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MathWorks, the leading developer of mathematical computing software, will exhibit at the upcoming European Microwave Week (EuMW) 2025 in Utrecht, Netherlands. EuMW is Europe’s premier microwave, RF, wireless, and radar event, bringing together thousands of engineers, researchers, and industry leaders. Attendees are invited to visit MathWorks at Booth A094 to explore interactive demos and attend a short course focused on emerging satellite communication and non-terrestrial network (NTN) technologies. To schedule a meeting with MathWorks at EuMW, visit mathworks.com/company/events/tradeshows/european-microwave-week-2025-form.html “Attendees will gain practical insights into how MATLAB® and Simulink® streamline RF system design — from antenna modeling and signal processing to hardware prototyping,” said Giorgia Zucchelli, Principal Product Manager, RF and Mixed-Signal, MathWorks. “Our booth demos and short course will showcase how engineers can reduce development cycles, improve system performance, and apply integrated modeling techniques to real-world challenges in radar, satellite communications, and wireless communications systems.” EXHIBIT BOOTH DEMOS (Booth A094) MathWorks will present three hands-on demonstrations that highlight how MATLAB

Rockwell Automation, Inc., the world’s largest company dedicated to industrial automation and digital transformation, will showcase its end-to-end autonomous manufacturing solutions at PACK EXPO 2025 in Las Vegas Sept. 29 – Oct. 1.  Amidst shifting consumer demand and evolving regulations, Rockwell will demonstrate how it helps CPG manufacturers extend autonomy from raw-material movement via its OTTO autonomous mobile robots (AMRs) into the production process through integration across the Rockwell portfolio. This integrated solution delivers greater speed, efficiency, and resilience in end-to-end operations. “Autonomous manufacturing is no longer a future concept, it’s here today,” said Steve Deitzer, VP Global Industry, Consumer Packaged Goods, at Rockwell Automation. “Every manufacturer is at a different point in their digital transformation, and we meet them where they are with practical, scalable solutions that unlock measurable value. At PACK EXPO we’re showing how end-to-end autonomy can reshape operations and strengthen business outcomes today.” Attendees who visit booths SL-13028 and SL-13022 can see

Alphawave Semi, a global leader in high-speed connectivity and compute silicon for the world’s technology infrastructure, announced the successful tapeout of the industry’s leading 64 Gbps UCIe™ die-to-die (D2D) IP subsystem on TSMC’s 3nm process technology. Building on its 36 Gbps Gen2 silicon success, this third-generation subsystem delivers a major advancement in performance and shoreline bandwidth density for the IP Ecosystem. With 64 Gbps per-lane uni-directional data rates, it enables the next generation of chiplet-based architectures for AI, XPUs, and data center systems, providing power-efficient, reliable multi-die SoC integration and seamless interoperability across the chiplet ecosystem. As the first 64 Gbps UCIe™ IP subsystem implemented on TSMC's 3nm process, this achievement positions Alphawave Semi as a leader in UCIe die-to-die connectivity technology. With enhanced 64 Gbps UCIe performance and reduced power consumption, the solution enables new applications, including optical connectivity for Co-Packaged Optics (CPO), which are essential for scalable systems and

Aurigo Software, North America’s leading capital planning software provider, announced a fully integrated solution that brings together Aurigo’s capital planning product with Autodesk Construction Cloud®, a comprehensive construction management solution that connects workflows, teams, and data across every stage of a project, from design and planning through building and operations. The new integration enables Autodesk’s facility owner and operator customers to seamlessly connect long-range strategy and funding decisions with downstream project execution.  Project teams can now integrate Projects, Budgets, Commitments, Change Orders, and Expenses between Autodesk® Build Cost Management and Aurigo Primus Plan for planned vs. actual performance updates. Recent data from the U.S. Census Bureau indicate that construction across multiple sectors of the economy is on the rise, including data centers, manufacturing, and healthcare. Planning and finance teams need modern tools to address the complexity of these capital programs. Capital owners who are already utilizing Autodesk’s best-in-class construction solutions will now be able to collect, prioritize, program, and track performance of their projects from their very inception, before any asset is designed or built. By moving the management of capital programs upstream, risks can be identified early, and returns on investments can be calculated more easily.  “With the integration, we are creating a single, connected

Cyncly, the world’s leading global provider of software and content solutions that help make amazing spaces for living, announced a partnership with Leap SalesPro, a leading in-home sales platform for remodelers and home improvement contractors. Manufacturers publishing products to FeneVision WEB can now sell products directly through distributors using Leap SalesPro. Cyncly will continue expanding its partner program, enabling manufacturers to publish once and distribute across multiple selling channels with full control and consistency. FeneVision WEB CONNECT, available as an add-on to FeneVision WEB, gives manufacturers the power to integrate their product catalogs directly with leading selling tools. By making accurate product data and pricing available inside the dealer’s preferred in-home selling solution, WEB CONNECT: Accelerates estimates with precise, up-to-date product configurations. Improves customer relationships by simplifying how dealers and contractors access catalogs without leaving their selling tools.  Increases shop floor efficiency by reducing errors and minimizing manual data entry between quote, sale and production. “Our goal

Emerson, an industrial technology leader delivering advanced automation solutions, has introduced Guardian™ Virtual Advisor, an AI-powered software solution to support end-to-end lifecycle management. Emerson’s Guardian Virtual Advisor combines AI with deep domain expertise to help customers rapidly evaluate and enhance the performance of their automation systems, driving smarter decisions and operational excellence. Lifecycle services provide a comprehensive approach for industrial customers to support and maintain operations throughout the entire lifecycle of a plant – helping them maximize uptime, address operational inefficiencies and protect their automation investments. Frost & Sullivan estimates the industrial space has more than $1 trillion in operational losses globally, driving greater demand for lifecycle services. For over two decades, Emerson’s Guardian Digital Platform has accumulated a vast repository of troubleshooting information – but searching articles and reference documents is a manual approach that slows down quick responses to developing issues like performing system maintenance or managing security updates or new software releases.

ENCY Software announced the market release of ENCY Hyper, the company’s next-generation system for programming and simulating industrial robots and auxiliary equipment. ENCY Hyper blends the flexibility of offline programming with the responsiveness of real-time methods in a streamlined workflow designed for tablets and industrial PCs. The product will be officially presented at EMO Hannover 2025. What ENCY Hyper is — at a glance Next-generation programming & simulation. A hybrid system for industrial robots and auxiliary equipment that merges offline precision with real-time responsiveness in a touch-optimized workflow. Key capabilities: real-time robot and sensor feedback; AI-powered auxiliary tools; built-in collision avoidance; complete digital twin of the robotic cell; easy multi-brand robot calibration and programming from a single interface. Use it solo or together with ENCY Robot. ENCY Hyper can be used independently for pick-and-place, palletizing, packaging, or assembly — or seamlessly paired with ENCY Robot for advanced applications like milling, welding, spraying, or grinding. Unified, interactive environment. The

Siemens Digital Industries Software announced the latest updates to its Simcenter™ Testlab™ software, including new AI-assisted workflows that accelerate modal analysis processes by up to 7x faster while reducing the personnel needed to perform physical impact testing. Updates also bring automated data capture and processing, improving data quality and consistency across all testing phases - enabling engineers to test faster, smarter and earlier than ever before. “Siemens consistently delivers on its commitment to leveraging AI to streamline processes and workflows, minimize manual tasks, and accelerate time to market throughout the engineering lifecycle. The latest enhancements in Simcenter Testlab illustrate our approach to integrating AI in order to transform how teams conduct, manage, and interpret physical testing," said Jean-Claude Ercolanelli, Senior Vice President, Simulation and Test Solutions, Siemens Digital Industries Software. "We are leading a significant shift in engineering practices, from design and development through to the essential stages of physical testing." At

Tebis introduces its revolutionary Tebis SmartOps Technology, an innovative solution for automating design and CAM processes, specifically developed to address the requirements of single-part manufacturing. Users benefit from a unique combination of speed, flexibility and process reliability, providing a genuine shortcut to success thanks to consistently reproducible results. Single-part manufacturing demands rapid, precise solutions—both on the machine and throughout the CAD/CAM process. Tebis SmartOps automates recurring work tasks, significantly reducing the workload on teams. The result: reduced time pressure, increased process reliability, safer manufacturing, and enhanced flexibility for employees. Working with Tebis SmartOps: Automated, flexible, simple and fast Tebis SmartOps Technology automates CAD/CAM processes through intuitive, dialog-driven workflows that run nearly autonomously. Users maintain full flexibility to make manual adjustments when needed. Its user-friendly interface speeds up NC programming, while Tebis’s end-to-end solutions simplify and automate subsequent production steps. Modular and scalable: Ideal for all manufacturing needs SmartOps supports custom configuration: For instance, individual functions

Tech Mahindra, a leading global provider of technology consulting and digital solutions to enterprises across industries, unveiled TechM Orion Marketplace, an Agentic AI marketplace that offers a robust ecosystem of intelligent, autonomous and action-oriented AI agents that collaborate, evolve, adapt, and scale. TechM Orion Marketplace is engineered to centralize AI governance, reduce the cognitive load on employees, and enable AI agents to operate autonomously across complex workflows. TechM Orion Marketplace leverages advanced Agentic AI frameworks, large language models (LLMs), and machine learning algorithms to provide customized solutions for a wide range of enterprise applications across industries. It empowers agents with faster time-to-value, reduces operational costs, ensures sustained competitive advantage and unlocks measurable business impact. It further ensures intelligent automation is deployed with the right governance while providing scalable AI solutions that continuously learn from process data to accurately predict future scenarios and outcomes. Birendra Sen, President – Business Process Services, Tech Mahindra, said, “Most enterprises