Cyncly, the world’s leading global provider of software and content solutions that help make amazing spaces for living, announced the release of On-Demand Content in Worksheet, a major update that simplifies catalog updates for both manufacturers and dealers. With this update, Worksheet users can now access catalog updates directly within their workflow—faster, smarter, and without interruptions. “The Cyncly Worksheet 2025 On-Demand Software Updates and Catalog Updates are a major step forward in efficiency and accuracy for both manufacturers and designers,” said Sarah Girard, Cyncly Commercial Product Manager. “We hear from our customers all the time that real-time catalog information is essential to their business. This new system gives manufacturers more speed, control, and flexibility than ever before, while making catalog updates seamless and stress-free for our dealers.” This release marks a significant step in modernizing the Worksheet experience by eliminating the need for manual downloads or separate tools like the Content Downloader. Instead,

Siemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard.. Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate, (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and Through Silicon Via (TSV)-based 2.5D and 3D IC.  ASE’s VIPack is comprised of six core packaging technology pillars supported by a comprehensive and integrated co-design ecosystem. As ASE’s advanced packaging platform, it is designed to enable vertically integrated package solutions and represents its next generation of 3D heterogeneous integration architecture that extends design rules and achieves ultra-high density and performance. The platform leverages advanced redistribution layer (RDL) processes, embedded integration, and 2.5D and 3D technologies to help customers achieve unprecedented innovation when integrating multiple

At the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies. Mutual customers can now leverage these advancements, which include substantial innovations in artificial intelligence (AI), 3D IC design, and advanced packaging, to develop compelling and highly differentiated new products. “Our longstanding relationship with TSMC underscores the transformative power of collaborative innovation,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “By combining Siemens’ leading IC and advanced packaging solutions with TSMC’s state-of-the-art process technologies, we enable our mutual customers to achieve new levels of design innovation and faster time-to-market, reshaping the future of semiconductor development.” “The collaboration with Siemens illustrates our persistent focus to enable our shared customers for the latest and most advanced process and packaging technologies,” said Aveek Sarkar, Director

Synopsys, Inc. announced its ongoing close collaboration with TSMC to deliver multi-die solutions, encompassing advanced EDA and IP products, that support TSMC's leading-edge processes and packaging technologies, driving innovation in AI chip and multi-die design. The 3DIC Compiler exploration-to-signoff platform and IP, tuned for 3D packaging, along with the company's partnership with TSMC on design enablement has resulted in multiple customer tape-outs. Building on Synopsys' continued collaboration with TSMC is the availability of certified digital and analog flows, along with the enabled Synopsys.ai™ on TSMC's N2P and A16™ processes using TSMC NanoFlex™ architecture. In addition, Synopsys provides robust automotive IP solutions for TSMC N5A and N3A processes and best-in-class Interface and Foundation IP solutions, delivering highest level of safety, security and reliability while enabling maximum performance with the lowest power for advanced chips.  "Our close collaboration with TSMC continues to empower engineering teams to achieve successful tape outs on the industry's most advanced

Synopsys, Inc., announced TSMC has certified the Ansys portfolio of simulation and analysis solutions, enabling accurate final checks on chip designs targeted for TSMC's most advanced manufacturing processes including TSMC N3C, N3P, N2P, and A16™. The companies also collaborated on an AI-assisted design flow for the TSMC-COUPE™ platform. Together, Synopsys and TSMC empower customers to effectively design chips for a range of applications including AI acceleration, high-speed communications, and advanced computing. Multiphysics and AI-Driven Photonics Design Enablement Synopsys continues to work with TSMC to expand multiphysics analysis flows for larger designs with hierarchical analysis methodology. The multiphysics flow includes Ansys RedHawk-SC, Ansys RedHawk-SC Electrothermal platform, and Synopsys 3DIC Compiler™ exploration-to-signoff platform to enable hierarchical thermal-aware timing analysis and voltage-aware timing analysis. This multiphysics approach can help customers accelerate the convergence of large 3DIC designs. Ansys optiSLang software and Ansys Zemax OpticStudio software transform the design of optical coupling systems in TSMC-COUPE™ architecture by applying AI-assisted optimization

ESTECO is pleased to announce the agenda for the 9th edition of the biennial ESTECO Users’ Meeting North America, taking place on October 14-15, 2025, at Saint John’s Resort in Plymouth, MI. This year’s event features prominent speakers from leading companies such as Cummins, SLB, Honda Development & Manufacturing of America, Medtronic, Ford Motor Company, and Stellantis North America. The event will bring together engineers using ESTECO digital engineering solutions, allowing them to share their experiences and demonstrate how VOLTA and modeFRONTIER are driving innovation across various industries. Attendees will have the opportunity to connect with ESTECO experts, discover new features and upcoming advancements, and enhance their understanding of ESTECO Technology through interactive workshops. A significant portion of the agenda is dedicated to the automotive sector, traditionally one of the industries where ESTECO Technology is most widespread: Bob Tickel, Director of Multidisciplinary Simulation, Research and Technology at Cummins will discuss how his company’s

At the Bluebeam Unbound Conference, IMAGINiT Technologies, a division of Rand Worldwide and a Bluebeam Platinum Partner, will showcase its latest field-to-office workflow innovations. The conference, taking place September 30–October 2, 2025, in Washington, D.C. features IMAGINiT experts who will challenge architecture, engineering, construction firms and owners to rethink collaboration, redefine project outcomes, and accelerate their digital initiatives. As a Silver Sponsor of the conference, IMAGINiT will have a team of experts on hand in Booth #201. “A company’s digital evolution is more than a technology shift—it’s about connecting enterprise data and platforms resulting in more efficient projects giving our customers a competitive edge,” said Bill Zavadil, president and chief operating officer of IMAGINiT Technologies. “Our partnership with Bluebeam combines the best collaboration technology with IMAGINiT’s deep Autodesk software expertise and services, providing a single trusted partner to improve workflows, deliver stronger project outcomes, and reduce risk. Bluebeam Unbound is the ideal venue

MathWorks, the leading developer of mathematical computing software, will exhibit at the upcoming European Microwave Week (EuMW) 2025 in Utrecht, Netherlands. EuMW is Europe’s premier microwave, RF, wireless, and radar event, bringing together thousands of engineers, researchers, and industry leaders. Attendees are invited to visit MathWorks at Booth A094 to explore interactive demos and attend a short course focused on emerging satellite communication and non-terrestrial network (NTN) technologies. To schedule a meeting with MathWorks at EuMW, visit mathworks.com/company/events/tradeshows/european-microwave-week-2025-form.html “Attendees will gain practical insights into how MATLAB® and Simulink® streamline RF system design — from antenna modeling and signal processing to hardware prototyping,” said Giorgia Zucchelli, Principal Product Manager, RF and Mixed-Signal, MathWorks. “Our booth demos and short course will showcase how engineers can reduce development cycles, improve system performance, and apply integrated modeling techniques to real-world challenges in radar, satellite communications, and wireless communications systems.” EXHIBIT BOOTH DEMOS (Booth A094) MathWorks will present three hands-on demonstrations that highlight how MATLAB

Rockwell Automation, Inc., the world’s largest company dedicated to industrial automation and digital transformation, will showcase its end-to-end autonomous manufacturing solutions at PACK EXPO 2025 in Las Vegas Sept. 29 – Oct. 1.  Amidst shifting consumer demand and evolving regulations, Rockwell will demonstrate how it helps CPG manufacturers extend autonomy from raw-material movement via its OTTO autonomous mobile robots (AMRs) into the production process through integration across the Rockwell portfolio. This integrated solution delivers greater speed, efficiency, and resilience in end-to-end operations. “Autonomous manufacturing is no longer a future concept, it’s here today,” said Steve Deitzer, VP Global Industry, Consumer Packaged Goods, at Rockwell Automation. “Every manufacturer is at a different point in their digital transformation, and we meet them where they are with practical, scalable solutions that unlock measurable value. At PACK EXPO we’re showing how end-to-end autonomy can reshape operations and strengthen business outcomes today.” Attendees who visit booths SL-13028 and SL-13022 can see

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36 Gbps Gen2 silicon success, this third-generation subsystem delivers a major advancement in performance and shoreline bandwidth density for the IP Ecosystem. With 64 Gbps per-lane uni-directional data rates, it enables the next generation of chiplet-based architectures for AI, XPUs, and data center systems, providing power-efficient, reliable multi-die SoC integration and seamless interoperability across the chiplet ecosystem. As the first 64 Gbps UCIe™ IP subsystem implemented on TSMC's 3nm process, this achievement positions Alphawave Semi as a leader in UCIe die-to-die connectivity technology. With enhanced 64 Gbps UCIe performance and reduced power consumption, the solution enables new applications, including optical connectivity for Co-Packaged Optics (CPO), which are essential for scalable systems and