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Zuken is now accepting presentation abstracts for the ZIW 2016 Conference. As a user and technology conference, we welcome topics covering user experiences as well as technology topics of interest to the general design community. The presentation abstract can be based on a case study, challenging design experience, new technology trend or a solution to a common design problem. Each presentation selected for placement on the agenda is allotted 30 minutes. The conference is organized into two tracks; one focused on board design and the other focused on electrical and harness design. Each track includes the associated engineering data management topics. Presentation topics are not required to include Zuken solutions. The deadline for final submission is December 11, 2015. To view the original press release, please click here. Search for Zuken on CIMdata.com

New Mexico State University has recently been certified as a Partners for the Advancement of Collaborative Engineering Education (PACE) Silver Certified Program, which asserts that NMSU has met specific criteria for academic programs that align with automotive industry needs. NMSU’s College of Engineering became a PACE partner in 2006. PACE is an organization that links GM, Autodesk, Hewlett-Packard, Siemens PLM Software, Sun Microsystems and their global operations, to support strategically selected academic institutions worldwide to develop the automotive product lifecycle management team of the future. The PACE Certification Program includes silver, gold and platinum levels with specific criteria that must be met in order for an institution to achieve that certification level, such as the PACE tool deployment, curriculum integration, PACE projects/course competitions and PACE Annual Forum participation. A regional evaluation team, comprising representatives from the PACE core team, GM functional leadership, PACE faculty and PACE global administrators, completed an assessment of

Having been present for a decade on the Chinese market through a network of resellers, Missler Software decided to strengthen its position on this market, which has a high demand for software to optimize product design and manufacturing processes. According to Marc Choquin, Sales Director for Missler Software: "The creation of our subsidiary was a necessary evolution to accelerate our development in China, in the interest of our customers and our local partners. China has great growth potential for the distribution of TopSolid. This country has become the factory of the world and is the leading consumer of machine tools. We have also noticed that Chinese manufacturers are no longer content to simply purchase machines but rather they want to simultaneously acquire software solutions enabling them to optimize and secure their manufacturing process. TopSolid solutions perfectly meet these needs and, here as elsewhere, the main productivity gains lie in optimizing the

Hawk Ridge Systems announces a new release of xBOM™, the premier solution for Bill of Materials Management for SOLIDWORKS. By introducing extensive Bill of Materials (BOM) Management capabilities, users of SOLIDWORKS Product Data Management (PDM) tools will now be able to manage their BOMs within their current infrastructure without the need for costly Product Lifecycle Management (PLM) systems. Dale Ford, President and CEO of Hawk Ridge Systems says, “Our customers asked us for a robust, yet cost-effective, way to manage Bill of Materials within their existing SOLIDWORKS 3D platform. They wanted to avoid the significant investment and overhead of adding a PLM system for the singular purpose of BOM Management. With the latest release of xBOM, we now have a viable and economical solution for BOM Management which resides within their existing SOLIDWORKS PDM platform.” The xBOM solution is designed and optimized to process Bill of Materials within the SOLIDWORKS PDM environment. Easily accessible to any SOLIDWORKS PDM

MathWorks announced integration with FIX Flyer’s FIX Engine, providing access to FIX-enabled trading systems directly within MATLAB, the high-level language and interactive environment used by millions of engineers and scientists worldwide.  MATLAB users in financial services can now access a range of institutional and retail brokers, exchanges, and third-party networks using the FIX protocol for communication. Support for FIX Flyer's FIX Engine trading platform is now available in Trading Toolbox. By decoupling MATLAB applications from proprietary desktop trading applications, developers can deploy MATLAB algorithms to multiple end users, embed them in other applications, or co-locate them at the exchange of interest. This allows MATLAB users to develop and reuse trading strategies across multiple systems, providing a cost effective approach to managing their trading infrastructure. This approach can also help users scale from individual trading to institutional trading, all from a single platform. MATLAB users can quickly begin trading with their trading partners using FIX Flyer’s

Creaform announced today the latest upgrade to its scan-to-CAD software module. Part of VXelements, Creaform’s 3D software platform and application suite, VXmodel features a new collaborative functionality for direct transfer to Dassault Systèmes SOLIDWORKS and streamlined workflows for reverse engineering and additive manufacturing in scan-to-CAD to print. “VXmodel provides engineers with a simple, yet powerful, software solution that significantly accelerates reverse engineering process time. It now fulfills its duty as an integrated bridge for scan-to-CAD processes more than ever,” said Simon Côté, Product Manager. Here are some of the improvements added in this upcoming release of VXmodel: Direct transfer to SOLIDWORKS: Thanks to the “Direct transfer to SOLIDWORKS” function, all the essential information needed for your reverse engineering process such as NURBS surfaces, cross-sections and geometrical entities are automatically transferred into the CAD software in a single click! Texture menu: The Go!SCAN 3D color acquisition is now supported. Reapply the texture from a scan acquisition to the clean mesh

At its 2015 user conference, COMSOL has revealed features for Multiphysics 5.2. This release, according to the company, has updates for improved stability, robustness and execution. Features have also been added for easier application editing and overall user experience. To learn more about how the COMSOL Application Builder democratizes simulation, download a benchmarking study produced by Desktop Engineering and sponsored by Intel, Dell and COMSOL. Version 5.2 has an enhanced Application Builder with new editor tools for quicker creation of user interface components, a press release states. Tools enable users to make any model parameter, physics setting or plot into a user interface. Graphics can also be updated while the application is running with the App Designer. For the COMSOL Server, 5.2 has a new caching function lets users start applications quicker and simplify administration tasks. Application Libraries have also been expanded to include approximately 50 example simulations in areas such as membrane dialysis to water treatment,

Bentley Systems, Incorporated announced that Leica Geosystems will incorporate Bentley’s Acute3D reality modeling software into its advanced oblique airborne imaging solutions for both unmanned aerial vehicles (UAVs) and piloted aircraft. Leica Geosystems, a leader in geospatial data acquisition and mapping products, has selected Acute3Dsoftware to generate full 3D “reality mesh” representations from its airborne photogrammetric imagery. This combination of software and hardware advancements will enable users to take full advantage of integrated 3D surveying and mapping. Through reality modeling, observations of existing conditions are processed into representations for contextual alignment – for instance, within design modeling and construction modeling environments, in addition to mapping. Rather than generating a voluminous cloud of discrete points, Acute3D produces a 3D reality mesh, readily aligning the real-world context in mapping and infrastructure applications. “Acute3D’s breakthrough capabilities make it possible to now produce true 3D models, even in engineering formats, directly from digital photography, with unlimited scalability,” Styli Camateros, Bentley Systems senior

Aras® today announced that Laird, a leading global manufacturer of systems that enable communications connectivity and protect electronics from electromagnetic interference and heat, has selected the Aras Innovator® platform to streamline global product development and improve product visibility. Integrating to NX and Solidworks CAD, Altium ECAD, and the Laird ERP system, Aras Innovator will unify Laird’s product development, change management, and project management processes across seven business units worldwide. Working with Aras Gold Certified Partner Razorleaf, Laird selected Aras Innovator for the platform’s flexibility to meet the distinct configuration needs of each business unit. PLM system flexibility is vital to Laird, as the company develops a broad range of mission-critical systems, components, and solutions for customers in multiple industries from over 50 facilities in 19 countries across the globe. “Laird has provided global organizations with high-quality performance materials and wireless systems for more than 30 years,” said Peter Schroer, CEO of Aras. “Their

WHO: The international EDA Consortium (EDAC), provider of services, market awareness and a common voice for EDA and IP suppliers to the global semiconductor industry, and its Emerging Companies Committee WHAT: Will host a panel titled, "Patents and Patent Litigation -- Develop, Strengthen, and Protect Your Intellectual Property," featuring John Cabeca, newly named director of the Silicon Valley United States Patent and Trademark Office. Opening remarks will be made by San Jose's Mayor Sam Liccardo. WHEN: Thursday, October 29, from 6 p.m. until 9 p.m. WHERE: EDA Consortium/SEMI Global Headquarters, 3081 Zanker Road, San Jose, Calif. Moderated by Salumeh Loesch, an associate with Klarquist Sparkman, panelists will include John Cabeca, Karna Nisewaner, associate general counsel at Cadence Design Systems, Robert Sachs, partner with Fenwick & West, and John Vandenberg, partner at Klarquist Sparkman. They will address how to get highly technical patents through the Patent Office, and offer advice about how to protect patents or potential inventions in the current