Neues

Altair today announced that it has completed the acquisition of Multiscale Design Systems, LLC, developer of MDS, a family of products focused on micromechanics, microstructural optimization, and life prediction of complex materials.  The company's technology integrates modeling, simulation, testing, uncertainty quantification, and optimization of composite materials and structures at multiple spatial and temporal scales. Known for its mathematical rigor and versatility, MDS will bring important new composites expertise to the Altair HyperWorks® suite, including multiscale analysis, stochastic design, fatigue analysis, and multiphysics simulation.  A member of the Altair Partner Alliance since last year, MDS is already available to HyperWorks users, along with a number of other cutting-edge technologies related to composite materials analysis and simulation.  A much tighter integration with Altair solvers RADIOSS® and OptiStruct® is expected in future. "We will continue to develop, enhance, and invest in MDS as part of HyperWorks while retaining an open architecture approach with respect to other 3rd party solvers," said Uwe Schramm, Chief

Synopsys, Inc. today announced that TSMC has concluded 16-nanometer FinFET Plus (16FF+) v1.0 certification and reached the first milestone of 10-nanometer (nm) certification based on the most current DRM and SPICE model on a comprehensive list of Synopsys' custom and digital design tools.  This certification enables mutual customers to deploy tools in Synopsys' Galaxy™ Design Platform for 16-nm production designs and 10-nm early engagements. The certified platform delivers technologies including routing rules, physical verification runsets, signoff-accurate extraction technology files, statistical timing analysis that correlates with SPICE, and interoperable process design kits (iPDKs) for FinFET processes. TSMC and Synopsys have collaborated to enhance new tool features based on both 16-nm and 10-nm technology requirements in Synopsys' IC Compiler™ II place and route solution with TSMC validation.  This includes full-flow color enablement, support for connected poly on gate oxide and diffusion edge (CPODE) technology, layer optimization, low Vdd timing closure and support for signal

ANSYS, Inc. announced today that its ANSYS® RedHawk™ and ANSYS Totem™ products are certified by TSMC for the most current version of 10-nanometer (nm) FinFET Design Rule Manual (DRM) and SPICE models, addressing the power and performance requirements for mobile, computing and networking applications. TSMC has certified these solutions for static and dynamic voltage drop analysis and advanced signal and power electromigration (EM) verification to meet the 10-nanometer requirements. Complex device structure and high drive currents in FinFET devices make power integrity and EM key design requirements. With innovative algorithms and analysis engines, ANSYS solutions deliver needed accuracy while reducing turnaround time to meet the increased computational requirements caused by modern products' growing design complexity. Advanced technology support in RedHawk and Totem, including EM rule compliance and color-aware resistance extraction, help deliver greater reliability and manufacturability.  "The certification of RedHawk and Totem for 10nm FinFET technology ensures our products' ability to deliver the accuracy required

BIMobject® unveil the release of Private Cloud 2.0. This new version has features which gives extended capabilities for manufacturers that use digital product catalogues based on building information modelling – BIM. The new Private Clouds 2.0 are very powerful, easy to update, analyse and maintain, they have responsive web and language settings, are customisable and easy to integrate. They make life easier for any web developer or marketing department which no longer need to develop their own catalogue system for BIM objects and other digital content. The Private Clouds 2.0 serve as a premium online product catalogue for manufacturers in need of a modern and effective way to market their products. In parallel, it is a smarter way for manufacturers to manage their digital content in a controlled way as this service enables a future proof digital content management strategy. Private Clouds 2.0 are a part of the BIMobject Cloud platform that

PTC today announced that it expects revenue for the second quarter FY’15 ended April 4, 2015 to be slightly above the mid-point of the $305 million to $320 million guidance range. License & Subscription Solutions (L&SS) revenue is expected to be slightly below the mid-point of the $80 million to $95 million guidance range. The Company expects Subscription Solutions bookings, as a percentage of L&SS bookings, to be slightly below 15% for the second quarter FY’15 and above 15% on a year-to-date basis. In addition, PTC announced that it is realigning its global workforce to increase investment in its Internet of Things business to capitalize on the substantial growth opportunity in that market and to reduce its cost structure through organizational efficiencies in the face of significant foreign currency depreciation relative to the U.S. dollar and a more cautious outlook on potential global macroeconomic conditions. The Company expects to reduce its annualized

Fujitsu announced that Fujitsu Forum 2015, the company's largest annual event, will be held May 14-15 at the Tokyo International Forum in Japan. The theme of this year's Fujitsu Forum will be Human Centric Innovation in Action. By working with customers to build new ecosystems and realize innovation, Fujitsu seeks to create a prosperous future where people can live their lives in comfort and security. Fujitsu Forum 2015 will introduce new and effective ways to use ICT, including examples of Fujitsu's own internal deployments. With rapid advances in digitalization and evolving technologies, the world is becoming ever more closely connected. In addition to enhancing people's lives and making them more convenient, this trend is bringing significant changes to business and the management environment, presenting new opportunities for companies to grow beyond the bounds of traditional frameworks. On the other hand, there are also numerous challenges that threaten society's sustainability, such as issues related

Aras® today announced presentations and roundtable discussions with Amscan, Boeing Insitu, Gentex, GETRAG, Imperial Tobacco Group, Nidec Motor Corporation, Sonnax and others at the ACE 2015 conference. Sessions will revolve around the conference theme Rethink PLM, and sessions are designed to encourage interaction, learning and networking. Details, agenda and registration at http://www.aras.com/ACE2015 Topics will include systems engineering, visual collaboration, enterprise change, supplier collaboration, manufacturing & quality, Agile implementation techniques and more. Global leaders will discuss how they have transformed their business and driven their PLM strategy with Aras to get results. ACE 2015 is the best place to benchmark and collaborate with other forward thinkers on new approaches. Sessions are designed to encourage peer-to-peer interaction, so attendees can find out how others are approaching complex PLM challenges and get ideas to bring back to their own companies to implement. Attendees will also have the opportunity to participate in product workshops and roadmap discussions to

CoreTech System (Moldex3D) Co., Ltd, announced a donation of a $1.625 million gift to support education and research at the Clemson University International Center for Automotive Research (CU-ICAR). The gift includes 25 seats of the latest Moldex3D Advanced package and Solution Added-on modules including Fiber and MuCell® that will provide hands-on training for students, faculty and professionals in Clemson’s Automotive Engineering Academic Program. Clemson will be one of the first universities in the Southeast that incorporate Moldex3D into their academic curriculum and training for industry personnel. “I am thrilled to have Moldex3D as the newest corporate partner for CU-ICAR, and I thank them for their support,” said Clemson University President James P. Clements. “They are true industry leaders, and I know that our students and faculty in automotive engineering will benefit greatly from being able to use and learn from their software.” Dr. Anthony Yang, President of Moldex3D Northern America, said it is our responsibility to assist the academic world in nurturing the next

3D Systems announced today that it acquired Easyway Design and Manufacture Co. in China, including its wholly owned subsidiaries comprising the Easyway Group, creating 3D Systems China. Easyway is a leading Chinese 3D printing sales and service provider with key operations in Shanghai, Wuxi, Beijing, Guangdong and Chongqing. Terms of the transaction were not disclosed. “We are excited to become part of 3D Systems, a leading provider of the most complete portfolio of 3D digital design and fabrication solutions available today,” said May Zhou, General Manager, Easyway. “We plan to leverage our collective knowledge and experience for the benefit of our customers by building a stronger local presence and immediately delivering the full range of 3DS products throughout China.” Easyway brings to 3DS extensive and experienced greater China sales and service coverage, substantial service bureau production capabilities and long-term, key relationships with leading Chinese automotive, medical and consumer goods companies, including VW, Nissan, Philips,

PROSTEP presents version 5.1 of PDF Generator 3D. It not only allows the conversion of 3D models from the latest versions of CATIA V5, Siemens NX 10, Autodesk Inventor 2015, Solid Edge ST7, Creo Parametric 3.0, Parasolid 27, SolidWiorks 2015 and JT 10 but, thanks to PLM XML, also enables PLM structures to be transferred directly to PDF documents, thus allowing an even greater degree of integration in enterprise processes. The new version of PROSTEP PDF Generator 3D offers a number of improvements when reading in and processing CAD data from CATIA, Creo and NX, as well when displaying PMI information from SolidWorks. Textures from Autodesk Inventor and SolidWorks are now also displayed correctly. Furthermore, the new version can be used to import and visualize movement patterns from Dassault Systèmes applications like CATIA and DELMIA directly in 3D PDF documents. This makes the visual communication of manufacturing and assembly information easier. The