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Nano Dimension Ltd. (“Nano Dimension” or the “Company”), a leader in Digital Manufacturing solutions, announced its 2024 financial results and shared its 2025 strategic outlook. Letter from Ofir Baharav, CEO: Dear Shareholders, I am pleased to share an update with you on our 2024 financial results and strategic outlook. 2024 marked the beginning of transformative change for Nano Dimension. The Company’s Board of Directors was fully reconstituted following strong shareholder support for an independent slate. Together with a refreshed management team, we’ve assembled a leadership group built for this moment - combining deep expertise in technology, manufacturing, commercial strategy, operations, and governance. We are united by our shared commitment: To steward your capital responsibly and create lasting shareholder value. To This Point of Transformation Over the past few months, I’ve visited nearly every site across the Company, including those of Desktop Metal and Markforged. I’ve met with teams across all functions and levels - listening, learning,

PTC reported financial results for its second fiscal quarter ended March 31, 2025. "Q2 was a solid quarter for us, and I remain extremely optimistic about our position as an enabler of the digital economy – particularly our position as a supplier of software tools that make our customers more efficient as they design, manufacture, and service their products," said Neil Barua, President and CEO, PTC. "While the current macroeconomic uncertainty makes it challenging for us to predict precisely how our customers will react, PTC is in a better position today to meet our customers' demand than ever before. I am confident that PTC can help our customers navigate this period by accelerating their continued transition into the digital age," concluded Barua. Second Fiscal Quarter 2025 Highlights Key operating and financial highlights are set forth below. The definitions of our operating and non-GAAP financial measures and reconciliations of non-GAAP financial measures to comparable GAAP measures

Ansys announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability of advanced semiconductor systems for the most demanding applications — including AI chips, graphic processing units (GPUs), and high-performance computing (HPC) products. Intel Foundry and Ansys have also enabled a comprehensive multiphysics signoff analysis flow for Intel Foundry’s EMIB technology used for creating multi-die 3D integrated circuit (3D-IC) systems.. Recognized as industry-leading solutions, RedHawk-SC and Totem deliver speed, accuracy, and capacity to analyze the power integrity and reliability of Intel 18A RibbonFET Gate-all-around (GAA) transistors with PowerVia backside power delivery. For scalable electromagnetic analysis, Ansys is introducing HFSS-IC Pro, a new addition to the HFSS-IC product family. HFSS-IC Pro is certified for modeling on-chip electromagnetic integrity in radio frequency chips, WiFi, 5G/6G, and other telecommunication applications made with the Intel 18A process node.  EMIB facilitates 3D-IC for high-performance microprocessors, heterogeneous

Cadence announced a significant expansion of its portfolio of design IP optimized for Intel 18A and Intel 18A-P technologies and certification of Cadence® digital and analog/custom design solutions for the latest Intel 18A process design kit (PDK). These advancements are being showcased today at Intel Foundry Direct Connect, underscoring Cadence’s continued leadership in driving industry innovation for artificial intelligence and machine learning (AI/ML), high-performance computing (HPC) and advanced mobility applications through its strategic partnership with Intel Foundry. Cadence has collaborated closely with Intel Foundry to design and optimize a comprehensive range of solutions that fully leverage the innovative features of the Intel 18A/18A-P nodes, including RibbonFET Gate-all-around transistors and PowerVia backside power delivery network. With this collaboration, joint customers can achieve exceptional power, performance and area (PPA) efficiencies, accelerating time to market for cutting-edge system-on-chip (SoC) designs. The latest additions to Cadence’s broad portfolio of design IP in Intel 18A/18A-P technologies are available

Deltek, the leading global provider of software and solutions for project-based businesses, announced that its flagship ERP offering, Costpoint GovCon Cloud Moderate (GCCM), has completed its assessment for FedRAMP Moderate Equivalency - a key component to support cybersecurity compliance requirements for government contractors. This Department of Defense (DoD) standard allows cloud service providers to demonstrate full, validated FedRAMP Moderate security without the need for federal agency sponsorship. Deltek produced an official Body of Evidence and engaged with Schellman Compliance, a leading FedRAMP-recognized Third Party Assessment Organization (3PAO), to conduct its FedRAMP Moderate assessment – a DoD-specific requirement for DFARS 252.204-7012 compliance and, eventually, Cybersecurity Maturity Model Certification (CMMC). Customers can now validate Deltek’s FedRAMP Moderate Equivalency by requesting and reviewing the Body of Evidence and 3PAO assessment. “FedRAMP Moderate Equivalency is a massive win for Costpoint GCCM customers. For decades, Deltek has been known as the industry leader in project-based software, and now we are leading the shift

Planera, the leader in visual CPM-based construction scheduling, announced that its simple yet powerful construction scheduling solution is now available for iPad users. This important new capability makes it easy for project team members in the field to contribute to the creation of field schedules for pull planning and to update the status of those schedules on the job site.  Historically, there has been a disconnect between schedules created in the office and the planning that actually happens in the field. The office-created schedules are often built to meet contractual requirements—not to guide day-to-day work—and they’re rarely updated in real time. Meanwhile, superintendents and trades rely on spreadsheets or whiteboards to plan the work, making adjustments on the fly. As a result, the master schedule becomes a formality, not a functional planning tool—leaving teams to improvise without a reliable source of truth. The visual, collaborative, and now portable nature of Planera will

Rockwell Automation, Inc., the world’s largest company dedicated to industrial automation and digital transformation, announced its Security Monitoring and Response service, which is purpose-built to deliver continuous, real-time monitoring of operational technology (OT) environments. Security Monitoring and Response seamlessly integrates into existing architecture to help industrial organizations stay ahead of cyber threats and build resilient operations. Securing OT environments is getting more complex due to increasing industrial cybersecurity incidents, vulnerabilities and talent shortages. The recent State of Smart Manufacturing report found cybersecurity risks and a shortage of skilled workers were both among the top 5 external obstacles for critical manufacturing. “As cyber risk continues to increase, manufacturers need constant vigilance and the right expertise to stay ahead of evolving threats. But they often lack the resources to do so," said Nick Creath, cybersecurity services lead product manager at Rockwell Automation. "Security Monitoring and Response provides the visibility, intelligence and rapid action required to safeguard industrial

At the Intel Foundry Direct Connect 2025 event, Synopsys, Inc. announced broad EDA and IP collaborations with Intel Foundry, including availability of its certified AI-driven digital and analog design flows for the Intel 18A process node and production-ready EDA flows for the Intel 18A-P process node with RibbonFET Gate-all-around transistor architecture and the industry's first commercial foundry implementation of PowerVia backside power delivery. To drive multi-die design innovation forward, Synopsys and Intel Foundry are collaborating to enable Intel's new Embedded Multi-die Interconnect Bridge-T (EMIB-T) advanced packaging technology with an EDA reference flow powered by Synopsys 3DIC Compiler. With its EDA flows, multi-die solution, and broad portfolio of Synopsys' foundation and interface IP on Intel 18A and Intel 18A-P, Synopsys is helping designers accelerate the development of highly optimized AI and HPC chip designs from silicon to systems. In a keynote presentation at today's event, John Koeter, Senior Vice President, for the Synopsys IP Group, emphasized: "The successful collaboration between Synopsys and

Centric Software’s end-to-end concept-to-commercialization solutions like Centric PLM™ mitigate uncertainty caused by tariff activity. Centric Software® provides the most innovative enterprise solutions to plan, formulate, develop, procure, manufacture and sell consumer goods products in cosmetics & personal care, food & beverage, fashion and multi-category retail to achieve strategic and operational digital transformation goals. Recent tariff activity has affected cosmetics & personal care companies, resulting in fluctuating ingredient and packaging costs. Changes in regulations are happening day-by-day and companies must figure out how to absorb the rise in costs or adjust pricing strategies to pass increases on to consumers. Centric Software’s wider end-to-end product lifecycle platform, Centric PLM integrates with all Centric Software solutions including Centric Market Intelligence™ and Centric PXM™. All Centric Software solutions, infused with AI optimization as a natural evolution of trusted rule-based methods, target the unique challenges faced by the retail sector and deliver comprehensive, data-driven decision-making for modern retail

Ann Arbor, Michigan, USA 1 May 2025—CIMdata, Inc., the leading global research, consulting, and education firm specializing in Product Lifecycle Management (PLM) and the Digital Transformation it enables, announces its participation in an upcoming web dialogue, “What’s Next for PLM? A 3DEXPERIENCE Dialogue with CIMdata.” Sponsored by GoEngineer, this virtual discussion is set to take place on Wednesday, 21 May, at 3:00 PM EDT. For this session, GoEngineer’s Product Manager Cody Salyer, will be joined by CIMdata’s Vice President, Stan Przybylinski, to talk about current Product Lifecycle Management (PLM) demands and proven strategies to address these needs using tools such as 3DEXPERIENCE. The interactive session will focus on several key topics at the forefront of the current PLM landscape, including: What is PLM today? The growing need for the Digital Twin and Digital Thread. Cloud vs traditional On-Prem: choosing the right deployment model. Supply Chain Management up and down your value network. The importance of picking