Industry Summary Articles

Infor®, the industry cloud company, announced that Snellman, the Finnish and Swedish ready-made food and meat processor, will implement Infor’s cloud-based enterprise resource planning (ERP) system built on Amazon Web Services (AWS) to support its future growth and new business development. Infor CloudSuite Food & Beverage, a true multi-tenant cloud system, will…

Bricsys®, a leading provider of CAD technology, is announcing TES-EUROPE, a specialist in the planning, engineering and execution of exceptional transportation, has chosen BricsCAD® to power its logistics projects in France. The height of wind turbines has become increasingly taller to deliver higher megawatts and meet the growing demand of clean-energy solutions.…

Ansys has collaborated with TSMC to certify that Ansys RedHawk-SC™ and Ansys® Redhawk-SC Electrothermal™ are compliant with TSMC’s 3Dblox™ standard for the exchange of design data between different tools in a 3D-IC design flow. The TSMC 3DbloxTM standard unifies its Open Innovation Platform® (OIP) design ecosystem with qualified EDA tools and flows…

Ansys and TSMC continued their long-standing technology collaboration to announce certification of Ansys’ power integrity software for TSMC’s FINFLEX™ innovation as well as the TSMC N4 process. TSMC’s FINFLEX™ architecture allows Ansys RedHawk-SC and Totem customers to make fine-grained speed-power tradeoffs which reduce a chip’s power footprint without sacrificing performance. This is important…

Cadence Design Systems, Inc. announced that Cadence® RFIC solutions support TSMC’s N16RF Design Reference Flow and process design kit (PDK) to help accelerate the next generation of mobile, 5G and automotive applications. The continued collaboration between Cadence and TSMC allows mutual customers to design with Cadence solutions for TSMC’s N16RF mmWave…

Cadence Design Systems, Inc. announced the leading Cadence® Integrity™ 3D-IC platform has achieved certification for and met all reference design flow criteria for TSMC’s 3DFabric™ offerings, including Integrated Fan-Out (InFO), Chip-on-Wafer-on-Substrate (CoWoS®) and System-on-Integrated-Chips (TSMC-SoIC™) technologies. As part of the collaboration, the companies worked together to enable Cadence’s support of the TSMC 3DbloxTM standard…

DXC Technology, a leading Fortune 500 global technology services company, announced an expanded partnership with Dynatrace in which the Dynatrace® Software Intelligence Platform will become the preferred DXC Platform X™ software for observability and artificial intelligence-powered automated management of a customer’s IT estate. DXC Platform X is a data-driven, intelligent automation…

PROSTEP is launching the new version 1.2 of its OpenCLM solution for end-to-end digitalization and traceability. In addition to enhanced capabilities for cross-domain impact analysis, automated baselining and maturity monitoring, it provides even better support for the cross-enterprise exchange of structural and metadata for simulation. The new version is now…

Tecsys Inc., an industry-leading supply chain management software company, announces the launch of the industry’s fastest path to unified commerce through its rapid implementation methodology for Omni™ OMS, its robust cloud-native order management system. The six-week implementation methodology takes advantage of out-of-the-box integrations, operational accelerators including education, training and templated customer/vendor…

Trimble Access version 2022.10 software improves digital construction workflows, interoperability and delivers field-to-office enhancements to provide the flexibility to work the way you want in the formats you need for each project. To read the full details please go to the Trimble blog https://geospatialresources.trimble.com/blog/what-s-new-in-trimble-access-2022-10-software To view the original press release,…