CIMdata 博客

Razorleaf Corporation announced a strategic service partnership with Ansys for the Minerva platform powered by Aras, a centralized simulation knowledge management application. This platform secures critical simulation data and provides process and decision support to simulation teams across geographies and functional silos. Ansys Minerva incorporates advanced technologies for improving workflows and enhancing simulation process and data management (SPDM).

Razorleaf will provide consulting, integration, and implementation services to address the complexities of PLM interoperability and data management, enabling customers to connect simulation capabilities throughout the engineering product lifecycle. Razorleaf will help Ansys Minerva users improve traceability and streamline collaboration...

MakerBot a subsidiary of Stratasys Ltd. released its latest report, “Trends in 3D Printing and STEAM Education.” Based on over 1,000 responses from education professionals around the world, the report illustrates the use of 3D printing in education and how it is applied across grade levels among respondents.

Key findings from the report reveal that 63% of respondents use 3D printing to better prepare their students for the workforce, but they want more than just a 3D printer in order to be successful—respondents want a full ecosystem of...

Tech Soft 3D announces that it has acquired Ceetron AS, experts in developing 3D visualization technology for the computer-aided engineering (CAE) community.  This acquisition is in line with the company’s plans to fuel growth by investing in product development, scaling the company’s global reach and increasing its product offerings through acquisitions.

Tech Soft makes HOOPS and other CAD/CAM/CAE/PLMish toolkits, which the company says are used by over 500 applications –data exchange, visualization, AR/VR, publishing CAD or CAE data to PDF and more– that run on “hundreds of millions of computers worldwide”.

Ceetron also makes toolkits, but...

Cadence Design Systems, Inc. expanded its system analysis product line with the introduction of the Cadence® Clarity™ 3D Transient Solver, a system-level simulation solution that solves electromagnetic interference (EMI) system design issues up to 10X faster than legacy 3D field solvers and offers unbounded capacity. Built on Cadence’s massively parallel matrix solver technology, the Clarity 3D Transient Solver handles workload levels that previously required time-consuming and expensive anechoic test chambers to test prototypes for electromagnetic compatibility (EMC) compliance. The new solver is capable of simulating large designs that until now have been impractical or unable to be solved, reducing respins and accelerating time...

Autodesk, Inc. announced the international expansion of BuildingConnected, a construction management solution that centralizes and streamlines the bidding process, and encompasses the Autodesk Construction Cloud builders network, a crowdsourced network of construction professionals. Owners and general contractors use BuildingConnected to discover trade partners and identify the right subcontractor for the job, and to solicit and compare bids – also referred to as tenders – from one central location. With its international expansion, the BuildingConnected solution is now available in the United Kingdom, Ireland,