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Industry Summary Articles

Wednesday, October 26, 2016

New E-Cool Toolset in STAR-CCM+ Enables Improved Thermal Insight of Electronics Systems

Siemens PLM Software announced today the latest release of STAR-CCM+® software, version 11.06. This latest version of the engineering software tool aligns with Siemens' Smart Innovation Portfolio that helps manufacturers optimize their Digital Enterprise and realize innovation.

STAR-CCM+ v11.06 introduces the Electronics Cooling Toolset (E-Cool). E-Cool facilitates the creation and manipulation of electronics components for the thermal performance analysis of board and system level electronics devices. Parts such as fans, heatsinks, chips, and boards can be imported from industry-standard IDF files, or created in STAR-CCM+.

"This new capability allows engineers to focus their time on making the right decisions for improving the thermal efficiency of their electronics systems," says Siemens PLM Software Senior VP of Product Management Jean-Claude Ercolanelli. "It utilizes an entirely new concept for quickly managing and exploring their entire product design space to match their industrial engineering objectives."

While the E-Cool innovation is among the leading enhancements offered in STAR-CCM+ v11.06, this version features many more advancements, offering users significant gains in technology, experience, and productivity.

To view the original press release, please click here.

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