At the Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery. To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems. In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and

Centric Software’s end-to-end concept-to-commercialization solutions like Centric PLM™ mitigate uncertainty caused by tariff activity. Centric Software® provides the most innovative enterprise solutions to plan, formulate, develop, procure, manufacture and sell consumer goods products in cosmetics & personal care, food & beverage, fashion and multi-category retail to achieve strategic and operational digital transformation goals. Recent tariff activity has affected cosmetics & personal care companies, resulting in fluctuating ingredient and packaging costs. Changes in regulations are happening day-by-day and companies must figure out how to absorb the rise in costs or adjust pricing strategies to pass increases on to consumers. Centric Software’s wider end-to-end product lifecycle platform, Centric PLM integrates with all Centric Software solutions including Centric Market Intelligence™ and Centric PXM™. All Centric Software solutions, infused with AI optimization as a natural evolution of trusted rule-based methods, target the unique challenges faced by the retail sector and deliver comprehensive, data-driven decision-making for modern retail

Ann Arbor, Michigan, USA 1 May 2025—CIMdata, Inc., the leading global research, consulting, and education firm specializing in Product Lifecycle Management (PLM) and the Digital Transformation it enables, announces its participation in an upcoming web dialogue, “What’s Next for PLM? A 3DEXPERIENCE Dialogue with CIMdata.” Sponsored by GoEngineer, this virtual discussion is set to take place on Wednesday, 21 May, at 3:00 PM EDT. For this session, GoEngineer’s Product Manager Cody Salyer, will be joined by CIMdata’s Vice President, Stan Przybylinski, to talk about current Product Lifecycle Management (PLM) demands and proven strategies to address these needs using tools such as 3DEXPERIENCE. The interactive session will focus on several key topics at the forefront of the current PLM landscape, including: What is PLM today? The growing need for the Digital Twin and Digital Thread. Cloud vs traditional On-Prem: choosing the right deployment model. Supply Chain Management up and down your value network. The importance of picking

Each year, TOPSOLID SAS invests nearly 20% of its revenue into R&D and enhances its TopSolid product line with hundreds of improvements and new features inspired by feedback from partners and customers. The TopSolid Integrated Digital Factory Suite continues to expand, simplifying design and enabling automated, accelerated production within a fully collaborative environment. TopSolid’Design TopSolid'Predict: predictive intelligence that anticipates needs and suggests commands perfectly suited to each context Automated backups and vaulting without interrupting work Profile kits for automatic, standardized, and perfectly adjusted fastenings New generation PDM tree for simplified document access Automatic exceptions for generating clear and precise drawings TopSolid’Cam Simplified and faster creation of polygonal operations New features for easily managing all steady rest elements and movements New continuous 5-axis finishing strategy Fine-tune machining with residual toolpath control Cutting-edge robotics offering versatility, simplified programming, better adaptability, and advanced machining path simulation Smoother communication between the programming office and the shop floor TopSolid’Virtual Simplified navigation thanks to dynamic modes New teleportation tool that automatically detects

Siemens Digital Industries Software announced that its continued collaboration with Intel Foundry has resulted in multiple product certifications, updated foundry reference flows, and additional technology enablement leveraging the foundry’s leading-edge technologies for next-generation integrated circuits (IC) and advanced packaging. Siemens is a founding partner of the Intel Foundry Accelerator Chiplet Alliance – enabling a new and compelling solution for 3D IC and chiplet offerings to a breadth of semiconductor market verticals. Intel 18A Certification Achievements Siemens’ industry-leading Calibre® nmPlatform tool is now certified for the latest Intel 18A production Process Design Kit (PDK). Intel 18A represents a significant technological leap forward, featuring innovative RibbonFET Gate-all-around transistors and the industry’s first PowerVia backside power delivery. This Calibre certification allows mutual customers to continue leveraging the Calibre® nmPlatform tool as their industry-standard sign-off solution with Intel Foundry's most advanced manufacturing process, accelerating time-to-market for next-generation chip designs. Siemens and Intel Foundry have also successfully certified

Netskope, a leader in modern security and networking, announced the continued expansion of the Netskope One platform to cover more AI security use cases, including enhanced protections for private applications and data security posture management (DSPM) attributes. While other vendors focus on enabling safe user access to AI applications, Netskope capabilities go much further by managing new risks introduced by the adoption and building of AI applications, providing a deep understanding of sensitive data being fed into large language models (LLMs) and assessing risk on AI models to make informed decisions on application selection and policy setting. Building on Netskope’s current, comprehensive protections for public SaaS and AI applications, Netskope One, which is powered by SkopeAI innovations throughout the platform, covers a broad range of AI security use cases: protecting and securing AI use across users, agents, data, and applications, with complete visibility and contextual, real-time controls. The rapid adoption of AI by enterprise

Zuken announces the launch of eCADSTAR 2025, the latest release of its advanced PCB design software. This release brings a suite of innovative features designed to optimize design workflows, improve high-speed, signal integrity, and enhance collaboration between engineering and manufacturing teams. “eCADSTAR 2025 provides engineers with smarter tools to accelerate development while maintaining design accuracy,” said Jeroen Leinders, eCADSTAR Business Manager, Zuken Europe. “The new capabilities that we are introducing in this major release streamline library management, improve high-speed design precision, and automate key manufacturing processes.” The enhancements in eCADSTAR 2025 extend across the entire design process, from improved library management with multiple library path support to enhanced schematic documentation and greater accuracy in high-speed design. Manufacturing collaboration has been further refined with expanded variant exports and automated batch processing of manufacturing outputs. Rather than exporting files manually, Batch Processing allows for the automatic creation of all necessary manufacturing outputs, including Gerber

Centric Software® provides the most innovative enterprise solutions to plan, formulate, develop, procure, manufacture and sell consumer goods products in food & beverage, grocery, fashion and multi-category retail to achieve strategic and operational digital transformation goals. With the recent burst of tariff activity, food & beverage companies and grocery retailers are faced with widely fluctuating ingredient costs. Changes in regulations are happening day-by-day and consumer response is also factoring into sales, so there is no time for consultation and lengthy analyses; response to tariffs must be reactive and swift. Real-time access to data becomes crucial in today’s circumstances. A modern PLM solution has modules that can facilitate agile product development, enabling companies to quickly adapt to market changes. By streamlining collaboration and workflow processes, food & beverage and grocery companies can revamp their offerings or develop new products that cater to evolving consumer demands and benefit from AI-functionalities like least cost formulation to

Infosys, a global leader in next-generation digital services and consulting, announced the launch of Infosys Topaz for SAP S/4HANA Cloud, an AI-first suite designed to help enterprises harness the power of AI and Gen AI in their SAP S/4HANA Cloud transformation journey. The comprehensive AI suite is powered by Infosys Cobalt cloud offerings and Infosys Topaz, an AI-first set of services, solutions, and platforms using generative AI. It brings together services, solutions and playbooks to enable companies to become AI-first enterprises by reimagining business transformation, accelerating SAP S/4HANA Cloud adoption and unlocking data value with a future ready architecture. Reimagine business transformation: With an AI-first approach to business transformation, the suite has industry specific playbooks with a repository of proven solutions to enable enterprises to reimagine their business value chain. The playbooks comprise of Infosys industry cloud and AI solutions that help companies accelerate time to value. A global consumer packaged goods (CPG) leader improved short-term

Aeris, a global leader in secure cellular IoT platforms and solutions, launched an expansion of IoT Accelerator, the company’s IoT connectivity management platform as a service (PaaS). The move enables Aeris and its mobile carrier partners to deliver a single-SKU eSIM to OEM and enterprise customers, providing a single-pane of glass in a global unified manner. This expansion sets Aeris apart from competitive offerings that require multiple layers of aggregators or the need for investment in aggregator platforms that can lead to “margin stacking” in a price sensitive market. Aeris acquired the IoT Accelerator in early 2023 from Ericsson. The PaaS received over $2 billion in investment. The scale of this investment means automotive, utility, fleet and connected device industry partners can use the expanded IoT Accelerator to fulfill the promise of IoT and the opportunities offered with eSIMs. Aeris’ partners can build and deploy connected solutions without complex service management restraints