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Materialise NV is pleased to announce the newest version of the Materialise Mimics Innovation Suite. This flexible platform of 3D printing software and services enables engineers and researchers to achieve rapid, reliable image segmentation and accurate 3D reconstruction using validated software. Users can now segment medical images faster with new intuitive tools such as a live 3D Mask Preview. Robust algorithms in the finite element analysis mesh preparation workflow allow the user to obtain high-quality meshes with more ease, even in challenging cases. Segmenting anatomy from a CT or MRI scan is the most labor-intensive part in the process of creating a patient-specific device. That’s why the new version of the Materialise Mimics Innovation Suite will enable users to perform segmentations faster through a combination of smarter editing tools and a live 3D Preview. The Split Tool automatically splits two adjacent tissues by marking the two tissues in a few slices.

COMSOL, Inc. the leading provider of multiphysics modeling, simulation, and application design software, today announced the latest release of the COMSOL Multiphysics® and COMSOL Server™ simulation software environment. Hundreds of user-driven features and enhancements to COMSOL Multiphysics®, COMSOL Server™, and add-on products have been implemented with an emphasis on accuracy, usability, and productivity. From new solvers and methods, to application design and deployment tools, COMSOL® software version 5.2a expands the electrical, mechanical, fluid, and chemical design and optimization capabilities.  Thermoviscous acoustics simulation solved with the domain decomposition solver. Local acceleration, total acoustic pressure, and total thermo-viscous power dissipation density are shown. This COMSOL® model is used to design microphones and speakers used in consumer products, such as, smartphones, tablets, and laptops. It consists of 2.5 million degrees of freedom and required 14 GB of RAM to solve. Previsously 120 GB were needed using a direct solver. Powerful New Tools for

Mastercam 2017 brings a new suite of programming tools focused on delivering speed, automation, and efficiency for all machining jobs.  Mastercam 2017 introduces a more efficient workflow, improved usability, Dynamic Motion improvements, and so much more. Mastercam 2017 features a new ribbon interface and makes it easier to find the functions you need to complete your tasks. “Many of our more powerful tools were underused because customers did not know where to find them,” says CNC Software President, Meghan West. “We spent a lot of time with users determining the best way to simplify this, and the response has been overwhelmingly positive.” The ribbon tabs group similar functions and displays them in order from simple to more complex. Each tab relates to a type of activity, from creating wireframe geometry to generating toolpaths. Editing functions are on the same tab as creation functions so you have all the tools you

Mentor Graphics Corp. today announced that MagnaChip Semiconductor Corp., a Korea-based designer and manufacturer of analog and mixed-signal semiconductor products for high-volume consumer applications, has selected the Mentor® Analog FastSPICE™ (AFS™) Platform for circuit verification and device noise analysis of their analog and mixed-signal designs including display drivers, power management ICs, and PLLs. "We needed to reduce our long circuit simulation time and include device noise analysis in our analog and mixed-signal circuit verification flow," said Dr. Kihyun Kim, senior manager, Design Technology at MagnaChip. "We selected the AFS Platform because it demonstrated SPICE accurate results 2.5x-4x faster than our existing parallel SPICE simulator in multiple analog circuits." The AFS Platform provides the world’s fastest circuit verification for nanometer analog, RF, mixed-signal, memory, and custom digital circuits. Foundry certified by the world’s leading foundries and IDMs, the AFS Platform delivers nanometer SPICE accuracy 5x-10x faster than traditional SPICE and 2x-6x faster than

Visual 2000 International, end-to-end omni-channel business solutions provider for the apparel, footwear and accessories (AFA) industry, has announced its sponsorship of the Product Innovation (PI) Apparel Congress, scheduled to take place on June 27-28, 2016, in New York City.  PI Congress is a gathering of AFA professionals to discuss and promote innovation using modern technologies, such as 3D printing, virtual reality and sustainability.  “PI congress is a one-of-a-kind opportunity to discover and share new industry developments among other fashion-focused companies,” said VP of Research & Development Charles Benoualid. “As a supplier of apparel specific software, we are excited to showcase the new features in our own software suite and discover how companies are using PLM and other software suites to innovate their business processes.”  The scheduled talks at the event will address a broad range of topics that will touch upon all aspects of the apparel industry. A key area of

The Borlas consulting group and DATADVANCE – a developer of predictive modeling, intelligent data analysis and multidisciplinary optimization software in Russia, present the solution integrating pSeven, the software package for engineering analysis and optimization by DATADVANCE, and Teamcenter®, the product lifecycle management system developed by Siemens PLM Software. This joint solution allows to automate design procedures, analyze engineering data, and perform design optimization in the integrated pSeven and Teamcenter environment, including the capability to work with Teamcenter’s design parameters and methods. The new solution lowers the time and resource requirements in product data analysis and design optimization and also reduces the probability of errors that occur due to data loss during the development of new engineering workflows. Accessing design data does not require additional software, allowing customers to save on hardware and software resources. The primary goal of integrating pSeven with Teamcenter is to enable solving design optimization

Webinar will focus on the options available for unleashing product data to the enterprise. ANN ARBOR, Michigan, 24 June 2016—CIMdata, Inc., the leading global PLM strategic management consulting and research firm, announces that Gerard Litjens, Director of European Operations, will take part in a webinar to discuss ways to democratize product information so that it is provided to everyone who needs it, when they need it, and throughout the product lifecycle. In this webcast, “PLM for All: Unleashing Product Data to the Enterprise,” attendees will learn how leveraging product data across teams will drive better actions and decisions that can provide significant business value. The webinar, which is hosted by PTC, will take place on Thursday, 30 June, 2016 at 14:00 CEDT. To register, visit http://bit.ly/WebinarmitCIMdata

Centric Software is pleased to announce the availability of its brand new Field Testing mobile app in iOS. This new app works seamlessly with Centric’s PLM platform or, alternatively, can be used as a stand-alone solution. Centric’s Field Testing app is a new innovation and unique on the market. It is designed to help apparel, footwear and outdoor companies both track the usage and performance of prototypes and samples of clothing, footwear and hard goods. Early stage prototypes are particularly costly; at times thousands of dollars each to produce. Prototypes and samples are typically tested in the field, especially for performance wear; worn or used by sponsored athletes, internal teams or others. Humberto Roa, VP of Innovation at Centric Software explains, “Tracking the location and availability of prototypes and, ultimately wear tester performance feedback is critically important yet typically accomplished with a mishmash of methods. Centric’s new Field Testing app

Camtek Ltd. today announced the launch of an innovative inspection method for Fan-Out Wafer Level Packaging (FOWLP). This new inspection method compares the image acquisition of the dies on the reconstructed wafer with the computer-aided design (CAD) data used in fabricating the wafer. Ramy Langer, Vice President and Head of Camtek's Semiconductor Division, commented, "Camtek has more than 25 years of experience working with CAD data in our Automated Optical Inspection (AOI) systems for the PCB industry. The development of this new method for the inspection of Fan-Out applications is based on this experience and accumulated know-how." Continued Mr. Langer: "Industry experts expect Fan-out wafer level packaging technology to grow in excess of 30% annually over the coming years. The Fan-out packaging process imposes many inspection challenges, especially due to alignment issues. We believe that using the CAD as a reference for detecting the reconstructed wafers will make our Eagle

International TechneGroup Limited (ITI) will be exhibiting at the Farnborough International Airshow in the UK, 11-17 July. ITI will be on the Midlands Aerospace Alliance stand 1/B90 showcasing their engineering data interoperability solutions which significantly benefit the aerospace industry.  “Aerospace customers demand that their engineering and manufacturing technologies enable interoperability from design to sustainment,” commented Tom Gregory, CEO of ITI. “ITI is in a unique position to offer CAD migration, validation, and integration solutions that can be applied across the product lifecycle. No other company has the level of experience and focused approach to solving interoperability issues. Our team welcomes the opportunity to talk with customers at Farnborough about their unique and often demanding requirements.” Farnborough International takes place every two years and is the largest trade event for the global aerospace community. 1,500 diverse exhibitors from core sectors of the aerospace industry are scheduled to participate, with over 100,000