Delcam’s PartMaker Division will unveil the 2015 version of its PartMaker CAM software for programming CNC mills, lathes, wire EDM equipment, turn-mill centres and Swiss-type lathes at IMTS 2014 in Chicago from 8th to 13th September on booth E3222, the largest CAM software booth at the show.  Major highlights of PartMaker 2015 include improved support for today’s latest breed of multi-tasking machine tools, more powerful milling and turning functionality and a unique approach to post-processing for multi-axis turn-mill centres and Swiss-type lathes, among other productivity enhancements. "The innovations in PartMaker 2015 further cement the software’s position as the preeminent CAM system on the market for programming of multi-tasking machining applications,” said PartMaker Division President, Hanan Fishman.  "PartMaker 2015 extends support of the product’s patented approach to programming multi-tasking machine tools to support today’s latest breed of multi-function machines.” "Additionally, the power of the machining algorithms driving PartMaker will be enhanced in Version

Delcam will host a workshop on CADCAM developments during CIMES (China International Machine Tool Exhibition) in Beijing from 18th to 22nd June.  The workshop will include demonstrations of new functionality in Delcam’s PowerSHAPE Pro CAD software, in the PowerMILL CAM system and in the PowerINSPECT inspection software.  For the full programme and an invitation, please email \n Diese E-Mail-Adresse ist vor Spambots geschützt! Zur Anzeige muss JavaScript eingeschaltet sein! . The 2014 R2 release of PowerSHAPE Pro includes a range of new functionality for the design of products and tooling.  In particular, the new version introduces powerful new tools to make re-engineering complex parts from scanned data faster and easier, plus an option to merge disjointed faces within a solid and so make direct modelling operations more robust.  By offering a combination of solid, surface and direct modelling, together with reverse engineering functionality, PowerSHAPE Pro provides

Today from the Commonwealth Center for Advanced Manufacturing (CCAM), an applied research center that provides production-ready manufacturing solutions, Siemens announced more than one billion dollars of in-kind software grants for manufacturing programs at community colleges and universities in Virginia. Students will now have access to the same Siemens product lifecycle management (PLM) software used throughout the global manufacturing industry to design, develop and manufacture some of the world’s most sophisticated products in a variety of industries, including automotive, aerospace, consumer products, medical devices, machinery, shipbuilding, apparel and high-tech electronics.  The series of in-kind grants was established as a result of an industry need for skilled workers and is designed to support the state’s largest industrial employer, Newport News Shipbuilding, a division of Huntington Ingalls Industries, and other companies with local ties such as Rolls-Royce.  The grants are part of ongoing workforce development collaboration among community colleges, universities and organizations like CCAM,

Intergraph® has entered into an educational training partnership agreement with Korea's Chonnam National University, Yeosu campus, to teach students enrolled in its College of Engineering program using Intergraph's SmartPlant® Enterprise plant design solutions. The College of Engineering at Chonnam National University (CECNU), with more than 60 years of tradition, strives to develop core technologies and foster future leaders to contribute to the local community as well as the entire nation. Its motto is "To the Technology, to the World, to the Future." Chonnam National University engineering students will be trained using Intergraph Smart™ 3D, SmartSketch®, SmartPlant Instrumentation, SmartPlant P&ID and SmartPlant Review solutions. The popularity and effectiveness of Intergraph plant design solutions within Korea drove Chonnam National University's decision to incorporate SmartPlant Enterprise solutions into its engineering curriculum. University instructors will use Intergraph next-generation plant design technology that will allow engineering students to make an immediate impact with owner operators and EPCs upon graduation. Chonnam National University Professor Yigon Kim said, "Chonnam University operates

Trimble announced it has acquired the assets of privately-held MAYBIM based in Provo, Utah. MAYBIM is a provider of 3D Building Information Modeling (BIM) services to contractors with a focus on mechanical, electrical and plumbing (MEP) contractors across the U.S. Financial terms were not disclosed. MAYBIM's suite of 3D BIM professional services allows for contractors to rapidly scale their BIM capabilities regardless of the requirements from the building owner or general contractor. MAYBIM provides contractors customized project deliverables that can include 3D Modeling, BIM Coordination, 3D Laser Scanning and 3D Modeling from Scanned Point Clouds. "Today's MEP contractors are increasingly receiving requests to use BIM on their projects, but the adoption and implementation takes time. The use of 3D BIM services to supplement their own capabilities can help MEP contractors accelerate that process," said Pat Bohle, general manager of Trimble's MEP Division. "By combining the experience of the MAYBIM and the Trimble

Tekla Field3D is a high performing mobile BIM tool for handling large data sets and constructable, detailed models. Now also the models on mobile devices can carry all the building information you need. With the new mobile application AEC professionals can conveniently take BIM to the field with their iOS mobile devices. Tekla Field3D users can collaborate with all project members, including those without access to desktop BIM software or any deeper knowledge about 3D modeling. As Tekla is strongly committed to supporting Open BIM, the offering including the new mobile solution allows users to work efficiently with open standard IFC models. With Tekla Field3D, you can combine IFC models on your iOS device and view and share building information models on the go.

Computer Simulation Technology (CST) announces new features to automate workflows for field source coupling and multiphysics simulation using its System Assembly and Modeling (SAM) framework at MTT-S IMS, booth #1423. Since 2012, CST has offered the ability to link together multiple simulation and post-processing tasks using the SAM framework in its EM simulation software, CST STUDIO SUITE. The 2014 release of CST STUDIO SUITE builds on this with features that automate the creation of SAM projects for common design tasks, such as antenna placement, emissions analysis and thermal detuning. Multiphysics workflows, which combine full-wave EM simulation with thermal simulation, can now be created using the wizard from the schematic view in CST STUDIO SUITE. This means that all the solvers are set up and connected, and the entire simulation started with a single click. For simulations with temperature dependent materials, SAM allows simulations to be iterated until convergence is achieved. Mechanical simulations

Altium Limited has announced the latest update to its signature PCB design software, Altium Designer 14.3. Responding to user community feedback, Altium has updated the software to provide improved support and new features that facilitate design reuse and more efficient electronics design. This update – which is available to all subscription users – will bring Altium users improved Component Variant Support, which will give them the ability to design the schematic and PCB for drop-in replacement and alternative parts. This provides sizeable productivity gains for product variants, while also making it easy to source and manage multiple alternative parts from the supply chain. “We are committed to deeply engaging with our user community and responding to their needs to continually improve our software,” said Altium Limited CEO, Aram Mirkazemi. “Since the initial release of Altium Designer 14, we have released two additional updates that have incorporated the features and improvements that our

Aras® today announced that Roki Co., Ltd., a manufacturer of automotive filtration equipment and environment-friendly products that improve fuel consumption and reduce gas emissions, has selected Aras Innovator® suite for enterprise PLM to optimize 3D design management. The initial implementation of Aras Innovator will provide E-BOM management, including product configuration management, design change management and CAD integration. Together, this will facilitate Roki’s strategy to provide 3D design and real-time collaboration with clients worldwide. Roki is a worldwide leader in automotive filtration equipment, air and water purification systems, fuel cell systems and cogeneration filter systems. Roki’s PLM strategy with Aras will provide the foundation for achieving a 24-hour development cycle that eliminates lag between Roki’s multiple foreign R&D centers. For more information please visit http://www.roki-jp.com “We are very pleased that Roki has selected Aras for enterprise-wide PLM,” said Peter Schroer, President of Aras. “Roki has historically developed innovative and high-quality products that keep

MSC Software Corporation today announced that CEVT (China Euro Vehicle Technology AB) based in Gothenburg, Sweden, has used MSC Nastran advanced nonlinear to design and analyze the vehicle architecture of C-segment cars for Volvo Cars and Geely Auto. CEVT is focused on developing new modular architectures and key components for Volvo Cars and Geely Auto in the C-segment (small family car segment). The integrated set of engineering simulation solutions from MSC Software and MSC Nastran help CEVT with the advanced linear and nonlinear analysis required in the architecture development program. “The single model approach helps us save time and ensure our high quality standards. We are able to use the same data for NVH, Durability and Nonlinear Analysis,” says Anders Werner, Module Team Director CAE. A vehicle architecture is the integration of a set of common components, defined functional and performance limits, a set of common interfaces, a range of dimensional flexibility, as well as a common manufacturing system.