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Tuesday, May 12, 2015

UMC Certifies ANSYS Power Integrity And Electromigration Solutions For 28 And 40nm Technologies

ANSYS simulation tools, which deliver needed accuracy and reduced turnaround time, while ensuring power integrity and electromigration (EM) reliability, have been certified by UMC 28 and 40-nanometer (nm) technologies.

As the world's appetite for smart products continues to grow, 28-nanometer process technology is becoming the workhorse for most of the mobile, computing and Internet of Things applications, while 40-nanometer is becoming the lead technology for such automotive applications as microcontrollers. UMC, a leading semiconductor foundry, is actively addressing the needs of its 28- and 40-nanometer customers by delivering reliable, low power and cost-effective solutions.

UMC's certification of ANSYS®RedHawk™ and ANSYS Totem™ includes static and dynamic voltage drop analysis and signal and power EM verification with accuracy correlation and circuit resistance validation for poly-SiON, High-K/Metal Gate (HKMG) and mixed-signal RFCMOS technologies as per UMC's requirements. These process technologies are typically used for designing chips serving mobile, computing, IoT, automotive and other applications.

"By working closely with ANSYS on tool certification, we are able to offer our customers a reliable 28- and 40-nanometer technology platforms, enabling them to design and deliver robust, cost-effective systems-on-chips for the next generation electronic products," said Shih Chin Lin, senior director at UMC.

"The certification of RedHawk and Totem for 28- and 40-nanometer technologies illustrates the confidence UMC and our mutual customers have in our products for accuracy, performance, cost-effectiveness and reliability," said Fares Mubarak, vice president and general manager of ANSYS. "This collaboration with UMC helps us deliver optimized tools and methodologies for our mutual customers and the industry."

 

To view the original press release, please click here.

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