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RS Components today announced the expansion of DesignSpark Mechanical with two new optional premium modules that significantly extend the functionality of the existing version of the tool. Developed in conjunction with SpaceClaim, the leading provider of flexible and affordable 3D modelling software for engineers, DesignSpark Mechanical is an advanced 3D direct modelling tool that can be downloaded free of charge. Notwithstanding the availability of these optional premium paid-for modules, which can now be purchased from RS, very importantly the fundamental software that is available today will remain free to all users with continued support, new versions and updates from RS into the foreseeable future. DesignSpark Mechanical is a key element of the initiative by RS to provide tools for engineers that enable them to rapidly develop prototypes in the product concept design stage. For example, the software's STL-output format enables the direct export of designs to 3D printers. The first premium module

Granta Design has released version 3.1 of its MI:Materials Gateway software. This release, according to the company, has features that ensure materials choices can easily be access in the CAE environment and quickly identified. Interoperability is supported for CAD systems such as CATIA, Creo, Autodesk Inventor, NX for CAE platforms like Abaqus, ANSYS Workbench and HyperMesh. Version 3.1 further enables users to share materials knowledge between product development functions. MI:Materials Gateway allows CAD users to identify materials in the GRANTA MI database, assign them to parts and change materials assignments with CAE users. These CAE materials models can then be used for simulation. “Version 3.1 continues the fast pace of development for MI:Materials Gateway, in close collaboration with our customers and leading vendors of CAD, CAE and PLM (product lifecycle management),” says Dr Arthur Fairfull, director of Strategic Product Initiatives at Granta. “Already in its third generation, this unique technology ensures a single view

C3D Labs is pleased to announce that ROSATOM, the Russian Federal Nuclear Center’s All-Russian Research Institute of Experimental Physics (VNIIEF) has licensed the C3D kernel for use in its 3D software. After a selection procedure that thoroughly tested the contenders amongst available kernels, engineers at VNIIEF decided in favor of the C3D geometric kernel from C3D Labs. The technology will be used by the research institute to develop their own software that computes simulations of a variety of physical processes. “We look forward to using the C3D geometric kernel to build computational meshes for 3D models, and for simplifying, adjusting, and improving the computational geometry,” said Valery Budnikov, department head at VNIIEF.  “Our collaboration has proven to be productive for both teams.” During the testing phase, C3D Labs engineers joined forces with those from VNIIEF, so much so that C3D Labs decided to release the support systems and development environments requested by the

CGTech is on hand at the National Leadership and Skills Conference (NLSC), June 22-26, 2015, to help grade multiple SkillsUSA/NIMS events related to Computer Numeric Control (CNC) machining. More than 16,000 people — including students, teachers and business partners — are participating in the weeklong event.  The purpose of the CNC Mill, CNC Lathe and CNC Technician contests is to evaluate each contestant’s preparation for employment in CNC programming. In addition, it recognizes outstanding students for excellence and professionalism. The contest will assess the ability to write CNC programs, interpret prints, and measure/gage parts. Participants will also demonstrate theoretical knowledge of CNC machine configuration, setup and operations.  CGTech technical support engineers will use VERICUT software to evaluate the accuracy of the NC programs created, while also ensuring the programs will run without violating safety standards or damaging machines. After each student’s NC program has been simulated, the virtual workpiece will be compared

Gerber Technology is excited to announce that guest speakers Meg Munits, director of application development at Aeropostale, and Robyn Howard, senior PLM manager at Randa Accessories, will speak about the benefits of PLM for businesses at this year's PI Apparel 2015 Conference in New York on June 23 and 24. The annual conference attracts many of the world's leading fashion, apparel and footwear brands and executives. Over the two-day event, industry experts will discuss how modern technology can help address opportunities and challenges surrounding product lifecycles. Meg Munits is a guest speaker for the session entitled, "How Can PLM Help Facilitate Fast Fashion?" on June 23 at 11:15 a.m. in Room 1 at the Union League Club. Munits will speak about how Aeropostale is leveraging YuniquePLM to shorten cycle times by centralizing and sharing data. Implementation of the software with the company's cross-functional product development teams enabled Aeropostale to bring its

ESI Group, will attend the 10th Teratec Forum at the Ecole Polytechnique in Palaiseau, June 23 & 24. A founding member of the organization, ESI has supported Teratec for the past decade. Today, Teratec plays a leading role in accelerating the developments of High Performance Computing in Europe. For this reason, ESI has chosen the Teratec Campus, near Paris, to host its new European HPC center which is due to open this summer. In a highly competitive global context, European countries are engaging in digital strategies as a means to increase their industrial competitiveness. Ten years ago, leading French industrial companies, R&D centers and local authorities joined forces to create the non-profit association Teratec, aimed at supporting innovation through High-Performance Computing. Teratec's role includes the creation and the promotion of French and European R&D projects led in conjunction with industrial players, technology providers, research centers and competitiveness clusters. Teratec also supports small and medium businesses in adopting HPC solutions, organizes

Autodesk, Inc. today announced that Amar Hanspal, Senior Vice President, IPG Product Group, will present at the Nasdaq Investor Program in London, Tuesday, June 30 at 2:45 p.m. British Summer Time. A live webcast, replay and podcast of the presentations will be available through Autodesk's Investor Relations Website atwww.autodesk.com/investors. Please go to the Website at least 15 minutes early to register, download and install any necessary software. For more information, please call Autodesk Investor Relations at 415-507-6705. To view the original press release, please click here. Search for Autodesk on CIMdata.com

3D Systems announced today that it will feature its versatile personal and professional 3D printers as well as its extensive digital design tools at the Design Engineering & Manufacturing Expo (DMS) in Tokyo, Japan, June 24 – 26, 2015. Located in the Tokyo Big Site Convention Center, booth E 2-36, 3DS will showcase its workflow-enhancing 3D digital thread, which allows clients in industries such as manufacturing, healthcare and architecture to move seamlessly between scanning, designing and 3D printing to compress design windows and shorten supply chains. Together with its partners and resellers, 3D Systems will display the ProX™ 200 Direct Metal Printer (DMP), which creates fully functional, end-use metal parts. In addition, visitors to the booth can see vibrant full-color printing on theProJet® x60 series and ProJet® 4500 as well as multi-material composite printing on the ProJet® 5500X. Desktop printing and prototyping will also be on exhibit with the ProJet® 1200 micro-SLA 3D printer and the user-friendly Cube®and CubePro®. For the design and scanning component of the digital

Synopsys today announced its cooperation with National Taiwan University (NTU), National Cheng Kung University (NCKU), National Tsing Hua University (NTHU), and National Chiao Tung University (NCTU) to establish joint advanced design labs for Internet of Things (IoT) applications at the aforementioned schools. This is the first cooperation between a foreign semiconductor design software and IP company and top universities in Taiwan to focus on advancing IoT ecosystem business opportunities and research and development (R&D). The collaboration is expected to cultivate semiconductor design talent and advance relevant industry development. Dr. Aart de Geus, chairman and co-CEO of Synopsys, came from the U.S. to attend the opening ceremony for the joint advanced design labs today. Also present at the ceremony at the Grand Hyatt Taipei were Dr. Jyuo-Min Shyu, Minister of Science and Technology; Dr. Cheng-Wen Wu, senior vice president of NTHU; Prof. C.Y. Lee of the Department of Electronics Engineering, NCTU; Dr. Ming-Der Shieh, chairman of the Department

Oracle Corp founder and Executive Chairman Larry Ellison said his database company is expanding its cloud-computing offerings, bringing Oracle into more direct competition with Amazon.com Inc. "We're prepared to compete with Amazon.com on price," said Ellison in a webcast presentation on Monday, after announcing that Oracle would offer online storage and capability for customers to run their applications entirely in Oracle's cloud. The expansion is a major new step for Oracle, which is shifting its traditional database and customer relationship management businesses to the cloud. "This is a really big deal," said Ellison, who stepped aside in 2014 as chief executive of the company. Amazon Web Services is the market leader in providing cloud computing capability to customers, followed by Microsoft Corp's Azure service and International Business Machines Corp . Oracle, which calls its cloud offering the Oracle Cloud Platform, will provide a cost-effective alternative to Amazon, said Ellison. "Our new archive storage service goes head-to-head with Amazon Glacier and it's one-tenth