simulation software, powerful computing,

Cadence Design Systems today unveiled the Cadence Palladium Z1 enterprise emulation platform, the industry’s first datacenter-class emulation system, delivering up to 5X greater emulation throughput than the previous generation, with an average 2.5X greater workload efficiency than the closest competitor. With enterprise-level reliability and scalability, the Palladium Z1 platform executes up to 2304 parallel jobs and scales up to 9.2 billion gates, addressing the growing market requirement for emulation technology that can be efficiently utilized across global design teams to verify increasingly complex systems-on-chip (SoCs).  “The design and verification of our very complex devices requires us to employ sophisticated tools such as hardware emulation for fast and reliable system development,” said Narenda Konda, director of engineering at NVIDIA. “Due to the Palladium Z1 platform's capacity to handle our billion gate-class designs and its highly sophisticated debug and advanced multiuser capabilities, all in a small form factor, we will be able to

Mentor Graphics Corp. today announced that Terminus Technology Inc., a leading provider of custom analog, RF, and I/O IP based in Taiwan, has selected the Mentor® Analog FastSPICE™ (AFS™) Platform for verification and device noise analysis of its data converter, power management, Wireless LAN, high-speed I/O and PLL circuits. "We have stringent circuit verification and noise analysis requirements for our custom analog, RF, and high-speed I/O circuits," said Mr. Yu-Kuo Chen, senior manager of R&D of Terminus Technology. "We selected the AFS Platform because it fully addresses our requirements for circuit verification accuracy, performance, and capacity. AFS device noise analysis delivers silicon-accurate PLL noise analysis. In the case of a SerDes circuit verification, AFS delivered nanometer SPICE accuracy 5x faster than our existing parallel SPICE simulator." The Analog FastSPICE Platform (AFS) provides the world's fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits. Foundry certified to 10nm, the AFS Platform delivers

Rand Worldwide today announced that six industry experts from its IMAGINiT Technologies division will lead 10 sessions at Autodesk University 2015. On the tradeshow floor, at booth #319, IMAGINiT will demonstrate the new releases of IMAGINiT’s Scan to BIM, IMAGINiT Clarity 2016.1 and Clarity Owner Data Portal software. Autodesk University takes place December 1-3, 2015 at the Venetian Resort and Casino in Las Vegas, NV.  “Each year our presence at Autodesk University demonstrates our passion for connecting with customers, showcasing our latest products and services, and educating attendees in the classes we lead, all with the common goal of advancing the design experience for Autodesk users,” says Tim Johnson, senior vice president, IMAGINiT Technologies. “Our expert led sessions are always popular because they delve into the real business challenges that companies are having today. If you want a thoughtful, strategic discussion on a particular issue or a better understanding of the 2016 business trends, come

Fujitsu has kicked off Fujitsu Forum, its annual customer and partner event in Munich, Germany, by expanding on its vision for digitalising enterprises, launching a cloud platform called MetaArc to support capabilities around big data, mobility and the internet of things (IoT), and acquired French application delivery software house UShareSoft. Billed by Fujitsu as a digital enablement platform to help customers thrive in the digital world, MetaArc will encompass the technologies, tools, services and partnerships needed to establish a strategic cloud foundation, whether that is public, private or hybrid, said the supplier. It will support the delivery of more innovative, line-of-business driven IT projects, referred to by Fujitsu as fast IT, as well as the modernisation of what Fujitsu terms robust IT, meaning on-premise systems that are still core, but increasingly elderly. Fujitsu senior vice-president and head of managed infrastructure services and digital business platform, global delivery Joel O’Halloran said the MetaArc platform would let customers

PTC® and Bosch Software Innovations today announced a technology alliance to facilitate the integration of the ThingWorx® Platform and the Bosch IoT Suite. The new Bosch IoT Suite M2M Connector for ThingWorx allows for technical interplay between the two platforms and is now available on the ThingWorx Marketplace. The technology stack enables IoT developers to connect and control heterogeneous devices and systems, cost-effectively and rapidly develop IoT applications for complex IT landscapes, and easily and quickly adjust IoT solutions to the specific needs of individual companies and sectors. PTC and Bosch Software Innovations successfully tested the integrated technology stack in the Industrial Internet Consortium Track & Trace Testbed by wirelessly connecting tightening tools to operate seamlessly together on the factory floor. The Track & Trace application permits the monitoring of the status of all devices on the fly. The data collected is used to optimize production processes and tool maintenance. Irregularities or impending failures are detected immediately

Panasas®, the leader in high-performance hybrid scale-out network-attached storage (NAS) for industry and research, today announced that CD-adapco, the largest privately held computational fluid dynamics (CFD) provider of computer-aided engineering (CAE) software, has deployed more than one petabyte of Panasas ActiveStor® storage to support the high-performance demands of CFD simulations. CD-adapco is pioneering an approach called Multidisciplinary Design Exploration (MDX) that uses engineering data from simulation results to improve a product through multiple design iterations. Using software models that mimic the behavior of real-world objects results in higher quality end products that better fulfill customer expectations. CD-adapco uses MDX to maximize the real-life performance of products in the aerospace, automotive, energy, life sciences, and oil and gas industries. MDX relies on sophisticated software to drive the simulation through a complete range of operating scenarios, including geometrical configurations and different operating points. This approach helps manufacturers gain a complete understanding of the product’s performance across

Dassault Systèmes announced the launch of three industry solution experiences for life sciences, focused on BioPharma.  “ONE Lab,” “Designed to Cure” and “Made to Cure for BioPharma” complement the existing “License to Cure for BioPharma.”  Pharmaceutical and biotechnology companies now have access to an end-to-end, holistic approach to digitally transform the complex processes behind the design, development and production of novel therapeutics. Today’s life sciences industry is plagued by challenges at every stage of therapeutics development including cost pressures and long cycle times that leave little room for innovation.  Research and development expenditures exceed those of the aerospace and automotive industries combined, yet the success rate of new drug development from its initial concept phase is less than one percent.  This risk is compounded by patent expirations, global competition, strict regulatory requirements, a deluge of scientific data and operations - both within the enterprise and with outsourced partners - working in silos.  Dassault