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Accenture reported financial results for the fourth quarter and full fiscal year ended August 31, 2025. Click to Download To view the original press release, please click here. Search for Accenture on CIMdata.com

Honeywell will issue its third quarter financial results before the opening of the Nasdaq Stock Market on Thursday, October 23. The company will also hold a conference call at 8:30 a.m. EDT. Presentation Materials / Webcast Details A real-time audio webcast of the presentation can be accessed at https://www.honeywell.com/investor, where related materials will be posted prior to the presentation and a replay of the webcast will be available for 30 days following the presentation. To view the original press release, please click here. Search for Honeywell on CIMdata.com

Planera, the leader in visual CPM-based construction scheduling, announced that AMLI Residential, a leading multifamily developer, general contractor, and property operator, has selected Planera to streamline scheduling and boost collaboration across its construction projects. Challenge: Outdated, Siloed Scheduling ToolsBefore adopting Planera, AMLI relied primarily on Microsoft Project to manage its scheduling processes. While effective for basic sequencing, the tool created silos, limited collaboration, and required cumbersome manual updates. Field teams often reverted to Excel to generate weekly three-week look-aheads, which meant lost time and duplication of effort. AMLI needed a modern, cloud-based solution that could unify office and field teams, simplify adoption, and deliver real-time transparency across projects. Solution: Deploying Planera on the Littleton ProjectIn early 2025, AMLI launched Planera on its 310-unit Littleton, Colorado development—a wrap-style community built around a precast garage, including podium retail and five stories of wood-framed residential units. The Littleton team, known for its tech-forward approach, embraced Planera

Merck and Siemens have signed a new Memorandum of Understanding (MoU), extending their strategic partnership to accelerate digital transformation in the life science industry by connecting digital and physical products. The agreement focuses on delivering integrated software solutions, systems and consumables that harness automation, data and AI to connect drug discovery, development, and manufacturing. This agreement marks the first joint use of technology acquired by Siemens as part of the acquisition of Dotmatics that was completed in July 2025. “Through this collaboration with Siemens, we are opening new possibilities for scientists to move faster from an idea in the lab to a therapy for patients,” said Jean-Charles Wirth, Member of the Executive Board and CEO Life Science, Merck. “By combining our strengths, we aim to change how science advances, unlocking new ways to accelerate scientific progress.” “We are partnering with Merck to give scientists around the world the instruments to speed up

Centric Software® is proud to share the success story of Wild Foods, a fast-growing Chilean healthy food brand that has embraced digital transformation to fuel international expansion. Centric Software provides the most innovative enterprise solutions to plan, formulate, develop, procure, manufacture and sell consumer goods products in food & beverage, grocery, fashion and multi-category retail to achieve strategic and operational digital transformation goals. Wild Foods has been dedicated to reshaping the food industry since its inception by offering real, healthy food. Currently boasting a team of 120 employees, with offices in Chile and Mexico, products are also sold in Colombia, Brazil, Peru and the United States. The company is dedicated to inspiring healthier lifestyles and promoting transparency in its offerings. The mission is clear: to deliver high-quality, reliable alternatives to conventional, mass-market food products. Rapid company growth brought on significant challenges. Wild Foods struggled with inconsistent nutritional data management, scaling internationally and labor-intensive

Cadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications. Cadence and TSMC have collaborated closely across the spectrum from AI-driven EDA to 3D-ICs to IP and photonics, enabling the world’s most advanced semiconductors. Cadence and TSMC have worked together on design infrastructure for advanced process nodes, including TSMC N3, N2 and A16™, using Cadence® Innovus™ Implementation System, Quantus™ Extraction Solution and Quantus Field Solver, Tempus™ Timing Solution and ECO Option, Pegasus™ Verification System, Liberate™ Characterization Portfolio, Voltus™ IC Power Integrity Solution, Genus™ Synthesis Solution, Virtuoso® Studio and Spectre® Simulation Platform. Cadence AI design flows for chip and 3D-IC are now available for TSMC’s advanced N3, N2 and A16™ process technologies, as well as for new features in TSMC 3DFabric. Additionally, Cadence is collaborating with TSMC on EDA flow development for TSMC’s A14 process, with its first PDK to

Cyncly, the world’s leading global provider of software and content solutions that help make amazing spaces for living, announced the release of On-Demand Content in Worksheet, a major update that simplifies catalog updates for both manufacturers and dealers. With this update, Worksheet users can now access catalog updates directly within their workflow—faster, smarter, and without interruptions. “The Cyncly Worksheet 2025 On-Demand Software Updates and Catalog Updates are a major step forward in efficiency and accuracy for both manufacturers and designers,” said Sarah Girard, Cyncly Commercial Product Manager. “We hear from our customers all the time that real-time catalog information is essential to their business. This new system gives manufacturers more speed, control, and flexibility than ever before, while making catalog updates seamless and stress-free for our dealers.” This release marks a significant step in modernizing the Worksheet experience by eliminating the need for manual downloads or separate tools like the Content Downloader. Instead,

Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard.. Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.  ASE’s VIPack is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. As ASE’s advanced packaging platform, it is designed to enable vertically integrated package solutions and represents its next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple

At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies. Mutual customers can now leverage these advancements, which include substantial innovations in artificial intelligence (AI), 3D IC design, and advanced packaging, to develop compelling and highly differentiated new products. “Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens’ leading IC and advanced packaging solutions with TSMC’s state-of-the-art process technologies, we enable our mutual customers to achieve new levels of design innovation and faster time-to-market, reshaping the future of semiconductor development.” “The collaboration with Siemens illustrates our persistent focus to enable our shared customers for the latest and most advanced process and packaging technologies,” said Aveek Sarkar, Director

Synopsys, Inc. announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company's partnership with TSMC on design enablement has resulted in multiple customer tape-outs. Building on Synopsys' continued collaboration with TSMC is the availability of certified digital and analog flows, along with the enabled Synopsys.ai™ on TSMC's N2P and A16™ processes using TSMC NanoFlex™ architecture. In addition, Synopsys provides robust automotive IP solutions for TSMC N5A and N3A processes and best-in-class Interface and Foundation IP solutions, delivering highest level of safety, security and reliability while enabling maximum performance with the lowest power for advanced chips.  "Our close collaboration with TSMC continues to empower engineering teams to achieve successful tape outs on the industry's most advanced