Keysight Technologies, Inc.introduced the Interconnect Test System (ITS), an advanced software solution, and the Interconnect and Network Performance Tester 1600GE (INPT-1600GE) hardware traffic emulator it runs on. This cohesive solution validates AI infrastructure, network components, and data center interconnects from 200GE to 1600GE, expanding on the capabilities of the recently announced Interconnect and Network Performance Tester 800GE benchtop. The ITS software runs on both the 800GE and 1600GE Interconnect and Network Performance Tester platforms. For decades, validating network interconnect performance required a manual, time-consuming process with limited or no automation and needed advanced programming skills to write scripts. That process also lacked a centralized system to organize and store interconnect data and reports, making tracking and replicating tests and configurations difficult. With the increasing diversity and scale of AI and data center interconnects, these traditional test methods cannot accurately predict and measure the reliability of today’s complex production networks. The new Interconnect and

Beck Technology, the leading preconstruction estimating software provider, announced the acquisition of Workpack (Workpack.ai). This innovative AI-powered takeoff solution enables construction cost estimators to complete takeoffs more than 50% faster than traditional 2D takeoff tools. This strategic acquisition reinforces Beck Technology’s commitment to advancing preconstruction workflows by integrating intelligent automation into the estimating and takeoff process. Workpack’s AI-driven technology can automatically detect walls, doors, windows, rooms, symbols, and more, with automated label matching for every object detected on 2D drawings — dramatically reducing manual effort and improving accuracy. "Speed and accuracy in takeoff are critical for winning bids and optimizing preconstruction workflows. By incorporating Workpack’s advanced AI technology, we’re giving estimators the ability to work faster and with greater precision than ever before,” said Norbert Orth, CEO of Beck Technology. “This addition boosts value for our customers and opens doors for AI to streamline other inefficiencies. Our goal remains clear: empowering customers with data-driven

For the 13th consecutive year, IMAGINiT Technologies has earned Autodesk Platinum Club Awards, reaffirming its reputation as a leader in delivering innovative business solutions supported by exceptional customer service. At Autodesk’s annual One Team Conference in Nashville, IMAGINiT received the 2025 Architecture & Engineering Cloud Partner of the Year Award for the United States and the 2025 Customer Success Partner of the Year award for its Canadian operations. “We are honored to receive these top Autodesk awards, as they reflect our unwavering commitment to investing in our customers’ success,” said Bill Zavadil, president and chief operating officer of IMAGINiT Technologies. “When we consistently provide value at every interaction, our customers see us as a long-term partner who’s fully invested in helping their business thrive. As we look ahead, our team remains focused on delivering strategic solutions and exceptional support to ensure our customers not only achieve their business goals but also feel confident

OPEN MIND Technologies AG, a leading developer of CAD/CAM solutions, is expanding its team in Sweden. Lennie Gustafsson, an experienced application engineer, is joining the team at the OPEN MIND Technologies Scandinavia AB subsidiary in Hässleholm. The CAD/CAM expert, with many years of experience in various manufacturing industries, Lennie Gustafsson aims to support the growing number of hyperMILL® users in making optimum use of the software. Lennie Gustafsson has more than 20 years of experience in the manufacturing industry. He began his career as a lathe and machining center operator before becoming a specialist in NC programming and CAD/CAM. Through his experience in various industries, he has gained first-hand knowledge of the requirements and challenges of modern manufacturing processes. Gustafsson will now apply this practical expertise to support hyperMILL® users in Sweden. "I am very pleased to join OPEN MIND and support users in making the best use of the software and further establish the market leading CAD/CAM

Roima Intelligence (“Roima”) is delighted to announce the appointment of Michael Hallén as Chairman. Michael has a long track record of success in B2B software, having most recently served as CEO of Vizrt, a global leader in software solutions for content creators. Michael was previously President & CEO of Qmatic Group, a leading provider of customer journey software and he has also served as CEO of IFS Group, a leading industrial software company. Michael currently chairs Vizrt NDI and is a board member of Schibsted Media. Michael will bring to Roima his considerable experience of leading the scale-up and internationalisation of Nordic enterprise software companies. Michael Hallén, Chairman of Roima, says:"Since I was first introduced to Roima I have been impressed by the professionalism and customer focus of the team. I’m pleased to have the opportunity to work closely with Markus and his team to further and accelerate Roima’s growth and

Zuken Inc. announced an agreement with IBM to join the IBM Research AI Hardware Center as a commercial member. The IBM Research AI Hardware Center, a global research hub headquartered at the Albany NanoTech Complex in Albany, NY, aims to develop next-generation chips and systems, including advanced semiconductor packaging, that support the processing power and unprecedented speed that AI requires. Zuken has also signed an agreement with IBM for the joint research and development of heterogeneous chip integration packaging solutions, which is critical for AI accelerator architecture. The collaboration will focus on 3-D integrated circuit (3DIC) packaging design for advanced semiconductors and optimizing Electronic Design Automation (EDA) workflows. Zuken will support the evaluation of a prototype deep learning accelerator core from IBM’s digital and analog projects. Additionally, Zuken will contribute to material development and processes modeling, and integration assembly methods for interconnecting multiple IC dies within a semiconductor packaging module. The agreement will

3D Systems Corporation announced its financial results for the fourth quarter and full year ended December 31, 2024.  Full-year 2024 revenue of $440 million, above lower end of guidance range, inclusive of a $9 million revenue reduction in Q4 driven by a change in accounting estimates for Regenerative Medicine program milestone recognition. This change in estimate is related to the now anticipated use of pre-clinical human decedent testing, successfully demonstrated by our partner, United Therapeutics, which led to refinement of the milestone technical criteria. Continued reduction in operating expenses in Q4 reflecting the company’s focus on cost savings and efficiency improvements. Announcement of a new cost reduction initiative expected to deliver over $50 million in incremental annualized savings related to actions taken throughout 2025 and the first-half 2026.  All regulatory approvals have been obtained for sale of Geomagic software platform, with a sale price of $123 million and targeted close in early April. Balance sheet

Kontron, a leading global provider of IoT technology, announced its results for the 2024 financial year. The company recorded significant growth in both revenue and result, reaching new record levels. In the 2024 financial year, Kontron increased sales by 37% to EUR 1,685 million (PY: EUR 1,226 million) or EUR 1,716 million taking into account principal revenues. The gross margin as a value-added indicator increased by 48.9% from EUR 466 million to EUR 694 million, or from around 38.0% in the previous year to 41.2%. Operating result (EBITDA) grew by 52.2% to EUR 191.8 million (PY: EUR 126.0 million) reaching a new record high. Despite the burdens from the purchase price allocation (PPA), consolidated net income after minority interests increased to EUR 90.7 million (PY: EUR 77.7 million) or EUR 1.47 (PY: EUR 1.23) per share, thus also marking a new record. Before the PPA amortization from the Katek acquisition, the

Aras, a leader in product lifecycle management (PLM) and digital thread solutions, announced the launch of an AI-Assisted Search and Intelligent Assistant services, integrating Microsoft Azure OpenAI Service and Microsoft Copilot Studio. These new capabilities transform how users interact with product data and PLM business processes, enabling engineers and product teams to quickly find, analyze, and act on critical information through scalable search and conversational AI. AI-Assisted Search allows users to quickly search across structured and unstructured data managed by Aras Innovator SaaS®. It provides seamless access to relevant engineering documentation, design files, and other essential product information. Aras’ new AI-Powered Intelligent Assistant will let PLM users interact with Aras documentation and knowledgebase using natural language. “Aras is committed to helping organizations manage complexity with greater speed and intelligence,” said Rob McAveney, CTO at Aras. “With AI-assisted search and copilot capabilities, we’re exposing data in a way that helps users make more informed

Ansys and GlobalFoundries collaborated to certify four Ansys photonic solvers, empowering engineers to simulate passive and active photonic components with high-fidelity in the GF Fotonix platform. Together, Ansys and GlobalFoundries enable access to reliable, multiphysics simulation solutions that address design challenges for a range of high-capacity chips — including those used in generative AI, autonomous vehicles, hyperscale data center communications, and IoT. GF Fotonix is a feature-rich and highly flexible silicon photonics platform and is the only commercially available foundry platform for the monolithic integration of photonic and electronic components with the option of a photonics-only flow. The photonic components include active devices such as Mach Zehnder and Micro-ring modulators and Germanium photodiodes, and passive components such as splitters, multi-mode interferometers, phase shifters/rotators, tapers, bends, and filters for wave division multiplexing. The platform allows designers to develop custom solutions for their system applications for high-speed optical communications to address their high-bandwidth, low-latency