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 PDF Key takeaways: This biennial NAFEMS conference reaffirms the growing importance of engineering modeling and simulation across all industries and domains System Modeling and Simulation is becoming a key element in enabling the growth of the new paradigm of Model-Based Systems Engineering (MBSE)—“Thinking of a product as the sum of a number of interdependent systems” With its mini-symposium on “Democratizing CAE,” NAFEMS demonstrates a clear commitment to provide a platform for educating not just highly trained simulation experts but every engineer who uses simulation as a design tool Over 320 people met in Seattle, coinciding with the 100th anniversary of Boeing, for the 2016 NAFEMS Americas Conference. This event brought together end users, software and service providers, academics, and key associations and organizations from across many manufacturing industries, academia, and government. The attendance was a record for any NAFEMS regional event, with more than double the participants over the 2014 conference. The event showcased over

Infor today announced the availability of the next generation of Infor Fashion Product Lifecycle Management (PLM), a solution developed to help meet specific needs and nuances of the retail, apparel and footwear industries. Infor Fashion PLM is designed to help organizations enhance speed and agility to assist with rapid adjustment to what's happening in retail. Infor Fashion PLM is designed to help retail companies with faster innovation, quicker response times and more informed decision-making. Infor Fashion PLM was created using the latest Infor technologies to help fashion brands, manufacturers and private brand retailers develop styles more quickly and efficiently. The application can help link certain, vital areas of the fashion supply chain to the business - from line planning, design and development to sourcing, production, inventory management, customers and distribution. The newest generation includes a bi-directional Adobe™ Illustrator plugin, which can help designers focus more on product innovation and adding

3D pioneer Browzwear and upstart Wink Software LLC will partner to demonstrate their integration of a 3D tool with an innovative view of effective workflow at the upcoming PI Apparel event on Jun 27-28 in New York. Wink Software will unveil its BeProduct™ Social Product Development (SPD) platform. This fresh new approach to leveraging cloud and social media technologies promises to improve the way fashion and consumer goods develop products by simplifying the user experience and enabling new levels of collaboration. The latest innovation from longtime fashion systems developer and former Yunique Solutions Inc. founder Daniel Pak, BeProduct automates many of the time-consuming tasks and upkeep that limit the effectiveness of manual, spreadsheet, email and PLM-managed processes, while taking into consideration and applying the increasing use of 3D tools in the industry. Browzwear CEO Sharon Lim says “Product development driven by 3D and then going back to 2D data workflow

NGC Software today announced that Destination XL Group, Inc. (DXL) is implementing NGC’s EZ-Ship Scan/Pack Solution. DXL will use EZ-Ship to reduce chargebacks and packing errors by validating the contents of each carton and shipment sent from the retailer’s factories. The retailer, who also utilizes NGC’s fashion PLM, is the largest omni-channel specialty retailer of big and tall men's apparel. DXL is planning to roll out EZ-Ship, a factory-level scan/pack solution with electronic data exchange (EDI), at a dozen factory locations. DXL’s latest work with NGC builds on the success of its PLM implementation, which has helped streamline DXL’s design and sourcing operations, ensuring that DXL’s products meet the needs of its diverse customer base of larger men. NGC’s fashion PLM software has brought new efficiency to DXL’s design process. It enables much more frequent and timely communications with suppliers, while also reducing cost and improving product quality. NGC EZ-Ship interfaces

Premier Farnell today announces that, together with its wholly owned subsidiary Celdis Limited, it has completed the sale of Cadsoft Computer GmbH (“Cadsoft”) and the assets used in connection with the sale of Cadsoft products in the US (together “the Business) to a subsidiary of Autodesk Inc. (“Autodesk”). Cadsoft is a software development business that produces electronics design software that Autodesk will add to its software portfolio. Premier Farnell will continue to distribute the Cadsoft product on behalf of Autodesk. This action follows an operational review, initiated in July 2015, which concluded that Premier Farnell would look to strategically refocus its portfolio and concentrate on its core distribution business, while also reducing its net debt. The net proceeds of the disposal will have the effect of reducing Premier Farnell’s reported net debt position as at 31 January 2016 by approximately 8%. To view the original press release, please click here. Search for

WISeKey, a Swiss based cyber security company, today announced plans to help secure Internet of Things (IoT) devices with SAP. The collaboration aims to allow the integration of WISeKey’s Managed Cryptographic Root of Trust secure IoT Edge Device with devices leveraging SAP HANA® Cloud Platform for the Internet of Things (IoT). The collaboration will provide increased security of IoT devices when connecting to SAP solutions for the IoT. Having sensors connected to everything does not necessarily enable monetization or customer value. Companies and consumers can realize value and enable monetization when they can certify that they are receiving authenticated and secure sensor data, gain insight from it and propose appropriate actions as needed. Carlos Moreira, WISeKey’s CEO noted, “This new collaboration is indicative of WISeKey's broad and continuously expanding cyber security IoT offerings, as we are placing significant emphasis on strategic relationships to increase penetration and boost sales with established

Synopsys, Inc. today announced a multi-year extension of its OEM agreement with Lattice Semiconductor Corporation for Synopsys' Synplify Pro® FPGA synthesis tools. With this agreement, Synopsys continues to be the exclusive provider of logic synthesis technology optimized for the highest quality of results, area and runtime for designers targeting Lattice Field Programmable Gate Arrays (FPGAs) and Complex Programmable Logic Devices (CPLDs). "The extension of our long-standing relationship with Synopsys gives our customers continued access to a complete, easy-to-use synthesis design flow to implement and validate the rigorous timing and area requirements of next-generation designs," said Choon-Hoe Yeoh, senior director, software quality and strategic partnership at Lattice Semiconductor. "Synopsys' Synplify Pro synthesis software is optimized for the advanced architectural features of Lattice's programmable logic devices, offering designers the customizable and flexible solutions they need to quickly innovate and develop differentiated products for a variety of consumer, communications, industrial, computing and automotive

Rescale is excited to announce a technology collaboration that provides Autodesk Moldflow software users the ability to run their simulations on the Rescale platform. Existing Autodesk Moldflow Insight software customers can access Rescale’s on-demand, high performance computing (HPC) platform in order to benefit from Rescale’s powerful and scalable hardware resources. Rescale provides a highly secure, enterprise solution that enables companies to seamlessly accelerate their simulations with access to customizable, on-demand HPC resources available directly through a web browser. Rescale is a multi-cloud environment with more than 30 data centers globally providing a wide range of hardware offerings, including an ITAR compliant environment and specialty hardware such as InfiniBand and GPUs. Autodesk is a leader in 3D design, engineering and entertainment software, and has developed a comprehensive portfolio of innovative simulation solutions to address the needs of their customers. Through this collaboration, Autodesk is providing an additional way for customers to

Roima has created a new Business Unit and broadened its services into Product Information and Lifecycle Management with the acquisition of Modultek, a Finnish market leader in the field. Modultek is headquartered in Pori, Southwestern Finland and has offices in Vantaa and Eindhoven, The Netherlands. Last year it had a turnover of 3,8 MEUR and employed 40 people. Roima has grown rapidly since 2014. After this merger the Company’s turnover has grown from 3 to 16 MEUR and from 35 employees to almost 150 in a little over two years. This merger was the next logical step in Roima’s and its majority stakeholder Korona Invest’s growth strategy. Roima is targeted to become a large international player capable of serving even the largest of companies in manufacturing and supply chain management. ”We will continue our planned growth”, assures Jukka Ropponen, CEO of Roima. The merger of Roima and Modultek means a wider range and increased

aPriori will be holding its third annual European product cost management conference on June 27-29 at the International Conference Center in Stuttgart, Germany.  The event kicks off on Monday evening, June 27, with a Welcome Reception.  On Tuesday, June 28 and Wednesday, June 29, leading PCM practitioners from the UK, the Nordics, Germany, Switzerland, Austria, France, Italy and Spain will be joining together with Subject Matter Experts from aPriori to discuss new strategies and tactics for improving product profitability. CIMdata’s Stan Przybylinski is amongst the featured speakers. Registration and more info available by clicking here. Search for aPriori on CIMdata.com Search for Stan Przybylinski on CIMdata.com