Position Papers

Visual 2000 International, end-to-end omni-channel business solutions provider for the apparel, footwear and accessories (AFA) industry, has announced its sponsorship of the Product Innovation (PI) Apparel Congress, scheduled to take place on June 27-28, 2016, in New York City.  PI Congress is a gathering of AFA professionals to discuss and promote innovation using modern technologies, such as 3D printing, virtual reality and sustainability.  “PI congress is a one-of-a-kind opportunity to discover and share new industry developments among other fashion-focused companies,” said VP of Research & Development Charles Benoualid. “As a supplier of apparel specific software, we are excited to showcase the new features in our own software suite and discover how companies are using PLM and other software suites to innovate their business processes.”  The scheduled talks at the event will address a broad range of topics that will touch upon all aspects of the apparel industry. A key area of

The Borlas consulting group and DATADVANCE – a developer of predictive modeling, intelligent data analysis and multidisciplinary optimization software in Russia, present the solution integrating pSeven, the software package for engineering analysis and optimization by DATADVANCE, and Teamcenter®, the product lifecycle management system developed by Siemens PLM Software. This joint solution allows to automate design procedures, analyze engineering data, and perform design optimization in the integrated pSeven and Teamcenter environment, including the capability to work with Teamcenter’s design parameters and methods. The new solution lowers the time and resource requirements in product data analysis and design optimization and also reduces the probability of errors that occur due to data loss during the development of new engineering workflows. Accessing design data does not require additional software, allowing customers to save on hardware and software resources. The primary goal of integrating pSeven with Teamcenter is to enable solving design optimization

Webinar will focus on the options available for unleashing product data to the enterprise. ANN ARBOR, Michigan, 24 June 2016—CIMdata, Inc., the leading global PLM strategic management consulting and research firm, announces that Gerard Litjens, Director of European Operations, will take part in a webinar to discuss ways to democratize product information so that it is provided to everyone who needs it, when they need it, and throughout the product lifecycle. In this webcast, “PLM for All: Unleashing Product Data to the Enterprise,” attendees will learn how leveraging product data across teams will drive better actions and decisions that can provide significant business value. The webinar, which is hosted by PTC, will take place on Thursday, 30 June, 2016 at 14:00 CEDT. To register, visit http://bit.ly/WebinarmitCIMdata

Centric Software is pleased to announce the availability of its brand new Field Testing mobile app in iOS. This new app works seamlessly with Centric’s PLM platform or, alternatively, can be used as a stand-alone solution. Centric’s Field Testing app is a new innovation and unique on the market. It is designed to help apparel, footwear and outdoor companies both track the usage and performance of prototypes and samples of clothing, footwear and hard goods. Early stage prototypes are particularly costly; at times thousands of dollars each to produce. Prototypes and samples are typically tested in the field, especially for performance wear; worn or used by sponsored athletes, internal teams or others. Humberto Roa, VP of Innovation at Centric Software explains, “Tracking the location and availability of prototypes and, ultimately wear tester performance feedback is critically important yet typically accomplished with a mishmash of methods. Centric’s new Field Testing app

Camtek Ltd. today announced the launch of an innovative inspection method for Fan-Out Wafer Level Packaging (FOWLP). This new inspection method compares the image acquisition of the dies on the reconstructed wafer with the computer-aided design (CAD) data used in fabricating the wafer. Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "Camtek has more than 25 years of experience working with CAD data in our Automated Optical Inspection (AOI) systems for the PCB industry. The development of this new method for the inspection of Fan-Out applications is based on this experience and accumulated know-how." Continued Mr. Langer: "Industry experts expect Fan-out wafer level packaging technology to grow in excess of 30% annually over the coming years. The Fan-out packaging process imposes many inspection challenges, especially due to alignment issues. We believe that using the CAD as a reference for detecting the reconstructed wafers will make our Eagle

International TechneGroup Limited (ITI) will be exhibiting at the Farnborough International Airshow in the UK, 11-17 July. ITI will be on the Midlands Aerospace Alliance stand 1/B90 showcasing their engineering data interoperability solutions which significantly benefit the aerospace industry.  “Aerospace customers demand that their engineering and manufacturing technologies enable interoperability from design to sustainment,” commented Tom Gregory, CEO of ITI. “ITI is in a unique position to offer CAD migration, validation, and integration solutions that can be applied across the product lifecycle. No other company has the level of experience and focused approach to solving interoperability issues. Our team welcomes the opportunity to talk with customers at Farnborough about their unique and often demanding requirements.” Farnborough International takes place every two years and is the largest trade event for the global aerospace community. 1,500 diverse exhibitors from core sectors of the aerospace industry are scheduled to participate, with over 100,000

Washington State University today announced it received an in-kind software grant from Siemens PLM Software. The in-kind grant gives WSU students access to the same technology that companies around the world depend on every day to develop innovative products in a wide variety of industries including automotive, aerospace, machinery, shipbuilding, high-tech electronics and many more. Graduates with this type of software training are highly-recruited candidates for advanced technology jobs. The in-kind grant was provided by the Siemens PLM Software’s academic program that delivers PLM software for schools at every academic level. Siemens PLM Software is a leading global provider of product lifecycle management (PLM) software and services. The in-kind grant for WSU includes Siemens PLM Software’s NX™ software, a leading integrated solution for computer-aided design, manufacturing and engineering (CAD/CAM/CAE). “By using the same technology in the classroom that is used by companies all over the world to develop a wide variety of

Combining Silicon Valley’s entrepreneurial spirit with its own engineering expertise, Siemens today announced that it will add a new focus in industrial Augmented/Virtual Reality to its startup Frontier Partner. The Frontier program currently supports startups in the areas of 3D printing and Robotics – granting manufacturing-focused startups access to Siemens’ PLM software, its technology partner program and other developmental resources. Today’s announced expansion into Augmented/Virtual Reality is a strong indicator of the success of Frontier’s approach and further demonstrates the leading role that Siemens is taking with innovations in Advanced Manufacturing. “Digitalization is transforming industries across the globe, shortening innovation cycles even as products become more complex,” said Chuck Grindstaff, CEO and President, Siemens PLM Software. “We are helping our customers, in industries from autos to aerospace to consumer electronics, transform their operations. From ideation to realization and utilization, and from the top floor to the shop floor, our customers are creating digital enterprises with the

Bentley Systems, Incorporated today announced that it has successfully upgraded Crossrail’s Common Data Environment (CDE) for asset information through Bentley’sAssetWise managed services to a hybrid cloud-computing platform powered by Microsoft Azure. This provides a single location for storing, sharing, and managing information for approximately 1 million assets. Europe’s largest construction project, Crossrail has been designed in a virtual environment for 3D, 4D, and 5D BIM, powered by Bentley’s comprehensive modeling software. Bentley’s asset information management solution, AssetWise, based on Bentley’s eB technology, manages the engineering and asset information in the Crossrail project and provides a complete, federated view of “digital railway” information. “Crossrail is leading the world in demonstrating the value of BIM to realize greater efficiency and cost effectiveness in project delivery and asset lifecycle information management,” said Alan Kiraly, SVP, Bentley Systems. “We’re proud of our work together with Bentley Systems, one of our most important global collaborators,” said David Epp, Alliances Director,

“Siemens has long been known for its market-leading Teamcenter PLM suite. This week, the company added another memorable name to its portfolio: Simcenter 3D. This new solution is based in large part on Siemens’ recent acquisitions of the simulation and CAE solutions LMS and CD-adapco, in combination with the company’s existing computing and analysis tools such as Nastran and Femap. Using this software, Siemens has laid the groundwork for a platform that could put them ahead of the pack in terms of engineering and simulation capabilities. Simcenter 3D is the clear manifestation of the company's vision around this goal, and the first step on the road to a ‘next-generation’ CAE platform. According to Peter Bilello, president of PLM analysis firm CIMdata, ‘Manufacturers are under a great deal of pressure to evolve their product engineering practices to meet new challenges, or risk becoming obsolete.’…” Read the full article here: http://www.engineering.com/PLMERP/ArticleID/12458/PLM-This-Week-Siemens-PLM-Releases-End-to-End-Simulation-Platform.aspx