Cadence Design Systems, Inc.announced that OrCAD® Capture now provides export capability for Intel Schematic Connectivity Format (ISCF), targeted at automating Intel-based design reviews. ISCF was developed by Intel to streamline the collaboration process with its customers. Intel worked with Cadence to develop a direct ISCF generation capability in OrCAD Capture to make this collaboration process simpler and more efficient. Customers requiring a review with Intel's Customer Solutions Team in its Sales and Marketing Group (SMG) can now exchange design data in an Intel-approved format, optimizing the design review process.
By enabling the user to directly export hierarchical schematic designs in ISCF, OrCAD Capture improves upon the traditional method, which required Intel engineers to manually migrate the schematics. Customers can benefit from having their designs reviewed against specific guidelines early in the design cycle. They can then address issues sooner in the process, improving time to market.
"We review many schematics in OrCAD Capture/CIS format," said Rui Wang, vice president and general manager of the Technical Enablement Group in Intel's Sales and Marketing Group. "We expect this export capability from Cadence tools will significantly improve our efficiency and our customers' time to market."
"By integrating OrCAD Capture with ISCF, we are able to enable designers of IoT, wearable and mobile applications to receive faster Intel design reviews, reducing risk and cost and speeding time to market," said Steve Durrill, senior product engineering group director of the PCB Group at Cadence. "Many of Intel's growing customer base are already using our tools, and they can now leverage ISCF export to streamline their process of bringing innovative products to market."
