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Intergraph® Process, Power & Marine announces the availability of Isogen® Piping Component File (PCF) reference documentation for free download and use. Documentation of the widely used Isogen PCF format is now available for complimentary download at https://ig-prod.entitlenow.com/DownloadCenter/?product=isogen_pcf. Data exchange is needed at many points during the design, fabrication, construction and operation of piping systems and Intergraph recognizes that the PCF plays an important role. Isogen is the industry’s most widely used software for automated piping isometric production. The PCF format was originally developed as an easy way to drive Isogen – the syntax is simple, English language style and is not order dependent, which means it is straightforward to create from most piping design software. This simplicity and widespread support means the PCF format has encapsulated a multitude of industry requirements to serve the needs for practical piping data exchange. In addition to its use with many piping design software applications, SmartPlant®

Elecosoft Consultec announced today that it has chosen the C3D geometric kernel from C3D Labs for its Staircon software http://www.staircon.com/. Staircon is the company’s CAD/CAM application for the timber staircase industry. The software provides the best possible support for the simplified, cost-effective production of stairs made of timber – all the way from sales through to manufacturing. By connecting the software to CAM systems, complex handrails and other stair parts are milled to perfection. To meet the growing demand from users for more flexible design options, Elecosoft Consultec decided to replace its in-house geometry library with a more robust solid modeling kernel. The company evaluated a number of kernels before deciding on C3D from C3D Labs. The top reasons for choosing C3D was its robustness, flexible licensing model, and good support. “By integrating C3D in our applications, we now deliver robust, high-level functions to our customers in a shorter time than ever before,”

Alain de Rouvray, ESI Group’s Chairman and CEO states: ‘PRESTO’ software from AMOEBA offers the next generation of capabilities for cooling simulation and design optimization, a major concerns for the electronics industry. When integrated into ESI’s end-to-end Virtual Prototyping solutions, PRESTO will represent a major potential for disruptive innovation, addressing the needs of a large category of users presently hindered by the silo approach of the software tools available on the market. Interacting within ESI’s multi-domain modeling solutions, ESI’s new PRESTO solution will fully include cooling within the global design requirements of electronic devices. It will allow simultaneous optimization for performance and fabrication on a single ‘core model’ in a holistic approach, thus achieving considerable benefits on product development cost and time. The exceptional quality of PRESTO’s customers and early industry adopters bodes exceptionally well for the technical and commercial success of this exciting acquisition and business venture. Furthermore, we are very

Altair today announced that GeonX S.A. has joined the Altair Partner Alliance (APA), bringing access to Virfac®, a welding simulation software, to HyperWorks® users. Virfac provides quality predictions for manufactured parts with the ability to improve product lifespan and design before any prototype is required. Virfac is capable of predicting residual distortions encountered by a part during the manufacturing process as well as residual stresses to help calculate the in-service fatigue life of the part. It is particularly suited for high fidelity results on complex industrial applications and ensures manufactured part quality by predicting material transformations during the process as well as the final manufactured component. "Virfac is a new type of technology in the HyperWorks offering, and I believe this will help us identify many different ways to collaborate," said Laurent D'Alvise, CEO of GeonX. "GeonX is really looking forward to exploring the possibilities of the partnership with Altair." Several solvers are

Infolytica Corporation announces today the release of their latest MagNet for SOLIDWORKS update, the company’s electromagnetic field simulation add-in to the 3D CAD package. This update includes improvements made to the interface, post-processing and speed of the software. MagNet for SOLIDWORKS is an embedded 3D electromagnetic field solver developed by Infolytica Corporation which is based on their standalone MagNet 2D/3D software. The simulation and analysis of any electromagnetic device can be performed completely within the SOLIDWORKS environment using this embedded version, making it simpler than ever to setup such complex design problems. This includes a wide range of applications such as transformers, sensors, MRI, actuators, solenoids and more. In this new release, changes have been made to the user interface for both material modeling and post-processing. It is easier to set the direction of magnetization and material type for the electromagnetic analysis. In addition, users can set their desired point of origin

Mentor Graphics Corporation announced  its next-generation MicReD® Industrial Power Tester 1500A product, which provides electronics components power cycling and thermal testing for up to 12 devices simultaneously. The MicReD Industrial Power Tester 1500A is the industry's only commercially available thermal testing product combining both power cycling and thermal transient structure function analysis for real-time failure-in-progress data for diagnostics.  Based on market feedback and the success of the MicReD Power Tester 1500A three-channel product, Mentor Graphics has enhanced the product to accommodate more device testing for greater productivity and lifecycle performance, which will benefit industries such as automotive systems, hybrid and electrical vehicles, trains, power generation and converters, and renewable energy products. Reliability is a key concern in these industries that use high-power electronics, so accelerated testing of these modules through a lifetime of cycles (tens of thousands, potentially millions) is critical for the component supplier, the system supplier, and the OEM.

Infor today announced that Vari-Form has selected Infor CloudSuite™ Automotive to improve business processes and streamline product innovation. As a global provider of structural automotive hydroforming, Vari-Form sought to implement technology that would make the company more dynamic in creating more than 7 million parts each year. Infor CloudSuite Automotive provides the company with reliable access to a flexible technology platform that will help reduce customizations, lower risk and increase overall productivity. Vari-Form is currently undergoing a companywide expansion, which includes creating new facilities in European and Asian markets. Infor solutions will provide key language components that enable Vari-Form to utilize local language options when communicating within the enterprise. The company also determined that a switch to a cloud environment would be both practical and economical in servicing its growth initiative. Before selecting Infor, the company relied heavily on older technology to perform operational tasks. Many of these technologies included complex modifications and

Tata Consultancy Services was ranked as the 57th leading brand in the US by Brand Finance® in its second annual Top 500 US Brands survey, which evaluates the financial value of a company's brand name, intellectual assets and trademark, as compared to companies across industries. TCS was recognized as a top four IT Services brand in the US – the same as its global ranking – and has a AA+ score for its brand strength, the sector's highest designation. Globally, TCS' brand value grew 271% from US $2.3 billion in 2010 to US $8.7 billion in 2015, marking the fastest growth across the IT Services industry during the period. This study marks the first time that TCS has been ranked in the prestigious top 100 US brands list. Brand Finance integrates brand investment, brand equity and financial performance into its rigorous royalty relief research methodology. The approach works across all sectors, allowing brands to be benchmarked against each

PTC announced it has launched the PTC IoT Academic Program  to address the growing concern of an IOT talent shortage by providing students with an investigative learning experience and hands on exposure to the ThingWorx® IoT application development platform. A recent study published by the World Bank estimates that over the next 10 years there will be two million unfilled Information and Communication Technology-related jobs globally. In addition, over 95% of companies say they will be using the IoT in some form within the next three years. This requires educational institutions to better prepare students for employment by these companies. The PTC IoT Academic Program consists of the ThingWorx application development platform in a PTC-hosted environment where students and educators can build their own IoT apps. Users gain access to step-by-step educational content and ThingWorx training from PTC University with curricular that will help them quickly learn the platform as well as a community web presence to

EEMBC®, the Embedded Microprocessor Benchmark Consortium setting the industry standard for valuable application-specific benchmarks, today announced its focus on a benchmark to ensure optimum efficiency of edge nodes (end points) on the Internet of Things (IoT). This new benchmark, currently in development within EEMBC’s IoT working group, aims to provide a standardized, industry-created and -endorsed method to provide application developers with accurate, reliable information that allows them to quickly and equitably compare the efficiency of system solutions targeted at IoT end-point applications. An edge node, referred to as the 'thing' of the IoT, has four primary parts: 1) the sensors or transducers; 2) the processing (e.g. security, compression, protocol stack, data analysis); 3) the interfaces connecting the transducers and microcontroller; and 4) a communication mechanism used to send/receive information between the edge node and the network. When designing an edge node device, battery-life is often one of the most important factors