CIMdata PLM Industry Summary Online Archive

10 November 2009

Events News

Si2 Announces Sponsorship of “3D Architectures for Semiconductor Integration and Packaging Conference”

Silicon Integration Initiative (Si2) announced its sponsorship of the “3-D Architectures for Semiconductor Integration and Packaging Conference.” This conference will be held December 9-11, 2009, at the Hyatt Regency San Francisco Airport in Burlingame, CA, and is developed by RTI International.

“Si2's member companies recognize the growing business need for designing and integrating circuits in 3-D, as well as the technical challenges that must be solved,” says Sumit DasGupta, sr. vice-president of Engineering at Si2. "Many of our member companies and other interested parties are also calling for new standards in 3D design, which Si2 is currently investigating." At this conference, Dr. DasGupta will be presenting the findings from a recent 3D Standards workshop hosted by Si2 and GSA.

The various performance, size, and cost drivers to the move toward 3-D are well known. Likewise, the various routes and options for implementation of 3-D, whether it is through front-end device manufacturing or in back-end packaging, are often discussed. Near-term market opportunities are widely recognized as well. Regardless of this expanding reality, the situation continues to be very dynamic as technology continues to evolve, and the understanding of cost/performance benefits relative to specific market applications continues to expand. The best path forward, whether from a technology or market standpoint, often remains uncertain.

This year’s conference will provide attendees and speakers the unique opportunity to explore and understand the technology and business implications of the trend toward 3-D device and system integration in the semiconductor industry. Conference Sessions for this year's event include:

• The IDM and Foundry Perspective on 3-D Technology Trends and Opportunities

• The Packaging Foundry and its Vital Role in Driving 3-D

• Looking Over the Horizon - Forecasting Growth

• On the Front - Applications Driving 3-D Development and Commercialization

• Taking Advantage of 3-D - Rethinking Design Approaches

• Industry and Government Funded 3-D Efforts - Key Research Outcomes and Resources

• Fundamental Technology Approaches to Building 3-D

• Wafer Handling Leads the Way on Manufacturing

Registration and additional information is available at: http://techventure.rti.org/Winter2009/.

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